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公开(公告)号：KR1020080047211A
公开(公告)日：2008-05-28
申请号：KR1020060117253
申请日：2006-11-24
Applicant: 삼성전자주식회사
IPC: C09K11/06
CPC classification number: C07D209/82 , C09K11/06 , C09K2211/1029 , H01L51/0072 , H01L51/50
Abstract: An organic light emitting compound, and an organic light emitting device containing the compound are provided to improve enhance the solubility and thermal stability of the compound, thereby lowering drive voltage and enhancing efficiency, color purity and brightness. An organic light emitting compound is represented by the formula 1, wherein R1 to R7 are independently H, a halogen atom, a cyano group, a nitro group, a hydroxyl group, a substituted or unsubstituted C1-C50 alkyl or alkoxy group, a substituted or unsubstituted C5-C50 cycloalkyl or heterocycloalkyl group, a substituted or unsubstituted C6-C50 aryl group, a substituted or unsubstituted C2-C50 heteroaryl group, -N(Z1)(Z2) or -Si(Z3)(Z4)(Z5); Z1 to Z5 are independently H, a substituted or unsubstituted C1-C50 alkyl group, a substituted or unsubstituted C6-C50 aryl group, a substituted or unsubstituted C2-C50 heteroaryl group, a substituted or unsubstituted C6-C50 cycloalkyl group or a substituted or unsubstituted C5-C50 heterocycloalkyl group; X is C(Z6)(Z7), N(Z8), O, S, SO2, Se or SeO2; Z6 to Z8 are independently H, a substituted or unsubstituted C1-C50 alkyl group or a substituted or unsubstituted C6-C50 aryl group; and the case that R1, R2 and R4 are a methyl group and the case that R3, R5, R6 and R7 are H, are excluded.
Abstract translation: 提供有机发光化合物和含有该化合物的有机发光装置，以提高化合物的溶解性和热稳定性，从而降低驱动电压并提高效率，色纯度和亮度。 有机发光化合物由式1表示，其中R 1至R 7独立地为H，卤素原子，氰基，硝基，羟基，取代或未取代的C 1 -C 50烷基或烷氧基，取代的 或未取代的C 5 -C 50环烷基或杂环烷基，取代或未取代的C 6 -C 50芳基，取代或未取代的C 2 -C 50杂芳基，-N（Z 1）（Z 2）或-Si（Z 3）（Z 4）（Z 5） ; Z 1至Z 5独立地为H，取代或未取代的C 1 -C 50烷基，取代或未取代的C 6 -C 50芳基，取代或未取代的C 2 -C 50杂芳基，取代或未取代的C 6 -C 50环烷基或取代或未取代的C 6 -C 50环烷基， 未取代的C 5 -C 50杂环烷基; X为C（Z6）（Z7），N（Z8），O，S，SO2，Se或SeO2; Z6至Z8独立地为H，取代或未取代的C1-C50烷基或取代或未取代的C6-C50芳基; 以及R1，R2和R4为甲基，R3，R5，R6和R7为H的情况除外。
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公开(公告)号：KR1020080039763A
公开(公告)日：2008-05-07
申请号：KR1020060107486
申请日：2006-11-01
Applicant: 삼성전자주식회사
IPC: C09K11/06
CPC classification number: H01L51/0055 , C07C13/62 , C07C13/66 , C07C211/54 , C07C2601/14 , C07C2603/42 , C07C2603/52 , C07C2603/54 , C07C2603/94 , C07D209/86 , C07D495/04 , H01L51/0056 , H01L51/0081 , H01L51/5012
Abstract: An organic light emitting compound is provided to ensure excellent thermal stability and to produce an organic light emitting device having improved driving voltage, efficiency, and brightness characteristics. An organic light emitting compound has a structure represented by the following formula 1. An organic light emitting device includes a first electrode, a second electrode, and at least one organic layer between the first electrode and the second electrode, wherein the organic layer comprises the compound. The organic layer is a light emitting layer, a hole injection layer, a hole transport layer, a hole block layer, or an electron transport layer.
