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公开(公告)号：KR101278339B1
公开(公告)日：2013-06-25
申请号：KR1020100111712
申请日：2010-11-10
Applicant: 삼성전기주식회사
IPC: H01L21/60
Abstract: 본 발명에 따른 코이닝 장치는 인쇄회로기판의 일면에 형성된 범프를 가압하는 가압블럭과 상기 가압블럭 외측에 형성되고 상기 인쇄회로기판의 범프가 형성된 이외의 영역을 가압하도록 가압방향으로 돌출되어 형성된 돌출부를 포함하는 제1 지그, 상기 인쇄회로기판의 타면에 형성된 패드솔더와 대응되도록 탄성부재가 형성된 제2 지그를 포함한다. 본 발명에 따르면, FC-BGA패키지에서 인쇄회로기판의 일면에 형성된 범프를 코이닝하는 과정에서 인쇄회로기판 타면에 형성된 패드솔더를 손상을 방지하는 효과가 있다.
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公开(公告)号：KR1020130001015A
公开(公告)日：2013-01-03
申请号：KR1020110061871
申请日：2011-06-24
Applicant: 삼성전기주식회사
CPC classification number: H05K3/0097 , H05K3/4682 , H05K2203/308 , Y10T29/49124
Abstract: PURPOSE: A method of manufacturing coreless substrate is provided to form an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening, thereby simplifying the process for forming the opening and saving a cost. CONSTITUTION: A dry film(122) for forming an opening is patterned onto one surface of a carrier(110). A first protection layer(130) is formed in the carrier patterned with the dry film. A circuit layer(140) including a pad(142) is formed on the first protection layer. A build-up layer(150) is formed on the first protection layer with the circuit layer. The carrier is separated from the first protection layer. The pad is exposed by removing the dry film for forming the opening from the first protection layer. Only the dry film for forming the opening is removed to expose the pad.
Abstract translation: 目的：提供一种制造无芯基板的方法，以通过在载体的一个表面上形成开口的干膜图案化形成开口，将载体与基板分离，仅除去用于形成开口的干膜，从而简化 形成开放的过程并节约成本。 构成：用于形成开口的干膜（122）被图案化在载体（110）的一个表面上。 在用干膜图案化的载体中形成第一保护层（130）。 在第一保护层上形成包括焊盘（142）的电路层（140）。 在第一保护层上形成有电路层的堆积层（150）。 载体与第一保护层分离。 通过从第一保护层去除用于形成开口的干膜来暴露垫。 只有用于形成开口的干膜被去除以露出垫。
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公开(公告)号：KR1020110051005A
公开(公告)日：2011-05-17
申请号：KR1020090107647
申请日：2009-11-09
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: PURPOSE: A printed circuit board and a method for manufacturing the same provided to reduce a bending property by increasing rigidity using an enforced metal layer. CONSTITUTION: Protective layers(101,106) are formed on both sides of a build up layer(104) of a printed circuit board(100). An enforcement metal layer(102b) is formed on the build up circuit layer(102) of the build up layer. The build up layer is composed of the build up circuit layer and a build up insulating layer(103). The protective layers protects the outermost layer of build up layers.
Abstract translation: 目的：一种印刷电路板及其制造方法，其通过使用强化金属层增加刚性来降低弯曲性能。 构成：在印刷电路板（100）的堆积层（104）的两侧上形成保护层（101,106）。 在构建层的积层电路层（102）上形成强制金属层（102b）。 积层由积聚电路层和积层绝缘层（103）组成。 保护层保护层的最外层。
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公开(公告)号：KR1020090030970A
公开(公告)日：2009-03-25
申请号：KR1020070096710
申请日：2007-09-21
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/385 , H05K3/007 , H05K3/4644 , H05K2203/0315
Abstract: A method for manufacturing a substrate is provided to facilitate the extraction of a circuit laminate by using a supporter including an oxide metal layer. A supporter includes a base material and a first metal layer. The base material is made of the metal. A first metal layer is formed in one side of the base material(S210). The whole or a part of the first metal layer is oxidized. A first metal oxide layer is formed(S220). A second metal layer is formed in one side of the first oxide metal layer(S230). A circuit laminate is formed in one side of the second metal layer(S240). The first oxide metal layer and the second metal layer are separated. The circuit laminate is separated from the supporter(S250). The second metal layer is selectively etched to the predetermined shape(S260). The solder resist layer is formed in one side of the circuit laminate(S270).
