公开(公告)号：JP2010027624A

公开(公告)日：2010-02-04

申请号：JP2009251324

申请日：2009-10-30

Applicant: Inst Of Materials Research & Engineering ,  Osram Opto Semiconductors Gmbh ,  インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： GUENTHER EWALD KARL MICHAEL ,  CHUA SOO JIN ,  AUCH MARK DAI JOONG ,  FANG LIM SHUANG ,  LOW BEE LING

IPC: H05B33/04 ,  C09J201/00 ,  C09K3/10 ,  G09F9/30 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10

CPC classification number: H01L51/5246

Abstract: PROBLEM TO BE SOLVED: To provide an OLED device having improved sealing, and a reduced chip size, especially provide an OLED device formed on a thin or flexible substrate to prevent mechanical damage on an active device layer. SOLUTION: The device includes a barrier layer arranged on the substrate, a sealing dam surrounding a cell region and containing material selected from polybenzoxazoles, polyglutarimid, and benzocyclobutene, a cap supported by the sealing dam, spacer particles in a region of the device for supporting the cap, a sealing region adjacent to an external surface of the sealing dam, and adhesive as a tightly closing material arranged in the sealing region. The adhesive air-tightly seals the device, and the sealing dam reduces a sealing width of the device. The spacer particles are randomly distributed in the cell region. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供具有改进的密封和减小的芯片尺寸的OLED器件，特别是提供形成在薄或柔性衬底上的OLED器件，以防止在有源器件层上的机械损伤。 解决方案：该装置包括布置在基底上的阻挡层，围绕细胞区域并包含选自聚苯并恶唑，聚戊二酰胺和苯并环丁烯的材料的密封坝，由密封坝支撑的盖，间隔物颗粒在 用于支撑盖的装置，与密封堤的外表面相邻的密封区域，以及作为设置在密封区域中的紧密封闭材料的粘合剂。 粘合剂气密地密封装置，并且密封坝减小了装置的密封宽度。 间隔物颗粒随机分布在细胞区域中。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2011091063A

公开(公告)日：2011-05-06

申请号：JP2011025663

申请日：2011-02-09

Applicant: Inst Of Materials Research & Engineering ,  Osram Opto Semiconductors Gmbh ,  インスティチュート オブ マテリアルズ リサーチ アンド エンジニアリング ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： ZHU FURONG ,  GUENTHER EWALD KARL MICHAEL ,  CHUA SOO JIN

IPC: H05B33/28 ,  H01L51/50 ,  H05B33/02 ,  H05B33/10

Abstract: PROBLEM TO BE SOLVED: To provide a transparent conductive layer suitable for requirements for use of an OLED.
SOLUTION: The organic LED (OLED) device includes a substrate having a device region, and an OLED stack in the device region. The OLED stack includes: the transparent conductive layer useful as a first electrode, wherein the transparent conductive layer has specific resistance of 4×10
-4 Ωcm or less obtained at high carrier concentration of at least 7×10
20 cm
-3 ; a conductive layer useful as a second electrode; and at least one organic functional layer for separating the first electrode and second electrode. The transparent conductive layer is obtained by sputtering transparent conductive material on the substrate in argon-hydrogen treatment gas mixture. A surface of the transparent conductive layer has RMS surface roughness of

Abstract translation: 要解决的问题：提供适合于使用OLED的要求的透明导电层。 有机LED（OLED）器件包括具有器件区域的衬底和器件区域中的OLED堆叠。 OLED堆叠包括：可用作第一电极的透明导电层，其中透明导电层在高载流子浓度下获得的电阻率为4×10 -4 SPF以上，至少为7×10 20 厘米 -3 ; 用作第二电极的导电层; 以及用于分离第一电极和第二电极的至少一个有机功能层。 透明导电层通过在氩 - 氢处理气体混合物中在衬底上溅射透明导电材料而获得。 透明导电层的表面的RMS表面粗糙度<2nm。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2005322923A