Abstract translation: 提供有机发光化合物以确保优异的热稳定性并产生具有改进的驱动电压，效率和亮度特性的有机发光器件。 有机发光化合物具有由下式1表示的结构。有机发光器件包括第一电极，第二电极和在第一电极和第二电极之间的至少一个有机层，其中有机层包括 复合。 有机层是发光层，空穴注入层，空穴传输层，空穴阻挡层或电子传输层。
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公开(公告)号：KR1020080033780A
公开(公告)日：2008-04-17
申请号：KR1020060099942
申请日：2006-10-13
Applicant: 삼성전자주식회사
CPC classification number: C08K5/14 , B82Y30/00 , C08J5/005 , C08K5/0025 , C08K2201/011
Abstract: A multicomponent carbon nanotube-polymer complex is provided to improve mechanical properties and curing properties and be usable as a electromagnetic shielding material, a conductive material, etc. A multicomponent carbon nanotube-polymer complex includes carbon nanotubes surface-modified with double bond-containing functional groups, and a polymeric binder. The double bond-containing functional group has a structure represented by the following formula 1, wherein R1 is a C1-15 linear, branched, or cyclic alkylene group, or a C1-15 linear, branched, or cyclic alkylene group in which at least one of C, C=O, O, N, and benzene is contained in at least one of a main chain or side chain, and R2, R3, and R4 independently are H or a C1-15 linear, branched, or cyclic alkyl group.
Abstract translation: 提供多组分碳纳米管 - 聚合物复合物以改善机械性能和固化性能，并且可用作电磁屏蔽材料，导电材料等。多组分碳纳米管 - 聚合物复合物包括用双键官能团表面改性的碳纳米管 基团和聚合物粘合剂。 含双键的官能团具有由下式1表示的结构，其中R 1是C 1-15直链，支链或环状的亚烷基，或C 1-15直链，支链或环状的亚烷基，其中至少 C，C = O，O，N和苯中的一个包含在主链或侧链中的至少一个中，R2，R3和R4独立地为H或C1-15直链，支链或环状烷基 组。
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公开(公告)号：KR1020070074966A
公开(公告)日：2007-07-18
申请号：KR1020060003159
申请日：2006-01-11
Applicant: 삼성전자주식회사
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L24/26 , H01L21/76838 , H01L23/498 , H01L25/074
Abstract: A substrate for a Pb-free solder joint is provided to cause a wicking phenomenon in a Pb-free solder joint process by increasing the volume of a Pb-free solder in a lead part. A semiconductor chip package has an outer lead(17b) protruding to the outside of a resin molding part. Substrate pads(53) are joined by a Pb-free solder. An insulation layer(55) is formed in a manner that exposes the substrate pads to the outside. The outer lead, the substrate pads and the insulation layer are formed on a substrate(50). The substrate pads have a lead attach region corresponding to the attach surface of the lead, a front margin region formed in the lengthwise direction of the lead from the lead attach region to the outside of the package, and a rear margin region formed in the opposite direction to the lengthwise direction of the lead in the front margin region. A predetermined part of the rear margin region is removed to make the front margin region larger than the rear margin region so that the front margin region and the rear margin region are unbalanced with respect to the lead attach region. The lead can be a Sn-Bi plating layer, and the Pb-free solder can be Sn-Ag-Cu.
Abstract translation: 提供无铅焊点的基板，通过增加引线部分中的无铅焊料的体积，在无铅焊接工艺中引起芯吸现象。 半导体芯片封装具有向树脂成型部的外侧突出的外引线（17b）。 衬底焊盘（53）通过无铅焊料连接。 绝缘层（55）以将衬底焊盘暴露于外部的方式形成。 外引线，基板焊盘和绝缘层形成在基板（50）上。 衬底焊盘具有对应于引线的附着表面的引线附着区域，沿引线长度方向从引线附着区域到封装外部形成的前边缘区域和形成在相反的引线附近区域的后边缘区域 方向到前缘区域中铅的长度方向。 去除后边缘区域的预定部分以使前边缘区域大于后边缘区域，使得前边缘区域和后边缘区域相对于引线附着区域不平衡。 铅可以是Sn-Bi镀层，无铅焊料可以是Sn-Ag-Cu。
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公开(公告)号：KR1020070029992A
公开(公告)日：2007-03-15
申请号：KR1020050084706
申请日：2005-09-12
Applicant: 삼성전자주식회사
IPC: H05K13/08
CPC classification number: H05K13/08 , G01N21/8422 , G01N2021/8427 , H05K3/18
Abstract: An apparatus and a method for mounting a component to prevent a connection failure of components are provided to prevent an electrical connection failure between a printed circuit board and the component by mounting the plated component on the printed circuit board. An apparatus for mounting a component to prevent a connection failure of components includes a conveyer, a component stage(210), a transfer unit(230), a control unit(260), and a plating determination unit(270). The conveyer guides a printed circuit board to a predetermined position. The component stage(210) has a providing unit to provide a plurality of components having an external connection terminal to a predetermined position one by one. After the transfer unit(230) transfers the components provided to the component stage(210) to an upper part of the printed circuit board, the transfer unit(230) mounts the transferred component on a predetermined position of the printed circuit board. The control unit(260) controls the conveyer, the providing unit, and the transfer unit(230). The plating determination unit(270) determines whether a predetermined conductive material is plated on a surface of the external connection terminal of the component or not.