Abstract translation: 提供一种制造基板的方法，以便于通过使用包括氧化物金属层的支撑体来提取电路层叠体。 支撑体包括基材和第一金属层。 基材由金属制成。 第一金属层形成在基材的一侧（S210）。 第一金属层的全部或一部分被氧化。 形成第一金属氧化物层（S220）。 在第一氧化物金属层的一侧形成第二金属层（S230）。 在第二金属层的一侧形成电路层叠体（S240）。 第一氧化物金属层和第二金属层被分离。 电路层叠体与支架分离（S250）。 选择性地蚀刻第二金属层至预定形状（S260）。 阻焊层形成在电路层叠体的一侧（S270）。
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公开(公告)号：KR1020110052971A
公开(公告)日：2011-05-19
申请号：KR1020090109731
申请日：2009-11-13
Applicant: 삼성전기주식회사
IPC: H05K3/22
Abstract: PURPOSE: A printed circuit board with a reinforcing material and manufacturing method thereof are provided to form a reinforcing material in all parts except an opening of a solder resist layer which exposes a pad, thereby efficiently preventing a substrate from being bent. CONSTITUTION: A printed circuit board(100) with a reinforcing material includes a solder resist layer(110) and a reinforcing material(120). The solder resist layer is formed on the outmost edge of a buildup layer(130) to protect a circuit layer. The reinforcing material prevents a substrate from being bent. An opening(137) exposing a pad(135) is formed in the solder resist layer. A hole(125) corresponding to the opening is formed in the reinforcing material. The reinforcing material is formed through an anodic oxidation process. The reinforcing material is formed through a plating process.
Abstract translation: 目的：提供具有增强材料的印刷电路板及其制造方法，以在除了暴露衬垫的阻焊剂层的开口之外的所有部分中形成增强材料，从而有效地防止衬底弯曲。 构成：具有增强材料的印刷电路板（100）包括阻焊层（110）和增强材料（120）。 阻焊层形成在积层（130）的最外边缘以保护电路层。 增强材料防止基材弯曲。 在阻焊层中形成露出焊盘（135）的开口（137）。 在加强材料中形成对应于开口的孔（125）。 增强材料通过阳极氧化工艺形成。 增强材料通过电镀工艺形成。
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Patent Agency Ranking
公开(公告)号：KR100913765B1
公开(公告)日：2009-08-25
申请号：KR1020070096710
申请日：2007-09-21
Applicant: 삼성전기주식회사
IPC: H05K3/46
Abstract: 기판제조방법이 개시된다. 모재와 모재의 일면에 형성된 제1 금속층을 포함하는 지지체를 이용하여 기판을 제조하는 방법으로서, 제1 금속층을 산화시켜 제1 산화금속층을 형성하는 단계; 제1 산화금속층의 일면에 제2 금속층을 형성하는 단계; 제2 금속층의 일면에 회로적층체를 형성하는 단계 및 제1 산화금속층과 제2 금속층을 분리하여 회로적층체를 지지체로부터 분리하는 단계를 포함하는 기판제조방법이 개시된다. 이에 의하면, 모재와 그 일면에 형성된 산화금속층을 포함하는 지지체를 사용하여 회로적층체를 형성하여 그 취출과정을 용이하게 함으로써, 기판제조공정을 단순화시키고 지지체를 구성하는 모재를 재사용함으로써 기판의 제조비용을 절감할 수 있다.
코어리스, coreless, 박형기판-
公开(公告)号：KR1020160149613A
公开(公告)日：2016-12-28
申请号：KR1020150086884
申请日：2015-06-18
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4697 , H05K3/282 , H05K3/4007 , H05K3/4644 , H05K3/4673
Abstract: 본발명은인쇄회로기판및 인쇄회로기판의제조방법에관한것이다. 본발명의일 실시예에따르면, 제1 절연층, 제1 절연층상부에형성되는제1 회로층, 제1 절연층상부에형성되는제2 절연층, 제2 절연층상부에형성되며감광성재질로형성되는제2 회로층및 제2 절연층상부에형성되어제2 회로층을감싸보호하는보호층을포함하되, 보호층은관통형상의캐비티를포함하며, 제2 회로층의일부를외부로노출하도록형성되며, 제2 절연층은캐비티하부에위치한제1 회로층을외부로노출하도록형성된인쇄회로기판이제공된다.
