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公开(公告)号:AU6703686A
公开(公告)日:1988-06-30
申请号:AU6703686
申请日:1986-12-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , KAWASIMA SABURO , SONOBE YOSHIHO , OHTA MASAHIRO , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO
IPC: C08G73/00 , C08G73/10 , C09J179/08 , C09J3/14
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公开(公告)号:AU6924587A
公开(公告)日:1987-08-27
申请号:AU6924587
申请日:1987-02-25
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , KAWASHIMA SABURO
Abstract: This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutally connected with a bond or a crosslinking function).The ployimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3ʹ,4,4ʹ-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3ʹ4,4ʹ-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.
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公开(公告)号:DE69221956T2
公开(公告)日:1998-03-19
申请号:DE69221956
申请日:1992-06-09
Applicant: MITSUI TOATSU CHEMICALS
Inventor: YAMASHITA WATARU , TAMAI SHOJI , YAMAGUCHI AKIHIRO
IPC: C08G73/10 , C09J179/08
Abstract: Amorphous polyimide powder which has recurring structural units of the formula ( I ): as a fundamental skeleton, is blocked at the polymer chain end with dicarboxylic anhydride represented by the formula ( II ) wherein Z is a divalent radical having from 6 to 27 carbon atoms and selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and essentially has no reactive radical at the polymer chain end, preparation process of the amorphous polyimide powder, heat-resistant adhesive comprising the polyimide, and bonding method using the adhesive, are disclosed.
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公开(公告)号:DE3650656D1
公开(公告)日:1997-12-18
申请号:DE3650656
申请日:1986-06-30
Applicant: MITSUI TOATSU CHEMICALS
Inventor: OHTA MASAHIRO , KAWASHIMA SABURO - - , SONOBE YOSHIHO , TAMAI SHOJI , OIKAWA HIDEAKI , OHKOSHI KOUJI - - , YAMAGUCHI AKIHIRO - -
IPC: C08G73/10 , C09J179/08
Abstract: Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). Typical examples of polyimide and polyamic acid include where Y is thio radical and R is Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV. The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride. Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
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公开(公告)号:DE3855276T2
公开(公告)日:1996-09-19
申请号:DE3855276
申请日:1988-10-21
Applicant: MITSUI TOATSU CHEMICALS
Inventor: OHTA MASAHIRO , TAMAI SHOJI , KAWASHIMA SABURO , OIKAWA HIDEAKI , YAMAGUCHI AKIHIRO , NAKAKURA TOSHIYUKI , MASUDA MISAO , MARUKO CHIAKI , KOBA TOMOHITO , SAKAI HIDEO , KISHI SATORU
Abstract: This invention relates to a method for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polymide is prepared by reacting aromatic diamines such as 4,4 min -bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine : tetracarboxylic dianhydride : dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0). Another invention relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.
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公开(公告)号:DE69201139T2
公开(公告)日:1995-06-22
申请号:DE69201139
申请日:1992-02-17
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , YAMAGUCHI AKIHIRO , IIYAMA KATSUAKI
IPC: C08G73/10 , C09J179/08
Abstract: A polyimide-base heat-resistant adhesive having excellent peel strength and heat resistance comprising polyimide composed of 10 to 99 % by mole of structural units having the formula (1) and 1 to 90 % by mole of structural units having the formula (2) or comprising polyamic acid precursor which corresponds to the polyimide. a
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公开(公告)号:DE69109774D1
公开(公告)日:1995-06-22
申请号:DE69109774
申请日:1991-08-20
Applicant: MITSUI TOATSU CHEMICALS
Inventor: TAMAI SHOJI , YAMAGUCHI AKIHIRO , OHTA MASAHIRO
IPC: C08G73/10
Abstract: A readily melt-processable polyimide obtained by reacting diamino-diphenyl ether with 3,3 min ,4,4 min -biphenyltetracarboxylic dianhydride in the presnece of phthalic anhydride and thermally or chemically imidizing the resultant polyamic acid is disclosed.
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公开(公告)号:DE69012795T2
公开(公告)日:1995-05-11
申请号:DE69012795
申请日:1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor: YAMAYA NORIMASA , TAMAI SHOJI , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C08G73/12
Abstract: Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, O-, or by formula (III)): wherein n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.
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公开(公告)号:DE69011274T2
公开(公告)日:1995-03-09
申请号:DE69011274
申请日:1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor: YAMAGUCHI KEIZABURO , URAKAMI TATSUHIRO , TANABE YOSHIMITSU , YAMAZAKI MIDORI , TAMAI SHOJI , YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) wherein R is H or CH3. Also disclosed is a bismaleimide compound represented by the formula (IV) wherein R is H or CH3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
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公开(公告)号:DE69011274D1
公开(公告)日:1994-09-08
申请号:DE69011274
申请日:1990-10-24
Applicant: MITSUI TOATSU CHEMICALS
Inventor: YAMAGUCHI KEIZABURO , URAKAMI TATSUHIRO , TANABE YOSHIMITSU , YAMAZAKI MIDORI , TAMAI SHOJI , YAMAYA NORIMASA , OHTA MASAHIRO , YAMAGUCHI AKIHIRO
IPC: C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) wherein R is H or CH3. Also disclosed is a bismaleimide compound represented by the formula (IV) wherein R is H or CH3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
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