열박리형 양면 점착시트
    41.
    发明公开
    열박리형 양면 점착시트 有权
    热可释放的双面粘合片

    公开(公告)号:KR1020130010772A

    公开(公告)日:2013-01-29

    申请号:KR1020110071626

    申请日:2011-07-19

    Abstract: PURPOSE: A thermally releasable double-sided adhesive is provided to be easily released from a wide adhesive surface while maintaining high adhesive by uniformly coating with a thermal blowing agent. CONSTITUTION: A thermally releasable double-sided adhesive comprises a base(3), an adhesive layer(2) spread on one side of the base; a thermal blowing agent coating layer(4) and an adhesive layer(5) spread on the other side in order. The thermal blowing agent coating layer is formed of a coating liquid in which a rein binder and a thermal blowing agent are dispersed. The resin binder is a copolymer that acrylpolyol is crosslinked by polyisocyanate. The hydroxy group value of the acrylpolyol is 25-500 and the equivalent ratio of the isocyanate in the polyisocyanate to a hydroxyl group in the acrylpolyol is 1-3.

    Abstract translation: 目的:提供一种可热释放的双面粘合剂,以便通过用热发泡剂均匀涂布来保持高粘合剂,从宽的粘合剂表面容易地释放。 构成:可热脱模的双面粘合剂包括基底(3),在基底的一侧上铺展的粘合剂层(2) 热发泡剂涂层(4)和粘合层(5)依次分布在另一侧。 热发泡剂涂层由分散有粘合剂和热发泡剂的涂布液形成。 树脂粘合剂是通过多异氰酸酯将丙烯酸多元醇交联的共聚物。 丙烯酸多元醇的羟基值为25-500,多异氰酸酯中的异氰酸酯与丙烯酸多元醇中的羟基的当量比为1-3。

    성형성이 우수한 인몰드 장식용 폴리에스테르 필름
    42.
    发明公开
    성형성이 우수한 인몰드 장식용 폴리에스테르 필름 有权
    优质成型模具装饰聚酯薄膜及其制造方法

    公开(公告)号:KR1020130009230A

    公开(公告)日:2013-01-23

    申请号:KR1020110070177

    申请日:2011-07-15

    Abstract: PURPOSE: A polyester film for in-mold decoration with excellent formability and a manufacturing method thereof are provided to reduce the fault formation ratio of an edge part of a mold product in an in-mold formation process by making a balance of strength and elongation in a film random direction, thereby securing excellent in-mold formability. CONSTITUTION: A polyester film for in-mold decoration comprises a polyester film of a base film, an antistatic layer, and an adhesion-improving layer. The antistatic layer is coated on one side of the polyester film. The adhesion-improving layer is coated on the other side of the polyester film. The polyester film is uniaxially stretched with the elongation ratio of 3.0 - 4.5 in a film driving direction. The polyester film is biaxially stretched with the elongation ratio of 3.5 - 5.0 in the perpendicular direction of the film driving direction.

    Abstract translation: 目的:提供一种成型性优良的模内装饰用聚酯膜及其制造方法,通过使模具成形工序中的模具产品的边缘部分的强度和伸长率的平衡来减小模具制品的边缘部分的断层形成率 膜随机方向,从而确保了优良的模内成形性。 构成:用于模内装饰的聚酯膜包括基膜的聚酯膜,抗静电层和粘合改进层。 抗静电层涂覆在聚酯薄膜的一面上。 粘合改善层涂覆在聚酯膜的另一面上。 聚酯膜在膜驱动方向上以3.0-4.5的伸长率单轴拉伸。 聚酯膜在膜驱动方向的垂直方向上以3.5-5.0的伸长比进行双轴拉伸。

    방열특성이 우수한 태양전지 백시트 및 그 제조방법
    43.
    发明公开
    방열특성이 우수한 태양전지 백시트 및 그 제조방법 有权
    一种具有优良热释放性能的太阳能电池的背板及其制备方法

    公开(公告)号:KR1020130006835A

    公开(公告)日:2013-01-18

    申请号:KR1020110061601

    申请日:2011-06-24

    CPC classification number: Y02E10/50 H01L31/052 H01L31/049

    Abstract: PURPOSE: A solar cell back sheet with an improved heat radiation property and a manufacturing method thereof are provided to improve a heat radiation property by using an adhesive including a heating filler. CONSTITUTION: A solar cell(12) is formed on a front glass(11). The solar cell includes an ethylene-vinyl acetate copolymer layer(13). A back sheet layer(14) is formed on the solar cell. The back sheet layer includes a polyethylene layer(15), an adhesive layer(16), and a polyethylene terephthalate layer(17). The adhesive layer includes a heating filler(18) inside.

