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公开(公告)号:DE102004040523B4
公开(公告)日:2008-10-02
申请号:DE102004040523
申请日:2004-08-20
Applicant: INFINEON TECHNOLOGIES AG
Inventor: FALCK ELMAR , NIEDERNOSTHEIDE FRANZ-JOSEF , SCHULZE HANS-JOACHIM , BARTHELMESS REINER
IPC: H01L29/06 , H01L21/328 , H01L29/739 , H01L29/74 , H01L29/78 , H01L29/861
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公开(公告)号:DE102005031398A1
公开(公告)日:2007-01-11
申请号:DE102005031398
申请日:2005-07-05
Applicant: INFINEON TECHNOLOGIES AG
IPC: H01L29/06 , H01L29/861
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公开(公告)号:DE102004042163B4
公开(公告)日:2006-06-08
申请号:DE102004042163
申请日:2004-08-31
Applicant: EUPEC GMBH & CO KG , INFINEON TECHNOLOGIES AG
IPC: H01L29/74
Abstract: The thyristor has a semiconductor body (1) in which a p-doped emitter, n-doped base and n-doped main emitter are arranged. A sectional plane runs via n-doped short circuit zones. The ratio between the sum of cross sectional surfaces of one of the zones in an inner area and a cross sectional surface of the inner area is greater than that between the sum of surfaces of another zones in the outer area to a surface of the outer area. - An INDEPENDENT CLAIM is also included for a circuit arrangement with a thyristor.
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公开(公告)号:DE102004040523A1
公开(公告)日:2006-02-23
申请号:DE102004040523
申请日:2004-08-20
Applicant: EUPEC GMBH & CO KG , INFINEON TECHNOLOGIES AG
Inventor: FALCK ELMAR , NIEDERNOSTHEIDE FRANZ-JOSEF , SCHULZE HANS-JOACHIM , BARTHELMESS REINER
IPC: H01L29/06 , H01L29/739 , H01L29/74 , H01L29/78 , H01L29/861
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公开(公告)号:DE50107925D1
公开(公告)日:2005-12-08
申请号:DE50107925
申请日:2001-08-24
Applicant: EUPEC GMBH & CO KG , INFINEON TECHNOLOGIES AG
Inventor: BARTHELMESS REINER , PFIRSCH FRANK , MAUDER ANTON , SCHMIDT GERHARD
IPC: H01L21/322 , H01L21/329 , H01L29/06 , H01L29/40 , H01L29/861 , H01L21/304
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公开(公告)号:DE10250608B4
公开(公告)日:2005-09-29
申请号:DE10250608
申请日:2002-10-30
Applicant: EUPEC GMBH & CO KG , INFINEON TECHNOLOGIES AG
Inventor: SCHULZE HANS-JOACHIM , KELLNER-WERDEHAUSEN UWE , NIEDERNOSTHEIDE FRANZ-JOSEF , BARTHELMESS REINER
Abstract: A thyristor comprises a semiconductor body with a front and back face, an edge, a first semiconductor zone, embodied in the region of the rear face and a second semiconductor zone, adjacent to the first semiconductor zone, whereby the edge has a bevelled embodiment in the region of the transition between the first and second semiconductor zones, at least one third semiconductor zone, arranged in the region of the front face of the semiconductor body and at least one fourth semiconductor zone, arranged between the at least one third semiconductor zone and the second semiconductor zone. The fourth semiconductor zone terminates before the edge in the lateral direction of the semiconductor body, in order to reduce the amplification of a parasitic bipolar transistor formed in the region of the edge by the fourth semiconductor zone, the second semiconductor zone and the first semiconductor zone.
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公开(公告)号:AT263433T
公开(公告)日:2004-04-15
申请号:AT99944236
申请日:1999-07-01
Applicant: INFINEON TECHNOLOGIES AG
Inventor: PORST ALFRED , STRACK HELMUT , MAUDER ANTON , SCHULZE HANS-JOACHIM , BRUNNER HEINRICH , BAUER JOSEF , BARTHELMESS REINER
IPC: H01L29/744 , H01L29/10 , H01L29/12 , H01L29/36 , H01L29/739 , H01L29/745 , H01L29/749 , H01L29/78 , H01L29/861
Abstract: A power semiconductor components has stop zones. In order to optimize the static and dynamic losses of the power semiconductor components, the stop zone is provided with donors which have at least one donor level which lies within the band gap of silicon and is at least 200 meV away from the conduction band edge of silicon.
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