Abstract:
하기 화학식 1로 표현되는 부분을 포함하고 말단에 규소 결합된 알케닐 기(Si-Vi)를 가지는 제1 폴리실록산, 그리고 말단에 규소 결합된 수소(Si-H)를 가지는 제2 폴리실록산을 포함하는 봉지재 조성물, 상기 봉지재 조성물을 경화하여 얻은 봉지재 및 상기 봉지재를 포함하는 전자 소자에 관한 것이다. [화학식 1]
Abstract:
The present invention relates to a photocurable composition including a silicon-based compound containing a repeating unit of formula A and a (meth)acrylate group, a barrier layer including the same, a barrier layer stack including the same, an encapsulated apparatus including the same, and a method of encapsulating an apparatus using the same.
Abstract:
The present invention relates to a composition for an encapsulant composition comprising a first polysiloxane including a part represented by formula 1 and an alkenyl group combined with silicon (Si-Vi) at the terminal thereof and a second polysiloxane including hydrogen combined with silicon (Si-H) at the terminal thereof, an encapsulant obtained by curing the composition for encapsulant, and an electronic device including the encapsulant. In formula 1, the definitions of A and R^1 to R^4 are described in the specification.
Abstract:
The present invention relates to a photocurable composition and a device including a barrier layer made of the composition, and more specifically, to a photocurable composition and a device including a barrier layer made of the composition, wherein the photocurable composition includes a photocurable monomer and a monomer including a phosphor and a amide group. The photocurable monomer according to one embodiment of the present invention includes 1 to 30 monomers having a vinyl group, an acrylate group, or a methacrylate group. The device is sealed using the photocurable composition.
Abstract:
The present invention relates to a photocurable composition and an apparatus comprising a protective layer formed with the composition. More specifically, the present invention comprises: (A) a photocurable monomer; (B) a monomer comprising silicon; and (C) a photo polymerization initiator, and the monomer comprising silicon (B) relates to a photocurable composition having a structure of formula 1 and a device comprising a protective layer formed by the composition.
Abstract:
PURPOSE: A transparent resin composition, an encapsulant formed using the same and an electronic device including the encapsulant are provided to easily control the molecular weight, viscosity, vinyl content and hardness. CONSTITUTION: A transparent resin composition comprises polysiloxane having a part represented by chemical formula 1: -Si-Ar-Si-, wherein Ar is a substituted or unsubstituted C6-C30 arylene group.. The polysiloxane includes a part represented by (OR1)aO_(3-a)/2Si-Ar-SiO_(3-b)/2(OR^II)b, a part represented by R1R2SiO_(2-c)/2(OR^III)c, and at least one of the parts represented by R3SiO_(3-d)/2(OR^IV)d, R4R5SiO_(2-e)/2(OR^V)e, and R6R7R8SiO_1/2.
Abstract:
PURPOSE: A transparent resin composition, an encapsulant formed using the same and an electronic device including the encapsulant are provided to easily control the molecular weight and viscosity. CONSTITUTION: A transparent resin composition includes polysiloxane having a part represented by chemical formula 1: *-Si-Ar-Si-*. In chemical formula 1, Ar is a substituted or unsubstituted C6-C30 arylene group. The polysiloxane includes a part represented by (OR1)aO_(3-a)/2Si-Ar-SiO_(3-b)/2(OR^II)b, a part represented by R1R2SiO_(2-c)/2(OR^III)c, and at least one of the parts represented by R3SiO_(3-d)/2(OR^IV)d, R4R5SiO_(2-e)/2(OR^V)e, and R6R7R8SiO_1/2.