Abstract translation: 提供了用于安装组件以防止部件的连接故障的装置和方法，以通过将电镀部件安装在印刷电路板上来防止印刷电路板和部件之间的电连接故障。 用于安装部件以防止部件的连接故障的装置包括传送器，部件台（210），传送单元（230），控制单元（260）和电镀确定单元（270）。 输送机将印刷电路板引导到预定位置。 部件级（210）具有提供单元，用于将多个具有外部连接端子的部件逐个地提供给预定位置。 在传送单元（230）将设置到组件台（210）的组件传送到印刷电路板的上部之后，传送单元（230）将传送组件安装在印刷电路板的预定位置上。 控制单元（260）控制传送器，提供单元和传送单元（230）。 电镀确定单元（270）确定在组件的外部连接端子的表面上是否镀覆预定的导电材料。
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Patent Agency Ranking
公开(公告)号：KR1020060015919A
公开(公告)日：2006-02-21
申请号：KR1020040064310
申请日：2004-08-16
Applicant: 삼성전자주식회사
CPC classification number: H01L25/074 , H01L23/49816 , H01L24/12 , H01L24/28
Abstract: 본 발명은 단위 반도체 칩 패키지 복수 개가 수직으로 적층된 적층형 반도체 칩 패키지와 그를 갖는 반도체 모듈에 관한 것으로서, 단위 반도체 칩 패키지 복수 개가 솔더 범프에 의해 물리적 및 전기적으로 상호 연결되어 수직으로 적층된 적층형 반도체 칩 패키지에 있어서, 적층된 상기 단위 반도체 칩 패키지들에 패키지 박리 방지용 홀더가 클램핑되어 수직 적층 상태를 유지하는 것을 특징으로 한다. 이에 따르면, 반도체 모듈의 제조 과정이나 수리 과정에서 발생될 수 있는 솔더 볼 변형이나 패키지 박리 현상을 방지할 수 있다. 적층되는 단위 반도체 칩 패키지의 수가 증가될수록 더욱 큰 효과를 얻을 수 있다. 더욱이, 박리 방지용 홀더(holder)로써 금속 재질의 홀더를 사용함으로써 솔더 볼 변형과 패키지 박리의 방지 효과와 더불어 향상된 방열 효과를 얻을 수 있다.
적층형 반도체 칩 패키지, 스택 패키지, 모듈, BGA, 솔더 볼, 솔더 범프-
公开(公告)号：KR100539246B1
公开(公告)日：2005-12-27
申请号：KR1020030085818
申请日：2003-11-28
Applicant: 삼성전자주식회사
IPC: H01R33/76
CPC classification number: H01R13/2471 , H01R13/111
Abstract: 소켓에 투입되는 이물질이 모듈 및 소켓에 주는 영향을 최소한으로 하는 개방형 소켓이 개시된다. 상기 개방형 소켓은, 모듈이 장착되는 부분의 하부에 위치한 하단지지대 전체가 개방되거나, 모듈이 장착되는 부분의 하부에 위치하는 하단지지대 중에서, 소켓의 한 쪽 에지 또는 양쪽의 에지 부분은 밀폐되고 중간 부분은 개방되는 것이다. 또한, 상기 개방형 소켓은, 모듈의 전기적 연결부와 서로 접촉하는 소켓의 전기적 연결부의 형태를 원형으로 하는 것이다.