公开(公告)日：2005-11-17

申请号：JP2005134682

申请日：2005-05-02

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： GUENTHER EWALD KARL MICHAEL ,  WAITL GUENTHER ,  BRUNNER HERBERT ,  STRAUS JOERG

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/00

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting diode device which can be manufactured at a particularly low cost, and to provide a method of manufacturing the light-emitting diode device.
SOLUTION: A light-emitting diode device has at least one light-emitting diode chip 11, provided with a radiation emission surface 12 via which most of the electromagnetic radiation generated in the light-emitting diode chip is emitted; at least one light-emitting layer 13 positioned on the radiation emitting surface; and a housing 17 in which the light-emitting diode chip is embedded.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决的问题：提供可以以特别低的成本制造的发光二极管器件，并提供一种制造发光二极管器件的方法。 解决方案：发光二极管器件具有至少一个发光二极管芯片11，该发光二极管芯片11具有发射在发光二极管芯片中产生的大部分电磁辐射的辐射发射表面12; 位于辐射发射表面上的至少一个发光层13; 以及嵌入发光二极管芯片的壳体17。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2003059664A

公开(公告)日：2003-02-28

申请号：JP2002218047

申请日：2002-07-26

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング

Inventor： GUENTHER EWALD KARL MICHAEL

IPC: H05B33/10 ,  H01L21/67 ,  H01L51/50 ,  H01L51/52 ,  H05B33/02 ,  H05B33/14

CPC classification number: H01L51/52 ,  H01L21/67 ,  H01L51/5246 ,  H01L2251/5338 ,  Y10S438/976

Abstract: PROBLEM TO BE SOLVED: To provide a reinforcing method of the substrate on which a device is formed so that it may not easily be damaged during the manufacturing time.
SOLUTION: A support rim is formed at the edge of at least one surface of the substrate and possibility of damages is reduced by this support rim, and an additional treatment is applied to the device.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种在其上形成器件的基板的增强方法，使得其在制造时间内不容易损坏。 解决方案：在基板的至少一个表面的边缘处形成支撑边缘，并且通过该支撑边缘减小损坏的可能性，并且对该装置进行附加处理。

公开(公告)号：JP2003086360A

公开(公告)日：2003-03-20

申请号：JP2002218046

申请日：2002-07-26

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  INST MATERIALS RESEARCH & ENG

Inventor： GUENTHER EWALD KARL MICHAEL ,  LOW HONG YEE ,  CHUA SOO JIN

IPC: H05B33/04 ,  H01L21/50 ,  H01L23/10 ,  H01L51/50 ,  H01L51/52 ,  H05B33/02 ,  H05B33/10 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide an effective method for sealing a device without influencing the quality and property of a substrate of an active element. SOLUTION: An active element is mounted to the upper part of a substrate, and a cap, to be used for sealing the active device mounted on the substrate, is prepared. Adhesive agent is applied to the area of the cap where the cap contacts with the substrate, or to the area of the substrate where the substrate contacts the cap, and bridging is made to start while making the adhesive agent stay in liquid phase by applying partial cure, and the cap is put on the substrate, and the device is sealed by curing the adhesive agent.

公开(公告)号：WO2010025694A2

公开(公告)日：2010-03-11

申请号：PCT/DE2009001103

申请日：2009-08-04

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

Inventor： GUENTHER EWALD KARL MICHAEL ,  HERRMANN SIEGFRIED ,  ZEHNDER ULRICH ,  BRUNNER HERBERT

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

Abstract: In at least one embodiment of the optoelectronic component (1), it comprises a carrier (2) having an installation side (20) and at least one functional element (3). The optoelectronic component (1) further comprises at least one substrateless optoelectronic semiconductor chip (4) having a top side (44) and a bottom side (45) opposite thereof, wherein electric contacting of the semiconductor chip (4) takes place via the top side (44) and the bottom side (45), and wherein the bottom side (45) faces the installation side (20) of the carrier (2). The at least one semiconductor chip (4) is applied to the installation side (20). The optoelectronic component (1) further comprises at least one electric contact film (5) on the top side (44) of the semiconductor chip (1), wherein the contact film (5) is structured. Such an optoelectronic component (1) has a compact design and good thermal properties.

