公开(公告)号：KR1020110080864A

公开(公告)日：2011-07-13

申请号：KR1020100001284

申请日：2010-01-07

Applicant: 삼성전기주식회사

Inventor： 이재준 ,  안진용 ,  조석현 ,  김기환 ,  이석규

IPC: H05K3/46

CPC classification number: H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

Abstract: PURPOSE: A carrier for manufacturing a printed circuit board and a manufacturing method thereof and a method for manufacturing a printed circuit board using the same are provided to reduce process cost and process time, by simplifying the structure of the carrier without using vacuum method or hetero-layer insertion method between the carrier and the printed circuit board. CONSTITUTION: A first carrier(100a) includes a first bonding means(102) and a first metal layer(101). The first metal layer is formed in a first open aperture of the first bonding means. A second carrier(100b) includes a second bonding means(104) and a second metal layer(103). The second carrier is combined to the first carrier. The second metal layer is formed in a second open aperture of the second bonding means. The second metal layer is partially overlapped with the first metal layer.

Abstract translation: 目的：提供一种用于制造印刷电路板的载体及其制造方法以及使用其的印刷电路板的制造方法，以通过简化载体的结构而不使用真空法或杂质来降低加工成本和加工时间 载体和印刷电路板之间的层插入方法。 构成：第一载体（100a）包括第一接合装置（102）和第一金属层（101）。 第一金属层形成在第一接合装置的第一开口中。 第二载体（100b）包括第二接合装置（104）和第二金属层（103）。 第二载体与第一载体组合。 第二金属层形成在第二接合装置的第二开口中。 第二金属层与第一金属层部分重叠。

公开(公告)号：KR1020110067449A

公开(公告)日：2011-06-22

申请号：KR1020090124053

申请日：2009-12-14

Applicant: 삼성전기주식회사

Inventor： 조석현 ,  안진용 ,  전동주 ,  김병문

IPC: H05K3/46

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce build-up time by inserting a first substrate with a protrusion into a second substrate with a receiving groove for manufacturing a multilayered printed circuit board. CONSTITUTION: A first substrate(110a) includes a first via exposing a first protrusion(118a). A first buildup layer(122) and a first solder resist layer(130) are formed on one side of a first insulation layer(114). A second substrate(150a) has a receiving groove(158a') which receives the first protrusion. The second substrate includes a second via which includes a second protrusion(158a') exposed to the outside. The receiving groove has a shape corresponding to the first protrusion.

Abstract translation: 目的：提供印刷电路板及其制造方法，以通过将具有突起的第一基板插入具有用于制造多层印刷电路板的接收槽的第二基板中来减少积聚时间。 构成：第一衬底（110a）包括暴露第一突起（118a）的第一通孔。 在第一绝缘层（114）的一侧上形成第一累积层（122）和第一阻焊层（130）。 第二基板（150a）具有容纳第一突出部的接收槽（158a'）。 第二基板包括第二通孔，其包括暴露于外部的第二突起（158a'）。 接收槽具有与第一突起对应的形状。

公开(公告)号：KR1020110062037A

公开(公告)日：2011-06-10

申请号：KR1020090118611

申请日：2009-12-02

Applicant: 삼성전기주식회사

Inventor： 전동주 ,  안진용 ,  이재준 ,  조석현 ,  김기환 ,  김병문

IPC: H05K3/46 ,  H05K3/06

Abstract: PURPOSE: A method for manufacturing a printed circuit board is provided to save processing costs. CONSTITUTION: A metal layer is formed on the first protection layer of a photo curable first protecting layer. The first protection layer is selectively cured. The first protection layer is coupled with a carrier. A metal layer is patterned on the first protection layer to form a first circuit layer(102b). A buildup layer(106) is formed on the first protection layer. A second protection layer(107) is formed on the buildup layer. A carrier is divided so that a first open unit is formed.