Abstract translation: 印刷电路板包括：第一绝缘层; 设置在所述第一绝缘层上方的第一电路层; 设置在所述第一绝缘层上方的第二绝缘层; 第二电路层，设置在所述第二绝缘层的上方并由感光材料构成; 以及保护层，其设置在所述第二绝缘层的上方并且围绕所述第二电路层，其中所述保护层包括隧道型腔并将所述第二电路层的一部分暴露于外部环境，并且其中所述第二绝缘层暴露出所述第二绝缘层的一部分 第一电路层位于空腔下面到外部环境。
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公开(公告)号：KR1020160149612A
公开(公告)日：2016-12-28
申请号：KR1020150086883
申请日：2015-06-18
Applicant: 삼성전기주식회사
CPC classification number: H05K1/0298 , H01L23/13 , H01L23/49822 , H01L23/49827 , H05K1/111 , H05K1/113 , H05K1/183 , H05K3/06 , H05K3/061 , H05K3/188 , H05K3/40 , H05K3/4644 , H05K3/4652 , H05K3/4697 , H05K2201/09036 , H05K2203/308
Abstract: 본발명은인쇄회로기판및 인쇄회로기판의제조방법에관한것이다. 본발명의실시예에따르면, 상면에서내부로오목하게캐비티가형성된절연층, 절연층내부에형성되되, 일부가캐비티내부에위치하도록형성된제1 회로층, 절연층에상부에형성된제2 회로층, 캐비티내부에위치한제1 회로층상부에형성된제1 표면처리층및 제2 회로층상부에형성된제2 표면처리층을포함하는인쇄회로기판이제공된다.
Abstract translation: 印刷电路板包括：绝缘层，其包括形成在其中的空腔，所述空腔从绝缘层的顶表面凹入绝缘层; 形成在所述绝缘层内的第一电路层，使得所述第一电路层的一部分设置在所述空腔内; 设置在所述绝缘层上方的第二电路层; 第一表面处理层，设置在设置在腔内的第一电路层的部分之上; 以及设置在第二电路层上方的第二表面处理层。
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公开(公告)号：KR1020120006748A
公开(公告)日：2012-01-19
申请号：KR1020100067387
申请日：2010-07-13
Applicant: 삼성전기주식회사
IPC: H01L21/673 , B65D85/86 , B65D85/48 , G02F1/13
Abstract: PURPOSE: A magazine for transferring thin plate is provided to minimize substrate warpage by supporting an end part of a substrate with the formation of an inclined protrusion portion in an individual slot. CONSTITUTION: A main body(110) includes either side wall(112). A plurality of slots(120) is perpendicularly projected in inner sides of both sides of the main body. A protrusion portion(121) is formed in a part of a lower side of each slot. A declined part(130) sloping downward is formed in an tip-end portion of the protrusion portion. The declined part is composed of a side inclined portion(131) and a front inclined portion(132).
Abstract translation: 目的：提供用于转移薄板的盒子，以通过在单个槽中形成倾斜突出部分来支撑衬底的端部来最小化衬底翘曲。 构成：主体（110）包括侧壁（112）。 多个狭槽（120）垂直地突出在主体两侧的内侧。 在每个槽的下侧的一部分中形成有突起部（121）。 在突出部的前端部形成有向下倾斜的倾斜部（130）。 倾斜部由侧倾部（131）和前倾部（132）构成。
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公开(公告)号：KR100643928B1
公开(公告)日：2006-11-10
申请号：KR1020050079187
申请日：2005-08-29
Applicant: 삼성전기주식회사
IPC: H05K3/22
Abstract: A printed circuit board with a dual type inner structure is provided to suppress a warping effect in an arbitrary direction by dualizing an internal layer structure thereof. A core layer is formed with an insulator. A circuit pattern layer includes a center part(320) and a peripheral part(330). The circuit pattern layer is formed on an upper part of the core layer. A circuit pattern is formed on the center part. The center part is surrounded by the periphery part. The peripheral part is formed with a material having the same strength as or strength more than strength of a material for forming the circuit pattern. An insulating layer is formed on an upper part of the circuit pattern layer. A solder resist is formed on an upper part of the insulating layer.
Abstract translation: 提供具有双重型内部结构的印刷电路板以通过对其内部层结构进行双重化来抑制任意方向上的翘曲效应。 芯层由绝缘体形成。 电路图案层包括中心部分（320）和外围部分（330）。 电路图案层形成在芯层的上部。 电路图案形成在中央部分上。 中央部分被周边部分包围。 周边部分由具有与用于形成电路图案的材料的强度相同的强度或强度的材料形成。 绝缘层形成在电路图案层的上部。 阻焊剂形成在绝缘层的上部。
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