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公开(公告)号：KR1020140001671A
公开(公告)日：2014-01-07
申请号：KR1020120070049
申请日：2012-06-28
Applicant: 삼성전기주식회사
IPC: H01F1/24 , H01F27/255 , B22F3/00
CPC classification number: H01F27/255 , F27D7/06 , H01F1/01 , H01F1/26 , H01F27/2804 , H01F27/292 , H01F41/046 , H01F41/14 , H01F41/16 , H01F2017/048 , Y10T29/4902
Abstract: The present invention relates to a metal-polymer complex film for an inductor and a method for manufacturing an inductor. An inductor is manufactured by using a film-shaped metal-polymer complex film which is produced from a mixture including metal powder, amorphous epoxy resins, and 75-98 weight% of metal powder. Thereby, production efficiency can be enhanced by enabling the simultaneous manufacture of multiple inductors, and the characteristic values of the inductor can be improved. [Reference numerals] (S110) Stack a metal-polymer complex film on a coil layer; (S120) Compressing/hardening; (S130) Dicing; (S140) Form an external electrode; (S150) Plating
Abstract translation: 本发明涉及一种用于电感器的金属 - 聚合物复合膜和一种用于制造电感器的方法。 通过使用由包括金属粉末，无定形环氧树脂和75-98重量％的金属粉末的混合物制成的膜状金属 - 聚合物复合膜来制造电感器。 由此，可以通过同时制造多个电感器来提高生产效率，并且可以提高电感器的特性值。 （S110）在线圈层上堆叠金属 - 聚合物复合膜; （S120）压缩/硬化; （S130）切片; （S140）形成外部电极; （S150）电镀
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公开(公告)号：KR1020130134639A
公开(公告)日：2013-12-10
申请号：KR1020120058289
申请日：2012-05-31
Applicant: 삼성전기주식회사
CPC classification number: H01L28/10 , H01F27/24 , H01F27/255 , H01F27/2804 , H01F27/292
Abstract: The present invention relates to a chip inductor. The chip inductor according to the present invention includes: a substrate on which a through hole is formed; a conductive coil which is formed on the substrate; a top resin composite magnetic layer which is filled to surround the conductive coil for forming a core on the center of the substrate; a bottom resin composite magnetic layer which is formed on the lower side of the substrate; and an external electrode which is formed on both sides of the top and bottom resin composite magnetic layers.
Abstract translation: 本发明涉及片式电感器。 根据本发明的芯片电感器包括：形成有通孔的基板; 形成在基板上的导电线圈; 顶部树脂复合磁性层被填充以围绕用于在基板的中心形成芯的导电线圈; 形成在基板的下侧的底部树脂复合磁性层; 以及形成在顶部和底部树脂复合磁性层两侧的外部电极。
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43.发明公开
公开(公告)号：KR1020130001981A
公开(公告)日：2013-01-07
申请号：KR1020110062942
申请日：2011-06-28
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4676 , H01B3/40 , H05K1/0373 , H05K3/38 , H05K2201/0209 , H05K2203/0773
Abstract: PURPOSE: A dielectric composition is provided to obtain high adhesion with a plating layer without using fluoride-based solution in an etching step of a dielectric layer. CONSTITUTION: A dielectric composition includes 10-60 parts by weight of two kinds of inorganic fillers based on 100 parts by weight of an epoxy resin. The inorganic fillers are SiO2 and CaCO3. One inorganic filler of the inorganic fillers is used with an amount of 20 weight% or less. A multilayered printed circuit board comprises an insulating layer which is manufactured of the dielectric composition. A manufacturing method of the multilayered printed circuit board comprises the following steps: a step of forming an insulating layer on a printed circuit board, and a step of etching the dielectric layer. [Reference numerals] (AA) Etching; (BB) Plating; (CC) Exfoliation
Abstract translation: 目的：提供电介质组合物以在电介质层的蚀刻步骤中不使用氟化物基溶液来获得与镀层的高粘附性。 构成：基于100重量份的环氧树脂，电介质组合物包含10-60重量份的两种无机填料。 无机填料是SiO 2和CaCO 3。 使用无机填料的一种无机填料，其量为20重量％以下。 多层印刷电路板包括由电介质组合物制成的绝缘层。 多层印刷电路板的制造方法包括以下步骤：在印刷电路板上形成绝缘层的步骤和蚀刻介电层的步骤。 （附图标记）（AA）蚀刻; （BB）电镀; （CC）去角质
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公开(公告)号：KR101175892B1
公开(公告)日：2012-08-23
申请号：KR1020110012777
申请日：2011-02-14
Applicant: 삼성전기주식회사
CPC classification number: B05D1/36 , H01B19/04 , H05K3/4673 , H05K2203/0156 , Y10T428/24355 , Y10T428/31797 , Y10T428/31913
Abstract: PURPOSE: An insulation film structure body and a manufacturing method thereof are provided to reduce the material costs or waste processing costs after a stripping process. CONSTITUTION: An insulation film structure body includes an insulation film layer(10) and a carrier film layer(20). The carrier film layer includes a releasing layer(21) contacting the insulation film layer, and a surface process layer(22). The releasing force of the releasing layer is 30-1,000gf. The surface process layer is processed to control the illumination, and has the lamination force of 34-40 dyne.