    Abstract translation: 目的:提供一种具有改善的散热性能的太阳能电池背板及其制造方法,以通过使用包括加热填料的粘合剂来改善散热性能。 构成:在前玻璃(11)上形成太阳能电池(12)。 太阳能电池包括乙烯 - 乙酸乙烯酯共聚物层(13)。 在太阳能电池上形成背板层(14)。 背板层包括聚乙烯层(15),粘合剂层(16)和聚对苯二甲酸乙二醇酯层(17)。 粘合剂层包括内部的加热填料(18)。

    에폭시 말단기를 가지는 폴리알킬페닐렌옥사이드 수지를 함유한 접착제 조성물, 그를 이용한 반도체 패키지용 리드락 테이프 및 그의 제조방법
    44.
    发明授权
    에폭시 말단기를 가지는 폴리알킬페닐렌옥사이드 수지를 함유한 접착제 조성물, 그를 이용한 반도체 패키지용 리드락 테이프 및 그의 제조방법 有权
    含有环氧封端的聚(亚烷基苯氧基)S的粘合组合物和使用其的半导体封装的粘合引线锁带

    公开(公告)号:KR101208611B1

    公开(公告)日:2012-12-06

    申请号:KR1020110089043

    申请日:2011-09-02

    Abstract: PURPOSE: An adhesive composition is provided to improve compatibility with an epoxy resin, to increase the glass transition temperature(Tg) of the composition after hardening, and to able to decrease a dielectric constant and dielectric loss by introducing a polyphenylene oxide resin with low dielectric constant and dielectric loss. CONSTITUTION: An adhesive composition comprises 100.0 parts by weight of a polyalkylphenylene oxide resin which has an epoxy-terminated group indicated in chemical formula 1, 50-150 parts by weight of an epoxy resin, 20-250 parts by weight of a hardener, 20-300 parts by weight of a modifier which consists of a thermoplastic resin, and 0.1-10 parts by weight of a hardening accelerator. In chemical formula 1, R1 and R2 is hydrogen or a C1-C3 alkyl group and can be the same or different to each other, m is 4-80, and n is 4-80.

    Abstract translation: 目的:提供粘合剂组合物以改善与环氧树脂的相容性,以增加硬化后组合物的玻璃化转变温度(Tg),并且通过引入具有低电介质的聚苯醚树脂能够降低介电常数和介电损耗 恒定和介电损耗。 构成:粘合剂组合物包含100.0重量份的具有化学式1表示的环氧基封端基团的聚烷基苯醚树脂,50-150重量份环氧树脂,20-250重量份硬化剂,20 -300重量份由热塑性树脂组成的改性剂和0.1-10重量份的硬化促进剂。 在化学式1中,R 1和R 2是氢或C 1 -C 3烷基,可以相同或不同,m为4-80,n为4-80。

    반도체 공정용 점착테이프 및 이를 이용한 반도체 장치의 제조방법
    45.
    发明授权
    반도체 공정용 점착테이프 및 이를 이용한 반도체 장치의 제조방법 失效
    用于半导体工艺的粘合带及其制造方法

    公开(公告)号:KR101208082B1

    公开(公告)日:2012-12-05

    申请号:KR1020110077081

    申请日:2011-08-02

    Abstract: PURPOSE: An adhesive tape for a semiconductor process and a manufacturing method thereof are provided to efficiently prevent leakage of a resin by increasing adhesion of the tape with a lead frame side in a pre-curing process. CONSTITUTION: An adhesive layer(1) is coated on at least one side of a base material. The adhesive layer is an adhesive tape for a semiconductor process which is coated with an adhesive composition. The adhesive composition comprises 0.01-10 parts by weight of a curing agent and 60-100 parts by weight of an additive based on 100 parts by weight of a rubber system resin which contains a carboxyl group. Adhesion of the adhesive layer is 5-30 gf/in at room temperature. The adhesion of the adhesive layer after a pre-curing process is 4-10 times greater than the adhesion at room temperature.

    Abstract translation: 目的:提供一种用于半导体工艺的胶带及其制造方法,以通过在预固化工艺中增加带与引线框架侧的粘合力来有效防止树脂的泄漏。 构成:将粘合剂层(1)涂覆在基材的至少一面上。 粘合剂层是用粘合剂组合物涂布的用于半导体工艺的胶带。 粘合剂组合物包含0.01-10重量份的固化剂和60-100重量份的基于100重量份含有羧基的橡胶系树脂的添加剂。 粘合层的粘合力在室温下为5-30gf / in。 在预固化过程之后粘合剂层的粘合力是在室温下的粘附力的4-10倍。

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