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公开(公告)号：KR1020030068703A
公开(公告)日：2003-08-25
申请号：KR1020020008292
申请日：2002-02-16
Applicant: 삼성전자주식회사
IPC: H05K13/02
CPC classification number: H05K13/0413
Abstract: PURPOSE: A semiconductor chip package multiple supply device is provided to reduce a pickup time by performing semiconductor chip package pickup operations at the same time and to supply a semiconductor chip package rapidly and exactly by removing a mechanical error at a transfer operation. CONSTITUTION: A tray supply part(220) supplies a package tray(23), and a tray transfer part(240) transfers the package tray. The first head part(250) has a plurality of first pickup heads(255) which are spaced by intervals between semiconductor chip packages(20) in the package tray and perform a pickup operation at the same time. The first head shift part(260) has the first head part and two shift shafts(265,267) configured to shift a location of the first head part in all directions. A rotary table(270) has a plurality of package beds(276) where the semiconductor chip packages are placed at an edge of a top surface of a rotation body. A vacuum absorption hole(278) is formed at the package bed to absorb the semiconductor chip package. The second head part(280) has a plurality of second pickup heads(285) which are spaced by intervals between semiconductor chip packages transferred from the rotary table and perform a pickup operation at the same time. The second head shift part(290) has the second head part and two shift shafts(295,297) configured to shift a location of the second head part in all directions.
Abstract translation: 目的：提供半导体芯片封装多电源装置，通过同时执行半导体芯片封装拾取操作来减少采集时间，并通过在传输操作中消除机械误差来快速准确地提供半导体芯片封装。 构成：托盘供应部件（220）供应包装托盘（23），托盘传送部件（240）传送包装托盘。 第一头部（250）具有多个第一拾取头（255），其在包装托盘中的半导体芯片封装（20）之间间隔开，同时执行拾取操作。 第一头部移位部分（260）具有第一头部部分和两个换档轴（265,267），其配置成在所有方向上移动第一头部部分的位置。 旋转台（270）具有多个包装床（276），其中半导体芯片封装被放置在旋转体的顶表面的边缘处。 在包装床处形成真空吸附孔278以吸收半导体芯片封装。 第二头部（280）具有多个第二拾取头（285），其间隔开从转台传送的半导体芯片组件之间的间隔并同时执行拾取操作。 第二头部移位部分（290）具有第二头部部分和两个变速轴（295,297），其构造成在所有方向上移动第二头部部分的位置。
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公开(公告)号：KR101466339B1
公开(公告)日：2014-11-28
申请号：KR1020080079616
申请日：2008-08-13
Applicant: 삼성전자주식회사
CPC classification number: D06F39/125
Abstract: 본 발명은 세탁기의 지지장치에 관한 것으로, 보다 상세하게는 조립과 교체가 용이하여 서비스성이 향상되는 지지장치를 개시한다.
본 발명에 따른 세탁기의 지지장치는 베이스에 결합되되, 그 결합 위치를 조절할 수 있는 제1조절유닛과, 제1조절유닛에 상대 운동 가능하게 설치되는 제2조절유닛을 구비하는 구성된다.-
公开(公告)号：KR101466236B1
公开(公告)日：2014-11-28
申请号：KR1020080055835
申请日：2008-06-13
Applicant: 삼성전자주식회사
CPC classification number: H05K1/0271 , H01L2924/0002 , H05K1/144 , H05K1/181 , H05K2201/0133 , H05K2201/10159 , H05K2201/10265 , H05K2201/10734 , H01L2924/00
Abstract: 본 발명은 반도체 모듈에 관한 것으로서, 적어도 하나 이상의 반도체 패키지가 설치되는 모듈 몸체; 및 취급 부주의로 인한 추락 등에 의해 상기 모듈 몸체에 가해지는 충돌체와의 충격으로부터 상기 반도체 패키지가 보호되도록 충돌체와 충돌이 예상되는 상기 모듈 몸체의 일측에 설치되는 충격 완충 부재;를 포함하여 이루어지는 것을 특징으로 하기 때문에 추락이나 충돌체와의 충격이나 진동 등에 의한 반도체 패키지와 회로 기판 사이의 접속 단락을 방지할 수 있고, 좁은 공간에서도 모듈의 설치를 가능하게 하여 공간의 효율적인 이용이 가능하며, 탄성부재의 복원력에 의해 보다 견고한 고정으로 소음이나 진동의 발생을 억제할 수 있는 효과를 갖는다.
충격 완충 부재, 코일 스프링, 높이, 반도체 패키지, BGA 패키지
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