公开(公告)号：JP2006259472A

公开(公告)日：2006-09-28

申请号：JP2005079054

申请日：2005-03-18

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  HAMAGUCHI HITOSHI ,  KAJITA TORU

IPC: G02F1/1339 ,  C08F2/44 ,  C08F265/00 ,  G03F7/033

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition preferably used for simultaneously forming a projection and a spacer of a vertical alignment liquid crystal display element. SOLUTION: The radiation-sensitive resin composition for simultaneously forming the projection and the spacer of the vertical alignment liquid crystal display element contains: [A] (a1) unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (a2) a tetrahydrofuran frame, a furan frame, a tetrahydropyran frame, a pyran frame, an unsaturated compound containing at least one frame selected from a group of the frames denoted by formula (1) (in the formula (1), R is a hydrogen atom or a methyl group, and n is an integer of 2 to 10), and (a3) a copolymer obtained to copolymerize the other unsaturated compound except for components of (a1) to (a2); [B] a polymerization unsaturated compound; and [C] a radiation-sensitive polymerization initiator. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供优选用于同时形成垂直取向液晶显示元件的突起和间隔物的辐射敏感性树脂组合物。 解决方案：用于同时形成突起的放射线敏感性树脂组合物和垂直取向液晶显示元件的间隔物包含：[A]（a1）不饱和羧酸和/或不饱和羧酸酐，（a2）a 四氢呋喃框架，呋喃骨架，四氢吡喃骨架，吡喃骨架，含有选自由式（1）表示的一组框架中的至少一个框架的不饱和化合物（在式（1）中，R是氢原子或 甲基，n为2〜10的整数），（a3）除（a1）〜（a2）成分以外的其他不饱和化合物共聚而得到的共聚物。 [B]聚合不饱和化合物; 和[C]辐射敏感聚合引发剂。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006030809A

公开(公告)日：2006-02-02

申请号：JP2004212294

申请日：2004-07-20

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  KAJITA TORU

IPC: G03F7/031 ,  G03F7/038

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of faithfully reproducing the design size of a mask pattern with high sensitivity, excellent in adhesion to a substrate, making it possible to obtain a satisfactory spacer shape and thickness under an exposure energy of ≤150 mJ/cm 2 , and capable of forming spacers for a display panel excellent in strength, heat resistance, etc. SOLUTION: The radiation sensitive composition contains [A] a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing ethylenically unsaturated compound and (a3) another ethylenically unsaturated compound, [B] a polymerizable compound having an ethylenically unsaturated bond and [C] a photopolymerization initiator comprising a compound represented by formula (1) wherein one of R 1 and R 2 is an alkyl group, an alicyclic group, an oxygen-containing heterocyclic group, a nitrogen-containing heterocyclic group, an oxygen-containing heterocyclic group or a sulfur-containing heterocyclic group; and R 3 -R 6 each represent H or an alkyl group. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决问题：为了提供能够以高灵敏度忠实地再现掩模图案的设计尺寸的感光性树脂组合物，对基材的粘合性优异，可以在曝光下获得令人满意的间隔物形状和厚度 能量≤150mJ/ cm 2，能够形成强度，耐热性等优异的显示面板用间隔物。解决方案：辐射敏感性组合物含有[A]共聚物 （a1）烯键式不饱和羧酸和/或烯键式不饱和羧酸酐，（a2）含环氧基的烯属不饱和化合物和（a3）另一种烯属不饱和化合物，[B]具有烯属不饱和键的可聚合化合物和 [C]包含由式（1）表示的化合物的光聚合引发剂，其中R SB 1和R SB 2之一是烷基，脂环族基团，含氧的 杂环 基团，含氮杂环基，含氧杂环基或含硫杂环基; 和R SB 3 -R SB 6各自表示H或烷基。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005281445A

公开(公告)日：2005-10-13

申请号：JP2004096087

申请日：2004-03-29

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： KATO YOSHIFUMI ,  BABA ATSUSHI ,  KAJITA TORU

IPC: G02B1/11 ,  C08F220/36 ,  C08F220/60 ,  C08J5/18 ,  C08L101/06 ,  G03C1/835 ,  H01L27/14

Abstract: PROBLEM TO BE SOLVED: To provide a thermosetting composition suitable for forming an antihalation film which can effectively inhibit diffused reflection from a base substrate and has high transmittance of visible light and a high heat resistance. SOLUTION: The thermosetting composition contains a copolymer of a monomer mixture containing (a1) an epoxy group-containing unsaturated compound, (a2) a radiation-absorbing radically polymerizable compound and (a3) (a3-1) a polymerizable unsaturated carboxylic acid and/or a polymerizable unsaturated polycarboxylic acid anhydride or (a3-2) a polymerizable unsaturated compound having at least one structure chosen from an acetal ester structure of a carboxylic acid, a ketal ester structure of an carboxylic acid and a t-butyl ester structure of a carboxylic acid. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种适于形成防晕膜的热固性组合物，其可以有效地抑制基底基板的扩散反射，并且具有高可见光透射率和高耐热性。 热固性组合物包含含有（a1）含环氧基的不饱和化合物，（a2）辐射吸收自由基聚合性化合物和（a3）（a3-1）的可聚合不饱和羧酸的单体混合物的共聚物 酸和/或可聚合的不饱和多羧酸酐或（a3-2）具有选自羧酸的缩醛酯结构，羧酸的缩酮酯结构和叔丁基酯的至少一种结构的可聚合不饱和化合物 羧酸的结构。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004311617A

