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公开(公告)号：US20160115016A1
公开(公告)日：2016-04-28
申请号：US14667169
申请日：2015-03-24
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Martin Lim , Jong Il Shin , Jongwoo Shin
IPC: B81C1/00
CPC classification number: B81B3/001 , B81B2201/0235 , B81B2201/0242 , B81C2201/115 , B81C2203/0792
Abstract: Various embodiments provide for a method for roughening a surface of a MEMs device or the surface of a CMOS surface. A first material can be deposited in a thin layer over a surface made of a second material. After heating, the first and second materials, they can partially melt and interdiffuse, forming an alloy. The first material can then be removed and the alloy is removed at the same time. The surface of the second material that is left behind has then been roughened due to the interdiffusion of the first and second materials.
Abstract translation: 各种实施例提供了用于使MEM器件的表面或CMOS表面的表面粗糙化的方法。 第一材料可以沉积在由第二材料制成的表面上的薄层中。 加热后，第一和第二种材料，它们可以部分熔化和相互扩散，形成合金。 然后可以除去第一种材料并同时去除合金。 然后由于第一和第二材料的相互扩散，留下的第二材料的表面被粗糙化。
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公开(公告)号：US20160068386A1
公开(公告)日：2016-03-10
申请号：US14942969
申请日：2015-11-16
Applicant: Invensense, Inc.
Inventor： Mei-Lin Chan , Xiang Li , Martin Lim
IPC: B81C1/00
CPC classification number: B81C1/00238 , B81B3/0021 , B81B3/0086 , B81B7/0006 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , B81C2203/035 , B81C2203/0785 , H01L41/0926 , H01L41/0973 , H01L41/1132 , H01L41/1138 , H04R7/08 , H04R19/005 , H04R19/04
Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
Abstract translation: MEMS器件包括双膜，电极和互连结构。 双膜具有顶膜和底膜。 底部膜位于顶部膜和电极之间，并且互连结构限定顶部膜和底部膜之间的间隔。
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公开(公告)号：US08945969B2
公开(公告)日：2015-02-03
申请号：US14456973
申请日：2014-08-11
Applicant: InvenSense, Inc.
Inventor： Kegang Huang , Jongwoo Shin , Martin Lim , Michael Julian Daneman , Joseph Seeger
CPC classification number: B81C1/00301 , B81B7/0064 , B81B2207/098 , B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/031
Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.
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公开(公告)号：US10935509B2
公开(公告)日：2021-03-02
申请号：US16786361
申请日：2020-02-10
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim , Yushi Yang
Abstract: The present invention relates to methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
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公开(公告)号：US10891461B2
公开(公告)日：2021-01-12
申请号：US15601934
申请日：2017-05-22
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Peter Hartwell , Martin Lim
Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
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Patent Agency Ranking
公开(公告)号：US20180340901A1
公开(公告)日：2018-11-29
申请号：US16038499
申请日：2018-07-18
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Martin Lim , Baris Cagdaser
IPC: G01N27/04 , G01N27/414 , G01K7/16 , G01N27/12
Abstract: The present invention relates to low power, low cost, and compact gas sensors and methods for making the same. In one embodiment, the gas sensor includes a heating element embedded in a suspended structure overlying a substrate. The heating element is configured to generate an amount of heat to bring the chemical sensing element to an operating temperature. The chemical sensing element is thermally coupled to the heating element. The chemical sensing element is also exposed to an environment that contains the gas to be measured. In one embodiment, the chemical sensing element comprises a metal oxide compound having an electrical resistance based on the concentration of a gas in the environment and the operating temperature of the chemical sensing element. In this embodiment, the operating temperature of the chemical sensing element is greater than room temperature and determined by the amount of heat generated by the heating element.
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公开(公告)号：US09878902B2
公开(公告)日：2018-01-30
申请号：US15383755
申请日：2016-12-19
Applicant: INVENSENSE, INC.
