POLYIMIDE RESIN COMPOSITION
    42.
    发明专利

    公开(公告)号:AU591045B2

    公开(公告)日:1989-11-23

    申请号:AU1690288

    申请日:1988-05-31

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l

    POLYIMIDE RESIN COMPOSITION
    43.
    发明专利

    公开(公告)号:AU3385889A

    公开(公告)日:1989-11-09

    申请号:AU3385889

    申请日:1989-04-28

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

    POLYIMIDE RESIN COMPOSITION
    44.
    发明专利

    公开(公告)号:AU1674388A

    公开(公告)日:1988-12-15

    申请号:AU1674388

    申请日:1988-05-27

    Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

    POLYIMIDE RESIN COMPOSITION AND INJECTION-MOLDED ITEM EXCELLENT IN FATIGUE CHARACTERISTICS

    公开(公告)号:JPH07304949A

    公开(公告)日:1995-11-21

    申请号:JP9716694

    申请日:1994-05-11

    Abstract: PURPOSE:To obtain the compsn. having a high melt moldability and excellent fatigue resistance by compounding a polyimide having specified chemical structure and logarithmic viscosity with a reinforcement such as carbon fibers. CONSTITUTION:100 pts.wt. polyimide having repeating units of formula I and a logarithmic viscosity of 0.70 dl/g or higher is compounded with 5-65 pts.wt., pref. 10-50 pts.wt., reinforcement comprising carbon fibers, glass fibers, arom. polyamide fibers and/or potassium titanate fibers. The polyimide used has blocked molecular terminals and is produced in the presence of an arom. dicarboxylic anhydride of formula II (wherein Z is a 6-15C divalent group having a monocyclic arom. group, a condensed polycyclic arom. group and/or a noncondensed polycyclic arom. group formed by linking arom. groups directly or through linking groups) and/or an arom. monoamine of formula III (wherein V is the same as Z except it is monovalent). The part of the polyimide may be replaced by another polyimide.

Patent Agency Ranking