Abstract translation: 目的：提供印刷电路板的制造方法，以节省加工成本。 构成：在可光固化的第一保护层的第一保护层上形成金属层。 选择性地固化第一保护层。 第一保护层与载体耦合。 在第一保护层上图案化金属层以形成第一电路层（102b）。 在第一保护层上形成积聚层（106）。 在积层上形成第二保护层（107）。 分离载体以形成第一开放单元。

公开(公告)号：KR1020110051005A

公开(公告)日：2011-05-17

申请号：KR1020090107647

申请日：2009-11-09

Applicant: 삼성전기주식회사

Inventor： 정순오 ,  안진용 ,  조석현 ,  김병문 ,  이재준

IPC: H05K3/46

Abstract: PURPOSE: A printed circuit board and a method for manufacturing the same provided to reduce a bending property by increasing rigidity using an enforced metal layer. CONSTITUTION: Protective layers(101,106) are formed on both sides of a build up layer(104) of a printed circuit board(100). An enforcement metal layer(102b) is formed on the build up circuit layer(102) of the build up layer. The build up layer is composed of the build up circuit layer and a build up insulating layer(103). The protective layers protects the outermost layer of build up layers.

Abstract translation: 目的：一种印刷电路板及其制造方法，其通过使用强化金属层增加刚性来降低弯曲性能。 构成：在印刷电路板（100）的堆积层（104）的两侧上形成保护层（101,106）。 在构建层的积层电路层（102）上形成强制金属层（102b）。 积层由积聚电路层和积层绝缘层（103）组成。 保护层保护层的最外层。

公开(公告)号：KR1020110036394A

公开(公告)日：2011-04-07

申请号：KR1020090094035

申请日：2009-10-01

Applicant: 삼성전기주식회사

Inventor： 김병문 ,  조석현

IPC: H05K1/11 ,  H05K3/46

Abstract: PURPOSE: A printed circuit board and a method of manufacturing the same are provided to prevent the signal interference between circuits. CONSTITUTION: In a printed circuit board and a method of manufacturing the same, a first circuit layer and a pad are formed on the top of an insulating layer(100) and are extended from the pad, and they have a bump on the bottom of the insulating layer. A cavity(200) is formed on the insulating layer by attaching the bump of one insulating layer to the pad of the other insulating layer.

Abstract translation: 目的：提供一种印刷电路板及其制造方法，以防止电路之间的信号干扰。 构成：在印刷电路板及其制造方法中，在绝缘层（100）的顶部形成第一电路层和焊盘，并从焊盘延伸，并且在底部具有凸起 绝缘层。 通过将一个绝缘层的凸块连接到另一个绝缘层的焊盘，在绝缘层上形成空腔（200）。

公开(公告)号：KR1020110029792A

公开(公告)日：2011-03-23

申请号：KR1020090087617

申请日：2009-09-16

Applicant: 삼성전기주식회사

Inventor： 조석현 ,  안진용 ,  전동주 ,  김병문

IPC: H05K3/00

Abstract: PURPOSE: A method for manufacturing a printed circuit board is provided to minimize time and costs for forming a reinforcement material of the printed circuit board by forming a reinforcement material in a base substrate preparing process at once. CONSTITUTION: A base substrate which is divided into a plurality of unit substrate regions is provided(S110). A solder resist is laminated on the base substrate(S115). An reinforcement material is laminated on the solder resist(S120). The reinforcement material is combined with the base substrate by hardening the solder resist(S125). The reinforcement material laminated on the base substrate is processed with a necessary shape according to each substrate(S130). A pad is exposed by processing the solder resist which is used for the reinforcement material combination(S135). A plurality of unit substrates are separated by cutting the base substrate and the reinforcement material combined with the base substrate(S140).

Abstract translation: 目的：提供一种制造印刷电路板的方法，以通过在基底制备工艺中立即形成增强材料来最小化形成印刷电路板的增强材料的时间和成本。 构成：设置分割为多个单位基板区域的基底基板（S110）。 在基底基板上层叠阻焊剂（S115）。 在阻焊剂上层压增强材料（S120）。 通过硬化阻焊剂，加强材料与基底基板结合（S125）。 层压在基底基板上的增强材料根据各基板以必要的形状进行加工（S130）。 通过处理用于增强材料组合的阻焊剂来暴露焊盘（S135）。 通过切割基底基板和与基底基板结合的加强材料来分离多个单元基板（S140）。

公开(公告)号：KR101019155B1

公开(公告)日：2011-03-04

申请号：KR1020080122099

申请日：2008-12-03

Applicant: 삼성전기주식회사

Inventor： 조석현 ,  홍명호 ,  안진용

IPC: H05K3/18

Abstract: 기판 제조방법이 개시된다. 회로패턴이 형성되는 기판을 제조하는 방법으로서, 일면에 시드층이 형성되는 절연층을 제공하는 단계, 절연층의 타면을 기판의 일면에 열압착하는 단계, 시드층과 절연층 간의 결합력이 확보되도록 절연층을 경화시키는 단계, 전해도금을 수행하여 시드층에 회로패턴을 형성하는 단계를 포함하는 기판 제조방법은, 절연층과 결합력이 확보된 미세회로패턴을 형성할 수 있다.
기판, 시드층, 캐리어, 절연층