Inventor： Michael Dueweke , Martin Lim
CPC classification number: B81B7/0038 , B81B7/02 , B81B2207/012 , B81B2207/07 , B81C1/00285 , B81C1/00293 , B81C2201/0161 , B81C2203/0785
Abstract: A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
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公开(公告)号：US09718679B2
公开(公告)日：2017-08-01
申请号：US14598138
申请日：2015-01-15
Applicant: InvenSense, Inc.
Inventor： Martin Lim
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242
Abstract: A Microelectromechanical Systems (MEMS) structure with integrated heater is disclosed. The MEMS structure with integrated heater comprises a first substrate with cavities, bonded to a second substrate, forming a plurality of sealed enclosures of at least two types. Each of the plurality of sealed enclosures is defined by the first substrate, the second substrate, and a seal-ring material, where the first enclosure type further includes at least one of a gettering element to decrease cavity pressure in the first enclosure type or an outgassing element to increase cavity pressure in the first enclosure type when activated. The first enclosure type further comprises at least one heater integrated into the first substrate adjacent to the gettering element or the outgassing element to adjust the temperature of the gettering element or the outgassing element thereby providing heating to the gettering element or the outgassing element.
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公开(公告)号：US09650241B2
公开(公告)日：2017-05-16
申请号：US14857687
申请日：2015-09-17
Applicant: InvenSense, Inc.
Inventor： Cerina Zhang , Martin Lim
CPC classification number: B81C1/00333 , B81B3/0051 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81C2203/0118 , B81C2203/0145 , B81C2203/035 , B81C2203/038
Abstract: A method for forming a MEMS device includes coupling a MEMS substrate and a base substrate. The MEMS substrate and the base substrate contain at least two enclosures. One enclosures has a first vertical gap between the bonding surface of the MEMS substrate and the bonding surface of the base substrate that is less than a second vertical gap between the bonding surface of the MEMS substrate and the bonding surface of the base substrate than another of the enclosures to provide a height difference between the first vertical gap and the second vertical gap. The method includes bonding the bonding surfaces of the one of the two enclosures at a first pressure to provide a first sealed enclosure. The method includes bonding the bonding surfaces of other of the two enclosures at a second pressure to provide a second sealed enclosure.
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公开(公告)号：US20170067841A1
公开(公告)日：2017-03-09
申请号：US14849551
申请日：2015-09-09
Applicant: INVENSENSE, INC.
Inventor： Fang Liu , Martin Lim , Baris Cagdaser
CPC classification number: G01N27/046 , G01K7/16 , G01N27/128 , G01N27/4148
Abstract: The present invention relates to low power, low cost, and compact gas sensors and methods for making the same. In one embodiment, the gas sensor includes a heating element embedded in a suspended structure overlying a substrate. The heating element is configured to generate an amount of heat to bring the chemical sensing element to an operating temperature. The chemical sensing element is thermally coupled to the heating element. The chemical sensing element is also exposed to an environment that contains the gas to be measured. In one embodiment, the chemical sensing element comprises a metal oxide compound having an electrical resistance based on the concentration of a gas in the environment and the operating temperature of the chemical sensing element. In this embodiment, the operating temperature of the chemical sensing element is greater than room temperature and determined by the amount of heat generated by the heating element.
Abstract translation: 本发明涉及低功率，低成本和小型气体传感器及其制造方法。 在一个实施例中，气体传感器包括嵌入在衬底上的悬挂结构中的加热元件。 加热元件构造成产生一定量的热量以使化学传感元件达到工作温度。 化学传感元件热耦合到加热元件。 化学传感元件也暴露于含有待测气体的环境中。 在一个实施方案中，化学传感元件包括基于环境中的气体浓度和化学传感元件的操作温度具有电阻的金属氧化物化合物。 在该实施例中，化学传感元件的工作温度大于室温，并由加热元件产生的热量确定。
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