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    POLYIMIDE RESIN COMPOSITION
    41.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH0912882A

    公开(公告)日：1997-01-14

    申请号：JP16943595

    申请日：1995-07-05

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OKAWA YUICHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08J5/18 ,  C08G73/10 ,  C08K7/02 ,  C08K7/20 ,  C08L79/08 ,  C08L83/04

    Abstract: PROBLEM TO BE SOLVED: To prepare a polyimide resin compsn. having excellent heat resistance and mechanical properties by adding a particular polysiloxane to a particular polyimide resin. SOLUTION: This polyimide resin compsn. comprises: 100 pts.wt. polyimide resin, disclosed in Japanese Patent Laid-Open No. 205124/1987, represented by formula I (X represents a direct bond, formula II or the like; Ar represents a direct bond, formula III or the like) derived from an arom. tetracarboxylic acid dianhydride, such as biphenyltetracarboxylic acid dianhydride, and a diamine, such as bis(aminophenoxy)biphenyl; and 5 to 100 pts.wt. polysiloxane. The compsn. is prepd. by preparing a polyamic acid as a precursor of the polyimide, from a diamine component and a tetracarboxylic acid dianhydride in a solvent, adding a silane compd., such as tetramethoxysilane, and water to the soln. to conduct hydrolysis and applying heat to cause imidation of the polyamidic acid and dehydrocondensation of the cyanide to introduce a polysiloxane, thereby preparing a target composition with polysiloxane introduced into the polyimide molecule.

    PRODUCTION OF POLYIMIDE
    42.
    发明专利
    PRODUCTION OF POLYIMIDE 失效

    公开(公告)号：JPH0912719A

    公开(公告)日：1997-01-14

    申请号：JP16943395

    申请日：1995-07-05

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OKAWA YUICHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

    IPC: C08J5/18 ,  C08G73/10

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyimide having a small linear expansion coefficient and excellent dimensional stability and industrially useful for film, etc., by imidating a specific polyimide precursor in the presence of a specific compound. SOLUTION: The objective polyimide having the recurring structural unit of formula V can be produced by reacting (A) an aromatic diamine compound of formula I [X is direct bond, SO2 , CO, O, S, C(CH3 )2 or C(CF3 )2 ] [e.g. 4,4'-bis(3- aminophenoxy)biphenyl] with (B) a tetracarboxylic acid dianhydride of formula II (Ar is group of formula III, formula IV, etc.) (e.g. pyromellitic dianhydride) in a solvent (e.g. N-methyl-2-pyrrolidone) and imidating the resultant polyimide precursor in the presence of a compound having at least two groups selected from OH, NH2 , COOH, CH2 COOH and SO3 H on the aromatic ring of a molecule (e.g. o-hydroxybenzoic acid).

    POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM
    48.
    发明专利
    POLYAMIDE AND HEAT-RESISTANT ADHESIVE PREPARED THEREFROM 失效

    公开(公告)号：JPH0859826A

    公开(公告)日：1996-03-05

    申请号：JP19146194

    申请日：1994-08-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  IIYAMA KATSUAKI ,  SHIBUYA ATSUSHI ,  YAMAGUCHI TERUHIRO

    IPC: C08G69/42 ,  C09D177/00 ,  C09D177/06 ,  H05K3/38

    Abstract: PURPOSE: To obtain a heat-resistant adhesive of a low-temp. adhesion type by using a polyamide obtd. by reacting bis(aminophenoxydimethylbenzyl)benzene, a specific diaminosiloxane compd., and terephthaloyl chloride. CONSTITUTION: A polyamide is produced by reacting 1mol of 1.3- or 1,4-bis[4-(4 aminophenoxy)-α, α-dimethylbenzyl]benzene, 1-0.005-mol of a diaminosiloxane compd. of formula I wherein n is 0-7), and terephthaloyl or isophthaloyl chloride. It is important from the viewpoint of the adhesive properties and heat resistance of the resulting adhesive that the polyamide contains the siloxane units derived from the compd. of formula I and the units of formula II in a ratio of the former units to the latter of 1-0.005, pref. 0.2-0.1. In the above reaction a monocarboxylic acid or a monoamine can be used for blocking molecular terminals. A low-temp. soln. polycondensation method is suitable for obtaining a heat-resistant adhesive soln. contg. the polyamide. The soln. is applied and dried to bond a copper foil to glass. etc., providing a sufficient 90 deg. peeling strength even at low temp. and pressure.

    HEAT-RESISTANT ADHESIVE SOLUTION
    49.
    发明专利
    HEAT-RESISTANT ADHESIVE SOLUTION 失效

    公开(公告)号：JPH07228857A

    公开(公告)日：1995-08-29

    申请号：JP11645794

    申请日：1994-05-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  ASANUMA TADASHI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/10 ,  C09J179/08

    Abstract: PURPOSE:To obtain an adhesive solution of industrially great value, excellent in preservation stability and good in bonding strength. CONSTITUTION:This heat-resistant adhesive solution contains a polyimide copolymer obtained by thermally reacting a diamine component containing 1,3-bis (3-aminophenoxy)benzene or the 1,3-bis(3-aminophenoxy)benzene and other diamines at a specific molar ratio with benzophenonetetracarboxylic dianhydride or two or more tetracarboxylic dianhydrides selected from the benzophenonetetracarboxylic dianhydride and other specific tetracarboxylic dianhydrides in the presence of a dicarboxylic acid anhydride and/or a monoamino compound in an organic solvent.

    POLYIMIDE RESIN COMPOSITION
    50.
    发明专利
    POLYIMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH07179757A

    公开(公告)日：1995-07-18

    申请号：JP17718294

    申请日：1994-07-28

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI MASAJI ,  OKAWA YUICHI ,  SAKATA YOSHIHIRO ,  YAMASHITA WATARU ,  YAMAGUCHI TERUHIRO ,  YAMAGUCHI KEISABURO ,  OIKAWA HIDEAKI ,  MATSUO MITSUKI ,  ASANUMA TADASHI

    IPC: C08L71/10 ,  C08G73/10 ,  C08L71/08 ,  C08L79/04 ,  C08L79/08

    Abstract: PURPOSE:To obtain a polyimide resin composition containing, e.g. a polyimide having a specified structure and a polyether pyridine having a specified structure and excellent in melt molding properties, heat resistance, chemical resistance, mechanical strength and cumulative fatigue properties. CONSTITUTION:This resin composition contains (A) 99.9 to 50 pts.wt. polyimide having a repeating a structural unit of formula I (X is direct bond, isopropylidene, thio, etc.; R is a 2 to 27C aliphatic, an alicyclic, a condensed aromatic polycycle, etc.) and (B) 0.1 to 50 pts.wt. polyimide having a structural unit of formula II (R1 is a tetravalent group of formula III or IV), a polyimide having a structural unit of formula V and/or a polyether pyridine having a repeating structural unit of formula VI (Y is a bivalent group such as p-phenyl, biphenyl, etc.).

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