Abstract translation: 目的：提供一种绝缘膜结构体及其制造方法，以减少剥离过程后的材料成本或废物处理成本。 构成：绝缘膜结构体包括绝缘膜层（10）和载体膜层（20）。 载体膜层包括与绝缘膜层接触的释放层（21）和表面处理层（22）。 释放层的释放力为30-1,000gf。 处理表面处理层以控制照明，并具有34-40达因的层压力。
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公开(公告)号：KR1020110116505A
公开(公告)日：2011-10-26
申请号：KR1020100035957
申请日：2010-04-19
Applicant: 삼성전기주식회사
Abstract: 본 발명은 기판 이송 장치에 관한 것으로, 본 발명의 실시예에 따른 기판 이송 장치는 기판의 양측 가장자리를 지지하며, 기판의 이송 방향을 따라 배치된 진공홀들을 갖는 이송 가이드, 기판의 양측 가장자리에 접촉되도록 이송 가이드에 이동가능하게 구비되는 이송 벨트, 이송 벨트에 놓여진 기판이 이송 방향을 따라 이동되도록, 이송 벨트를 구동시키는 구동부재, 그리고 진공홀들로 진공압을 제공하는 진공압 제공부재를 포함하되, 이송 벨트는 기판이 놓여지는 로딩부 및 로딩부에 한정되어 형성되며 진공홀들에 상응하는 관통홀들을 갖는다.
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Patent Agency Ranking
公开(公告)号：KR1020110075526A
公开(公告)日：2011-07-06
申请号：KR1020090131999
申请日：2009-12-28
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A method for preparing insulating film for a multi-layer printed circuit is provided to shorten the total hardening time, to realize micro circuits due to low surface roughness compared with a conventional method and to secure long-term reliability. CONSTITUTION: A method for preparing insulating film for a multi-layer printed circuit comprises the steps of: forming a resin including epoxy in an insulating film; laminating the insulating film on the multi-layer printed circuit; and curing the insulating film with an infrared ray heater. The curing step is operated for 6 minutes - 2 hours. The insulating film further includes inorganic filler and curing accelerator. The curing accelerator is an imidazole-based compound.
Abstract translation: 目的：提供一种用于制备多层印刷电路的绝缘膜的方法，以缩短总硬化时间，与常规方法相比，由于低表面粗糙度而实现微电路并确保长期可靠性。 构成：一种制备多层印刷电路用绝缘膜的方法，包括以下步骤：在绝缘膜中形成包含环氧树脂的树脂; 在多层印刷电路上层叠绝缘膜; 并用红外线加热器固化绝缘膜。 固化步骤操作6分钟-2小时。 绝缘膜还包括无机填料和固化促进剂。 固化促进剂是咪唑类化合物。
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公开(公告)号：KR1020100111044A
公开(公告)日：2010-10-14
申请号：KR1020090029414
申请日：2009-04-06
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A package substrate and a method of manufacturing the same are provided to improve heat dissipation efficiency by including a boron nitride of a plate shape. CONSTITUTION: A circuit layer is respectively arranged in both sides of an insulating layer. The insulating layer(110) comprises a thermal conductive insulator and a binder resin. The thermal conductive insulator and the binder resin includes inorganic material powder and a boron nitride covering the outside of the inorganic material powder. A penetration hole(130) passes through the insulating layer. The insulating layer comprises the boron nitride of a plate shape. A solder resist(140) is arranged on the circuit layer.
Abstract translation: 目的：提供封装基板及其制造方法，以通过包括板状氮化硼来提高散热效率。 构成：电路层分别布置在绝缘层的两侧。 绝缘层（110）包括导热绝缘体和粘合剂树脂。 导热绝缘体和粘合剂树脂包括无机材料粉末和覆盖无机材料粉末外部的氮化硼。 穿透孔（130）穿过绝缘层。 绝缘层包括板状的氮化硼。 阻焊剂（140）布置在电路层上。
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公开(公告)号：KR100423399B1
公开(公告)日：2004-03-18
申请号：KR1020010068603
申请日：2001-11-05
Applicant: 삼성전기주식회사
IPC: H03H7/01
CPC classification number: H01G4/35 , H01F17/0013 , H01F2017/0026 , H01L27/08 , H03H7/0115
Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.
Abstract translation: 这里公开了一种阵列型降噪滤波器。 阵列型降噪滤波器具有多个水平排列在单个芯片内的降噪滤波器。 多个降噪滤波器各自具有电感部分，接地部分和电容部分。 电感部分由芯片中近似垂直连接的第一和第二线圈组成。 接地部分布置在电感部分之上或之下。 电容部分布置在接地部分之上或之下。 任何电感部分的第二线圈被构造成以与另一相邻电感部分的第二线圈相反的方向缠绕。
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公开(公告)号：KR1020170131069A
公开(公告)日：2017-11-29
申请号：KR1020160062235
申请日：2016-05-20
Applicant: 삼성전기주식회사
Abstract: 본발명은유전특성을가지는파티클과수지를포함하는복합층을사이에두고복수의내부전극이적층되는적층구조를포함하는복합바디, 상기복합바디내의복수의내부전극과전기적으로연결되는외부전극을포함하고, 상기유전특성을가지는파티클은인접하는파티클과는구별되는입계를가지는적층전자부품과그 제조방법에관한것이다.
Abstract translation: 本发明涉及一种复合体，其包括层叠结构，其中多个内部电极与包括夹在其间的具有介电特性的颗粒的复合层堆叠，并且外部电极电连接到复合体中的多个内部电极 并且具有介电特性的颗粒具有与相邻颗粒不同的颗粒边界，以及用于制造该颗粒的方法。
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