公开(公告)号：WO2008036423A2

公开(公告)日：2008-03-27

申请号：PCT/US2007020682

申请日：2007-09-24

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX ,  FLEMING ROBERT

Inventor： KOSOWSKY LEX ,  FLEMING ROBERT

IPC: H01L27/082

CPC classification number: H01L21/312 ,  B82Y30/00 ,  H01C7/12 ,  H01L21/3148 ,  H01L21/318 ,  Y10S438/90

Abstract: Formulations for voltage switchable dielectric materials include two or more different types of semiconductive materials uniformly dispersed within a dielectric matrix material. The semiconductive materials are selected to have different bandgap energies in order to provide the voltage switchable dielectric material with a stepped voltage response. The semiconductive materials can comprise inorganic particles, organic particles, or an organic material that is soluble in, or miscible with, the dielectric matrix material. Formulations optionally can also include electrically conductive materials. At least one of the conductive or semiconductive materials in a formulation can comprise particles characterized by an aspect ratio of at least 3 or greater.

Abstract translation: 可变压电介质材料的配方包括均匀分散在电介质基质材料中的两种或多种不同类型的半导体材料。 选择半导体材料具有不同的带隙能量，以便提供具有阶梯式电压响应的电压可切换介电材料。 半导体材料可以包括无机颗粒，有机颗粒或可溶于介质基质材料或与之混溶的有机材料。 制剂任选地还可以包括导电材料。 制剂中的导电或半导体材料中的至少一种可以包含由纵横比至少为3或更大的特征的颗粒。

公开(公告)号：WO2012088360A1

公开(公告)日：2012-06-28

申请号：PCT/US2011/066673

申请日：2011-12-21

Applicant: SHOCKING TECHNOLOGIES, INC. ,  FLEMING, Robert ,  SHANG, Shurui

Inventor： FLEMING, Robert ,  SHANG, Shurui

IPC: H05K3/00 ,  G06F17/50

CPC classification number: H05K1/0271 ,  H05K1/0259 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49124

Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

Abstract translation: 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。

公开(公告)号：WO2011059798A1

公开(公告)日：2011-05-19

申请号：PCT/US2010/054653

申请日：2010-10-29

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: C25D5/48

CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/07 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/0557 ,  H05K2203/1168 ,  H05K2203/1492

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

公开(公告)号：WO2011059771A1

公开(公告)日：2011-05-19

申请号：PCT/US2010/054569

申请日：2010-10-28

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: H05K1/09 ,  C25D5/00

CPC classification number: C25D5/02 ,  C25D5/18 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

公开(公告)号：WO2011059691A1

公开(公告)日：2011-05-19

申请号：PCT/US2010/054092

申请日：2010-10-26

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: C25D5/54 ,  H05K3/18 ,  H05K1/02

CPC classification number: C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/54 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

公开(公告)号：WO2010033635A1

公开(公告)日：2010-03-25

申请号：PCT/US2009/057209

申请日：2009-09-16

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01L27/02 ,  H01B1/22 ,  H01C7/105

CPC classification number: H01B1/20 ,  H01B3/002 ,  H01C7/105 ,  H05K1/0254 ,  H05K2201/0209 ,  H05K2201/0738

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises Boron. According to embodiments, VSD material is formulated that includes particle constituents that include one or more of Boron-nitride polymers, Boron nanotubes, and/or Boron nanoparticles.

Abstract translation: 包含硼的电压可切换电介质（VSD）材料的组成。 根据实施方案，配制VSD材料，其包括包括一种或多种硼氮化物聚合物，硼纳米管和/或硼纳米颗粒的颗粒组分。

公开(公告)号：WO2009120882A1

公开(公告)日：2009-10-01

申请号：PCT/US2009/038429

申请日：2009-03-26

Applicant: SHOCKING TECHNOLOGIES, INC. ,  FLEMING, Robert ,  KOSOWSKY, Lex ,  SHI, Ning ,  WU, Junjun

Inventor： FLEMING, Robert ,  KOSOWSKY, Lex ,  SHI, Ning ,  WU, Junjun

IPC: H01L27/02 ,  H01B1/20

CPC classification number: H01B1/22 ,  H01L23/60 ,  H01L27/0248 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

Abstract translation: 提供了包含聚合物粘合剂和一种或多种类型的颗粒成分的组合物。 至少一类颗粒成分包括单独具有不大于2eV的带隙的半导体颗粒。 作为VSD材料，组成是（i）不存在超过特征电压电平的电压的介质，和（ii）施加超过特征电压电平的所述电压导电。

公开(公告)号：WO2008153584A1

公开(公告)日：2008-12-18

申请号：PCT/US2007/079377

申请日：2007-09-25

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A substrate device is designed by identifying one or more criteria for handling of a transient electrical event on the substrate device. The one or more criteria may be based at least in part on an input provided from a designer. From the one or more criteria, one or more characteristics may be determined for integrating VSD material as a layer within or on at least a portion of the substrate device. The layer of VSD material may be positioned to protect one or more components of the substrate from the transient electrical condition.

Abstract translation: 通过识别用于处理衬底装置上的瞬态电事件的一个或多个标准来设计衬底装置。 该一个或多个标准可以至少部分地基于从设计者提供的输入。 根据一个或多个标准，可以确定一个或多个特性，用于将VSD材料整合为基底装置的至少一部分内或之上的层。 VSD材料层可以被定位以保护衬底的一个或多个部件免受瞬态电气条件的影响。

公开(公告)号：WO2007062170A8

公开(公告)日：2008-10-02

申请号：PCT/US2006045291

申请日：2006-11-22

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX

Inventor： KOSOWSKY LEX

IPC: H01L33/00

CPC classification number: G06K19/07345 ,  G06K19/07318 ,  G06K19/07735 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738

Abstract: A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

Abstract translation: 提供诸如RFID标签的无线通信设备，其是介电材料，除非施加超过材料特性电压电平的电压。 在存在这种电压的情况下，材料变得导电。 将这种材料整合到装置中可以是机械的和/或电的。

公开(公告)号：WO2013112826A1

公开(公告)日：2013-08-01

申请号：PCT/US2013/023133

申请日：2013-01-25

Applicant: SHOCKING TECHNOLOGIES, INC.

Inventor： FLEMING, Robert ,  KOSOWSKY, Lex ,  WU, Junjun

IPC: H01L27/04

CPC classification number: H01B1/18 ,  H01C7/1006 ,  H01L27/0288 ,  H05K1/0259 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0738

Abstract: Embodiments described herein provide for flexible circuits and flexible substrates comprising VSD material that has superior characteristics for its use as an integral structural component of a device.

Abstract translation: 本文描述的实施例提供了柔性电路和包括VSD材料的柔性基板，其具有优异的特性以用作其作为装置的整体结构部件。