公开(公告)日：2004-11-04

申请号：JP2003101358

申请日：2003-04-04

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SUGITA HIKARI ,  NEMOTO HIROAKI ,  KAJITA TORU

IPC: H01L21/768 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To provide a method which can remove easily the resist material and the planarizing material, without damaging an insulating film, after a fine pattern is formed in an interlayer insulating film of low permittivity on a substrate, in a manufacturing process of a semiconductor device. SOLUTION: In the manufacturing process of a semiconductor device, the process for removing the resist material and/or the planarizing material exfoliates them from the substrate 20 while leaving the insulating film 21 on the substrate 20, by integrating an adhesive member 1 in a body with the resist material and/or the planarizing material 26, after the resist material and/or the planarizing material 26 left on the substrate 20 after working of the interlayer insulating film 21 of low permittivity are covered with the adhesive member 1. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2002091002A

公开(公告)日：2002-03-27

申请号：JP2000282250

申请日：2000-09-18

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F32/00 ,  C08K5/00 ,  C08L45/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation and superior developability, excellent in adhesiveness to a substrate as well as in basic solid state properties as a resist, e.g. sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a copolymer having repeating units of formula (1) [wherein R1-R3 are each H, a 1-4C alkyl, a monovalent O-containing polar group or a monovalent N-containing polar group; R4-R6 are each H, a 1-6C alkyl, a 1-6C alkoxy or a 2-7C alkoxycarbonyl; and (n) and (m) are each an integer of 0-2] as essential units and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2002062657A

公开(公告)日：2002-02-28

申请号：JP2001095877

申请日：2001-03-29

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: C08F220/28 ,  C08F232/00 ,  C08K5/00 ,  C08L33/14 ,  C08L45/00 ,  G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type positive type resist, excellent in basic solid state properties as the resist, e.g. sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing semiconductor devices in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin having a lactone ring structure of formula (1) [where (a) is an integer of 1-3; (b) is an integer of 0-9; and R1 is a monovalent organic group] and made alkali-soluble when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2001235864A

公开(公告)日：2001-08-31

申请号：JP2000046031

申请日：2000-02-23

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  YAMAHARA NOBORU ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08K5/00 ,  C08K5/12 ,  C08L45/00 ,  C08L101/02 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) a compound of formula 1, formula 2 or the like.

公开(公告)号：JP2001147532A

公开(公告)日：2001-05-29

申请号：JP32822499

申请日：1999-11-18

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: H01L21/027 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in dry etching resistance, sensitivity, resolution, etc., as a chemical amplification type resist, capable of avoiding a change of the line width of a resist pattern due to a change of the time elapsed from exposure to post-exposure heating and having superior process stability. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin typified by copolymer of 8-methyl-8hydroxytetracyclo[4.4.0.12,5'.17,10]dodec-3-ene, itaconic anhydride and t-butyl (meth)acrylate and (B) a radiation sensitive acid generating agent. The resin A is made alkali-soluble when the acid dissociable group is dissociated.

公开(公告)号：JPH10319587A

公开(公告)日：1998-12-04

申请号：JP13005397

申请日：1997-05-20

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/022 ,  G03F7/023 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide the radiation sensitive resin composition superior in focus allowance and sensitivity and resolution and useful as a positive resist for producing large scale integrated circuits. SOLUTION: This radiation sensitive resin composition contains an alkali- soluble phenol resin and a quinonediazido compound, and the alkali-soluble phenol resin is a condensation product of phenols composed essentially of p- cresol and aldehydes, and, when the alkali-soluble phenol resin is measured by the pyrolytic analysis of a gas chromatgraph using a capillary column provided in the inside with a silicone phase containing permethylated α- cyclodextrine at a pyrolytic temperature of 670 deg.C, a ratio of the peak area X of the p-cresol to the peak area Y of 2,4-dimethylphenol X/Y is >=2.0.

公开(公告)号：JPH10133369A

公开(公告)日：1998-05-22

申请号：JP34700797

申请日：1997-12-01

Applicant: JSR CORP

Inventor： KAJITA TORU ,  MIURA TAKAO ,  ISAMOTO YOSHITSUGU ,  OKUDA CHOZO

IPC: G03F7/022 ,  G03F7/004 ,  G03F7/023 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide the composition capable of suppressing the occurrence of scum, improved in developing property, high in sensitivity and excellent in heat resistance and residual film ratio by incorporating a specific alkali soluble resin and a specific 1,2-quinone diazide compound into the composition. SOLUTION: This radiation resin composition containing the alkali soluble resin having weight average molecular weight of 2000-20000 expressed in terms of polystyrene and the 1,2-quinone diazide compound expressed by formula is used. In the formula, P represents integers of 0 or 1, D represents hydroxide group or an organic group having 1,2-quinone diazide group and a part or the whole of D is the organic group having 1,2-quinone diazide group. Various blending agents such as a sensitizer, a surfactant, a dissolution accelerating agent can be added in the composition. A dye or a pigment can be added to the composition in order to visualize a latent image in a part irradiated with radiation and reduce the effect of halation at the time of irradiation of radiant ray, and an adhesive assistant can be added in order to improve adhesion.