公开(公告)号：KR1020110012332A

公开(公告)日：2011-02-09

申请号：KR1020090070016

申请日：2009-07-30

Applicant: 삼성전기주식회사

Inventor： 조석현 ,  류창섭 ,  전동주 ,  김병문 ,  김경식 ,  안진용

IPC: H05K1/02

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase the strength of a printed circuit board without using additional metal core by attaching the reinforcing sheet having high glass transition temperature to a printed circuit board. CONSTITUTION: A circuit layer(114) is formed on an insulating layer(112) of a base substrate. An reinforcing insulating sheet(130) is attached to the base substrate by an adhesion insulating layer(120). The reinforcing insulating sheet protects the circuit layer from the external environment. The reinforcing insulation sheet is made of the material having the glass transition temperature being higher than that of the insulation layer and the adhesion insulating layer.

Abstract translation: 目的：提供一种印刷电路板及其制造方法，以通过将具有高玻璃化转变温度的增强片连接到印刷电路板而不使用附加金属芯来增加印刷电路板的强度。 构成：电路层（114）形成在基底基板的绝缘层（112）上。 通过粘合绝缘层（120）将加强绝缘片（130）附着到基底基板上。 加强绝缘片保护电路层免受外部环境的影响。 加强绝缘片由玻璃化转变温度高于绝缘层和粘合绝缘层的材料制成。

公开(公告)号：KR1020110003987A

公开(公告)日：2011-01-13

申请号：KR1020090061553

申请日：2009-07-07

Applicant: 삼성전기주식회사

Inventor： 안진용 ,  조석현 ,  조지홍

IPC: H05K3/46

CPC classification number: H05K3/4658 ,  H05K1/113 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/0352 ,  H05K2201/096 ,  Y10T29/49128

Abstract: PURPOSE: A printed circuit board and a method of manufacturing the same are provided to implement a micro-circuit by forming an outermost layer through an imprint method. CONSTITUTION: A base circuit layer is buried in the bottom of a buildup insulating layer(110). A first circuit layer(130) is formed on the top of the buildup insulating layer. A first circuit layer comprises a first VIA(300) An upper insulating layer layer(200) is laminated on the top of the build-up layer(100). A second circuit layer(210) is buried in the top insulating layer and includes a connection pad(220).

Abstract translation: 目的：提供一种印刷电路板及其制造方法，以通过压印方法形成最外层来实现微电路。 构成：将基极电路层埋在积层绝缘层（110）的底部。 第一电路层（130）形成在积层绝缘层的顶部。 第一电路层包括第一VIA（300）层叠在积层（100）的顶部上的上绝缘层层（200）。 第二电路层（210）被埋在顶部绝缘层中并且包括连接焊盘（220）。

公开(公告)号：KR1020100102893A

公开(公告)日：2010-09-27

申请号：KR1020090021186

申请日：2009-03-12

Applicant: 삼성전기주식회사

Inventor： 조석현 ,  유제광 ,  조승현 ,  류창섭

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2924/00014

Abstract: PURPOSE: A light-emitting diode package and manufacturing method thereof. The generation of heat characteristic can be improved. CONSTITUTION: A light-emitting diode package and manufacturing method thereof. The first conductor layer(130), second conductor layer(140), and light emitting diode(150) is included. The first conductor layer is formed in the single-side of the insulating layer. And cavity is formed. The second conductor layer is divided by the first circuit part electrically insulated with the first radiating unit and the first radiating unit covering up cavity. The light emitting diode is accepted to cavity. And it is wire-bonded with the first circuit part.

Abstract translation: 目的：一种发光二极管封装及其制造方法。 可以提高热特性的产生。 构成：发光二极管封装及其制造方法。 包括第一导体层（130），第二导体层（140）和发光二极管（150）。 第一导体层形成在绝缘层的单面中。 并形成腔体。 第二导体层由与第一辐射单元和第一辐射单元覆盖腔电绝缘的第一电路部分分开。 发光二极管被接受到腔。 并与第一电路部分进行导线接合。