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    ABRASIVE ARTICLES INCLUDING CONFORMABLE COATINGS AND POLISHING SYSTEM THEREFROM
    41.
    发明申请
    ABRASIVE ARTICLES INCLUDING CONFORMABLE COATINGS AND POLISHING SYSTEM THEREFROM 审中-公开

    公开(公告)号：US20200172780A1

    公开(公告)日：2020-06-04

    申请号：US16629769

    申请日：2018-07-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Chi-Fan Chen ,  Caleb T. Nelson ,  Moses M. David

    IPC: C09K3/14 ,  B24B53/12 ,  B24D11/00

    Abstract: The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

    Polishing pads and systems and methods of making and using the same
    44.
    发明授权
    Polishing pads and systems and methods of making and using the same 有权

    公开(公告)号：US10071461B2

    公开(公告)日：2018-09-11

    申请号：US15300125

    申请日：2015-03-31

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Duy K. Lehuu ,  Kenneth A. P. Meyer ,  Moses M. David

    IPC: B24B37/22 ,  B24B37/26 ,  B24B37/24 ,  B24B7/22

    CPC classification number: B24B37/26 ,  B24B7/228 ,  B24B7/241 ,  B24B37/22 ,  B24B37/24 ,  B24B37/245

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    SUBSTRATE WITH AMORPHOUS, COVALENTLY-BONDED LAYER AND METHOD OF MAKING THE SAME
    46.
    发明申请
    SUBSTRATE WITH AMORPHOUS, COVALENTLY-BONDED LAYER AND METHOD OF MAKING THE SAME 审中-公开

    公开(公告)号：US20170226640A1

    公开(公告)日：2017-08-10

    申请号：US15501044

    申请日：2015-07-31

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Biljana Mikijelj ,  Muhammad Z. Nawaz ,  Moses M. David

    IPC: C23C16/50 ,  C23C16/30 ,  B24B37/10 ,  C23C16/56

    CPC classification number: C23C16/50 ,  B24B37/107 ,  C23C16/02 ,  C23C16/30 ,  C23C16/515 ,  C23C16/56

    Abstract: An article that includes a substrate and an amorphous, covalently-bonded layer on the surface of the substrate. The substrate may be a crystalline ceramic and/or may have a surface with a first surface roughness (Ra) of at least 100 angstroms, and the amorphous, covalently-bonded layer has a second surface roughness (Ra) of up to 15 angstroms. The substrate may have a dimension of at least 50 mm, and the amorphous, covalently-bonded layer may have a thickness of at least five micrometers. A method of making an article is also disclosed. The method includes forming an amorphous, covalently-bonded layer on the surface of the substrate by plasma deposition and, in some embodiments, polishing the amorphous, covalently-bonded layer to a second surface roughness (Ra) of up to 15 angstroms. The amorphous, covalently-bonded layer in the article and method includes silicon, oxygen, carbon, and hydrogen atoms.

    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME
    47.
    发明申请
    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME 审中-公开

    公开(公告)号：US20170173758A1

    公开(公告)日：2017-06-22

    申请号：US15129639

    申请日：2015-03-31

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Duy K. Lehuu ,  Kenneth A.P. Meyer ,  Moses M. David

    IPC: B24B37/26 ,  B24B37/24 ,  B24B7/22 ,  B24B37/22

    CPC classification number: B24B37/26 ,  B24B7/228 ,  B24B37/22 ,  B24B37/245

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped asperities. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

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