公开(公告)号：DE69701944T2

公开(公告)日：2000-11-16

申请号：DE69701944

申请日：1997-06-19

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  YOCIS KATHLEEN ,  LARSON CHRISTOPHER

IPC: C25D5/54 ,  H05K3/42 ,  C25D5/56

Abstract: A conductive metal layer is electroplated onto a substrate comprising both non-conductive and metallic surfaces by: (a) contacting the substrate with a solution of a compound which forms a sacrificial layer on the metallic surfaces only, the sacrificial layer being insoluble in alkaline and neutral media but soluble in acid media; (b) contacting the substrate with a liquid carbon dispersion to deposit a layer of carbon; (c) contacting the substrate with an acidic solution to dissolve the sacrificial layer; and (d) electroplating a conductive metal layer over at least the non-conductive surfaces.

公开(公告)号：DE69009978T3

公开(公告)日：1998-01-29

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：DE69009978T2

公开(公告)日：1994-10-27

申请号：DE69009978

申请日：1990-12-05

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  DONLON EDWARD T

IPC: C23C18/38 ,  C23C18/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/42

Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process.

公开(公告)号：DE3887989T2

公开(公告)日：1994-07-14

申请号：DE3887989

申请日：1988-12-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  D AMBRISI JOSEPH J ,  KUZMIK JOHN J

IPC: C11D7/60 ,  C23C18/20 ,  C23C18/22 ,  C23C18/28 ,  H05K3/00 ,  H05K3/26 ,  H05K3/42 ,  H05K3/46 ,  C23C18/26 ,  C23C18/30 ,  C23C30/00

公开(公告)号：CA1258717A

公开(公告)日：1989-08-22

申请号：CA538709

申请日：1987-06-03

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E

IPC: H05K3/28 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  C25D5/02

Abstract: METHOD FOR MANUFACTURE OF PRINTED CIRCUIT BOARDS A method of preparing printed circuit boards is described in which the solder mask on the circuit pattern and, optionally, the solder on the through-holes surrounding pads, and like areas to receive solder, is applied over a layer of lead covering the copper layer at said loci. This method eliminates the need to strip tin-lead alloy etch resist which step is commonly employed in prior processes. The method overcomes the problems associated with migration of tin into the copper layer which can occur when tin-lead alloys are applied directly over copper.

公开(公告)号：AU7752287A

公开(公告)日：1988-02-24

申请号：AU7752287

申请日：1987-06-25

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RHODENIZER HAROLD

IPC: C25D7/00 ,  B05D1/32 ,  C23C18/28 ,  C23C28/00 ,  C25D5/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46

公开(公告)号：CA1222663A

公开(公告)日：1987-06-09

申请号：CA456946

申请日：1984-06-19

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  SAWOSKA DAVID

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/42 ,  C23C18/30

Abstract: OXIDIZING ACCELERATOR A method of electroless deposition of metal on a non-conductive substrate is disclosed and comprises treating a substrate prior to electroless deposition with a catalyst composition containing a mixed tin-palladium catalyst. An improvement in metal deposition is obtained by contacting the treated substrate with an accelerator bath containing an agent which oxidizes the tin.

公开(公告)号：ZA843704B

公开(公告)日：1985-09-25

申请号：ZA843704

申请日：1984-05-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  SAWOSKA DAVID

IPC: C23C18/18 ,  C23C18/28 ,  H05K3/42 ,  B01J ,  C23C

公开(公告)号：CH649580A5

公开(公告)日：1985-05-31

申请号：CH1044379

申请日：1979-11-23

Applicant: MACDERMID INC

Inventor： BASKER RACHEL-GOLDSTEIN ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

IPC: C23C18/40 ,  C23C18/48 ,  C25D3/38

公开(公告)号：CA1163056A

公开(公告)日：1984-03-06

申请号：CA393444

申请日：1981-12-30

Applicant: MACDERMID INC

Inventor： FERRIER DONALD R ,  RHODENIZER HAROLD L ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

IPC: C23C3/02

Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a nonformaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140.degree. to 160.degree.F); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.