公开(公告)号：DE10234178A1

公开(公告)日：2003-03-06

申请号：DE10234178

申请日：2002-07-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: H05B33/10 ,  H01L21/67 ,  H01L51/50 ,  H01L51/52 ,  H05B33/02 ,  H01L51/00 ,  H01L23/12

Abstract: A substrate support rim used in the fabrication of devices such as organic light emissive diodes (OLEDs) is disclosed. The support rim, which is located at the edge of a substrate, serves to reinforce the substrate, facilitating handling during and after the fabrication process to reduce damage to the device. The support rim comprises, for example, epoxy, adhesives or other materials that adhere to the substrate.

公开(公告)号：AU7468200A

公开(公告)日：2002-03-22

申请号：AU7468200

申请日：2000-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  INST MATERIALS RESEARCH & ENG

Inventor： GUENTHER EWALD KARL MICHAEL ,  AUCH MARK DAI JOONG

IPC: H05B33/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H01J1/62 ,  H01L51/20

Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

公开(公告)号：AU4951399A

公开(公告)日：2001-01-30

申请号：AU4951399

申请日：1999-07-09

Applicant: INST MATERIALS RESEARCH & ENG ,  OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  CHEN ZHONG ,  COTTERELL BRIAN

IPC: H05B33/10 ,  B81B7/00 ,  B81C1/00 ,  H01L27/32 ,  H01L33/26 ,  H01L33/42 ,  H01L51/50 ,  H01L51/52 ,  H05B33/02 ,  H05B33/26 ,  H01L21/027 ,  H01L21/308 ,  H01L21/311 ,  H01L21/321

公开(公告)号：CA2342363A1

公开(公告)日：2001-01-18

申请号：CA2342363

申请日：1999-07-09

Applicant: INST MATERIALS RESEARCH & ENG ,  OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WANG WEI ,  GUENTHER EWALD KARL MICHAEL ,  CHUA SOO JIN

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/02 ,  H01L23/31 ,  H01L27/32 ,  H01L29/24 ,  H01L51/52 ,  H05K5/02 ,  H05K5/06 ,  H01L23/28

Abstract: An encapsulation for an electrical device (105) is disclosed. The encapsulation comprises plastic substrates (120, 121) which are laminated on to the surface (116) of the electrical device (105). The use of laminated plastics is particularly useful for flexible electrical devices (105) such a s organic LEDs.

公开(公告)号：DE102007015893A1

公开(公告)日：2008-10-09

申请号：DE102007015893

申请日：2007-04-02

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  GROETSCH STEFAN ,  BRUNNER HERBERT

IPC: H01L23/34 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

Abstract: The arrangement has a radiation emitting component (10) with a radiation emission side (11) and a lower side (12) that is opposite to the radiation emission side. A heat conductive strip (40) connects the radiation emission side and a housing (30). The strip is provided for electrically contacting the radiation emitting component, where the strip is designed in a rectangular cross section. The strip comprises metal, transparent conductive oxide and/or a semiconductor, where the metal comprises gold, aluminium and/or copper. The transparent conductive oxide comprises indium zinc oxide. Independent claims are also included for the following: (1) a method for operating an opto-electronic arrangement (2) a method for manufacturing an opto-electronic arrangement.

公开(公告)号：DE69935261T2

公开(公告)日：2007-06-21

申请号：DE69935261

申请日：1999-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: G02F1/1339 ,  H05B33/04 ,  H01L51/50 ,  H01L51/52

公开(公告)号：DE102005040558A1

公开(公告)日：2007-03-01

申请号：DE102005040558

申请日：2005-08-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  BRUNNER HERBERT ,  FISCHER HELMUT ,  EISSLER DIETER ,  HEINDL ALEXANDER

IPC: H01L33/50 ,  H01L51/50

Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

公开(公告)号：DE60027021T2

公开(公告)日：2006-08-24

申请号：DE60027021

申请日：2000-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  INST MATERIALS RESEARCH & ENG

Inventor： GUENTHER EWALD KARL MICHAEL ,  AUCH MARK DAI JOONG

IPC: H01J1/62 ,  H05B33/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10

Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

公开(公告)号：AT241253T

公开(公告)日：2003-06-15

申请号：AT99962636

申请日：1999-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  HAGEN KLAUSMANN

IPC: H05B33/04 ,  C09J201/00 ,  C09K3/10 ,  H01L25/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H01L27/15 ,  H01L51/20

Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

公开(公告)号：DE10234162A1

公开(公告)日：2003-03-13

申请号：DE10234162

申请日：2002-07-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  INST MATERIALS RESEARCH & ENG

Inventor： LOW HONG YEE ,  GUENTHER EWALD KARL MICHAEL ,  CHUA SOO JIN

IPC: H01L21/50 ,  H01L23/10 ,  H05B33/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/02 ,  H05B33/10 ,  H01L21/52 ,  H01L51/40

Abstract: An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.