公开(公告)号：SE1051193A1

公开(公告)日：2010-11-12

申请号：SE1051193

申请日：2008-12-23

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  AAGREN PETER ,  SVEDIN NIKLAS ,  ERICSSON THOMAS

IPC: G02B26/08 ,  B81B7/00 ,  H01L23/522

公开(公告)号：SE532576C2

公开(公告)日：2010-02-23

申请号：SE0602717

申请日：2006-12-14

Applicant: SILEX MICROSYSTEMS AB

Inventor： KAELVESTEN EDVARD ,  EBEFORS THORBJOERN ,  CORMAN THIERRY

IPC: G01R1/073 ,  A61B5/042 ,  A61B5/151 ,  A61B5/153 ,  A61M5/158 ,  A61M25/06 ,  A61M37/00 ,  A61N1/18 ,  G01N33/483

公开(公告)号：SE0602717L

公开(公告)日：2007-06-15

申请号：SE0602717

申请日：2006-12-14

Applicant: SILEX MICROSYSTEMS AB

Inventor： KAELVESTEN EDVARD ,  EBEFORS THORBJOERN ,  CORMAN THIERRY

公开(公告)号：SE0300784L

公开(公告)日：2004-09-22

申请号：SE0300784

申请日：2003-03-21

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  SVEDIN NIKLAS ,  HUHTAOJA TOMMY ,  RANGSTEN PELLE

IPC: B81B7/00 ,  H01L21/768 ,  H01L23/48 ,  H01L21/60

Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.

公开(公告)号：SE0300784D0

公开(公告)日：2003-03-21

申请号：SE0300784

申请日：2003-03-21

Applicant: SILEX MICROSYSTEMS AB

Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  SVEDIN NIKLAS ,  HUHTAOJA TOMMY ,  RANGSTEN PELLE

IPC: B81B7/00 ,  H01L21/768 ,  H01L23/48 ,  H01L

Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.