LITHOGRAPHIC METHOD AND APPARATUS
    44.
    发明申请

    公开(公告)号:US20170261863A1

    公开(公告)日:2017-09-14

    申请号:US15527264

    申请日:2015-11-02

    CPC classification number: G03F7/70425 G03F7/20 G03F7/70491 G03F7/706

    Abstract: A method of correcting aberrations caused by a projection system of a lithographic apparatus, the method including performing a measurement of an aberration caused by the projection system using a sensor located in the lithographic apparatus, determining, based on a history of operation of the lithographic apparatus since a change of machine state, whether to average the measured aberration with one or more aberration measurements previously obtained using the sensor, calculating a correction to be applied to the lithographic apparatus using the measured aberration if it is determined that averaging should not be performed, calculating a correction to be applied to the lithographic apparatus using an averaged aberration measurement if it is determined that averaging should be performed, and applying the calculated correction to the lithographic apparatus.

    Lithographic Method and Apparatus
    46.
    发明申请
    Lithographic Method and Apparatus 有权
    平版印刷方法和装置

    公开(公告)号:US20150346606A1

    公开(公告)日:2015-12-03

    申请号:US14825771

    申请日:2015-08-13

    Abstract: A method of patterning substrates using a lithographic apparatus. The method comprising providing a beam of radiation using an illumination system, using a patterning device to impart the radiation beam with a pattern in its cross-section, and using a projection system to project the patterned radiation beam onto target portions of a lot of substrates, wherein the method further comprises performing a radiation beam aberration measurement after projecting the patterned radiation beam onto a subset of the lot of substrates, performing an adjustment of the projection system using the results of the radiation beam aberration measurement, then projecting the patterned radiation beam onto a further subset of the lot of substrates.

    Abstract translation: 使用光刻设备对衬底进行图案化的方法。 该方法包括使用照明系统提供辐射束,使用图案形成装置将辐射束赋予其横截面中的图案,以及使用投影系统将图案化的辐射束投影到许多基底的目标部分上 其中所述方法还包括在将所述图案化的辐射束投影到所述许多衬底的子集之后执行辐射束像差测量,使用所述辐射束像差测量的结果执行所述投影系统的调整,然后将所述图案化的辐射束 进入许多底物的另一个子集。

    Lithographic Method and Apparatus
    47.
    发明申请
    Lithographic Method and Apparatus 有权
    平版印刷方法和装置

    公开(公告)号:US20130271636A1

    公开(公告)日:2013-10-17

    申请号:US13849333

    申请日:2013-03-22

    CPC classification number: G01J1/42 G03F7/70591 G03F7/7085 G03F7/70941

    Abstract: A method and apparatus are provided for determining apodization properties of a projection system in a lithographic apparatus. The method comprises allowing light from a given point in an illumination field to pass through the projection system along at least three different optical paths, and then determining the difference in the intensity of light received in a projection field from the two different optical paths, and calculating apodization properties of the projection system from the intensity difference. It is not necessary to know the intensity distribution in the illumination field. To provide the different optical paths a pinhole reticle provided with wedges of different orientations is used.

    Abstract translation: 提供了一种用于确定光刻设备中的投影系统的变迹特性的方法和装置。 该方法包括允许来自照明场中的给定点的光沿着至少三个不同的光路穿过投影系统,然后确定在来自两个不同光路的投影场中接收的光的强度差,以及 从强度差计算投影系统的变迹特性。 不需要知道照明场中的强度分布。 为了提供不同的光路,使用具有不同取向楔形的针孔掩模版。

    Lithographic Method and Apparatus
    48.
    发明申请

    公开(公告)号:US20130235361A1

    公开(公告)日:2013-09-12

    申请号:US13767774

    申请日:2013-02-14

    Abstract: A method of patterning substrates using a lithographic apparatus. The method comprising providing a beam of radiation using an illumination system, using a patterning device to impart the radiation beam with a pattern in its cross-section, and using a projection system to project the patterned radiation beam onto target portions of a lot of substrates, wherein the method further comprises performing a radiation beam aberration measurement after projecting the patterned radiation beam onto a subset of the lot of substrates, performing an adjustment of the projection system using the results of the radiation beam aberration measurement, then projecting the patterned radiation beam onto a further subset of the lot of substrates.

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