Abstract translation: 在光电子器件（1）中的至少一个实施例具有这种在载体（2）具有安装侧（20）和具有至少一个功能元件（3）。 此外，光电子器件（1）包括至少一个无基材，所述光电子半导体芯片（4），其具有一个顶部（44）和相对的底部表面（45），所述上侧（44）和底部上的半导体芯片（4）的电接触 （45）发生，并且其中朝向载体的安装侧（20）的下侧（45）（2）。 在安装侧的至少一个半导体芯片（4）（20）施加。 此外，光电子器件（1）包括至少一个电接触膜（5）上的半导体芯片（1）的上侧（44），其中，所述接触膜（5）被构造。 这样的光电子器件（1）的紧凑地构成，并且具有良好的热性能。

公开(公告)号：WO03030277A2

公开(公告)日：2003-04-10

申请号：PCT/EP0210891

申请日：2002-09-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  ONG KIAN SOO

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/20

CPC classification number: G06K19/07703 ,  H01L27/32 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5259

Abstract: A reinforcement technique used in the fabrication of displays, such as organic light emissive diode (OLED) display, is disclosed. A stiff reinforcement lid is mounted on a thin substrate to encapsulate the OLED cells. The lid serves to reinforce the thin flexible substrate and protect it from breakage. It comprises preferably of metal or other materials that have higher stiffness and ductility than the thin substrate. The fabricated display is compatible for integration into chip cards and other flexible applications.

Abstract translation: 公开了用于制造显示器的增强技术，例如有机发光二极管（OLED）显示器。 硬的加强盖安装在薄的基板上以封装OLED单元。 该盖用于加强薄的柔性基板并防止其破损。 它优选地包括具有比薄衬底更高的刚度和延展性的金属或其它材料。 制造的显示器兼容于集成到芯片卡和其他灵活的应用程序。

公开(公告)号：DE102009051746A1

公开(公告)日：2011-03-31

申请号：DE102009051746

申请日：2009-11-03

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： MUELLER KLAUS ,  HERRMANN SIEGFRIED ,  SPATH GUENTER ,  GUENTHER EWALD KARL MICHAEL ,  BRUNNER HERBERT

IPC: H01L33/50 ,  H01L31/0203 ,  H01L31/18 ,  H01S5/022

Abstract: Es wird ein optoelektronisches Bauelement angegeben, mit - einem Träger (1), der eine erste Hauptfläche (1a) aufweist, - zumindest einem substratlosen optoelektronischen Halbleiterchip (2), und - einer Kontaktmetallisierung (3a, 3b), wobei - der Träger (1) elektrisch isolierend ist, - der zumindest eine optoelektronische Halbleiterchip (2) mittels eines Verbindungsmaterials (4), insbesondere eines Lotmaterials, an der ersten Hauptfläche (1a) des Trägers (1) befestigt ist, - die Kontaktmetallisierung (3a, 3b) zumindest einen Bereich der ersten Hauptfläche (1a) bedeckt, der frei vom optoelektronischen Halbleiterchip (2) ist, und - die Kontaktmetallisierung (3a, 3b) elektrisch leitend mit dem optoelektronischen Halbleiterchip (2) verbunden ist.

公开(公告)号：DE102008046762A1

公开(公告)日：2010-03-18

申请号：DE102008046762

申请日：2008-09-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  GUENTHER EWALD KARL MICHAEL ,  WILM ALEXANDER ,  HERRMANN SIEGFRIED

IPC: G02B27/18 ,  G03B21/00 ,  H01L25/075

Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

公开(公告)号：DE102008045653A1

公开(公告)日：2010-03-04

申请号：DE102008045653

申请日：2008-09-03

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GUENTHER EWALD KARL MICHAEL ,  ZEHNDER ULRICH ,  HERRMANN SIEGFRIED ,  BRUNNER HERBERT

IPC: H01L23/38 ,  H01L31/024 ,  H01L33/00

Abstract: An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.