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公开(公告)号:JPH10306212A
公开(公告)日:1998-11-17
申请号:JP5463798
申请日:1998-03-06
Applicant: TORAY INDUSTRIES
Inventor: KUMAKI JIRO , TOGAWA MITSUNARI , KATO KIMIYA
Abstract: PROBLEM TO BE SOLVED: To obtain a polyamide resin composition, having excellent rigidity and toughness together and especially excellent in high-speed planar impact fracture characteristics and having balanced and excellent characteristics of molded product surface appearance and dimensional stability. SOLUTION: This polyamide resin composition is obtained by melt kneading 100 pts.wt. of a polyamide resin with 5-150 pts.wt. of a nonfibrous inorganic filler having 0.05-10 μm average particle diameter and/or a fibrous inorganic filler having 0.05-10 μm average fiber diameter except glass fibers. The resultant composition has >=4 g/m of the polyamide component sticking to the inorganic filler based on a unit surface area measured by a BET method when dissolving the composition in hexafluoroisopropanol and recovering the inorganic filler.
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公开(公告)号:JPH09216951A
公开(公告)日:1997-08-19
申请号:JP2571096
申请日:1996-02-13
Applicant: TORAY INDUSTRIES
Inventor: TOGAWA MITSUNARI , YAMANAKA TORU , KUMAKI JIRO
IPC: C08J5/00 , B29C45/00 , B29K67/00 , B29K77/00 , B29K81/00 , B29K105/16 , B29K105/18 , B29L22/00 , B29L31/34 , C08K3/00 , C08K9/04 , C08L23/16 , C08L67/00 , C08L77/00 , C08L81/02 , C08L81/04 , C08L101/00
Abstract: PROBLEM TO BE SOLVED: To provide a housing having an excellent balance among heat resistance, rigidity and impact resistance. SOLUTION: This housing is made by molding a resin composition comprising at least three components of a thermoplastic resin (A), an inorganic filler (B) and an elastic polymer (C) having a glass transition temperature of -20 deg.C or below and being a resin composition which contains a thermoplastic resin (A) as the matrix resin, and in which at least 30% of the dispersed particles of the elastic polymer (C) in the composition are present in a state in which they and inorganic filler (B) have common interfaces.
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公开(公告)号:JPH07157640A
公开(公告)日:1995-06-20
申请号:JP30880993
申请日:1993-12-09
Applicant: TORAY INDUSTRIES
Inventor: OKITA KIYOMI , OTAWA HIDETOSHI , KUMAKI JIRO
Abstract: PURPOSE:To obtain a polyester compsn. which gives a molding excellent in pin penetration strength by melt mixing a polycyclohexanedimethylene terephthalate resin with specific flame retardants and a hindered phenol compd. or a phosphite compd. CONSTITUTION:This polyester compsn. is obtd. by melt mixing 100 pts.wt. polycyclohexanedimethylene terephthalate (PCT) resin with 1-60 pts.wt. org. bromine compd. having an average mol. wt. of 3,000 or higher, 1-50 pts.wt. antimony compd., and 0.05-5 pts.wt. component comprising a hindered phenol compd. and/or a phosphite compd. having a mol.wt. of 500 or higher. The resin pref. has 80mol% or higher repeating units formed from terephthalic acid and 1,4-cyclohexanedimethanol; a brominated phenoxy compd. is a pref. example of the bromine compd.; and the hindered phenol compd. and the phosphite compd. are pref. used in a ratio of the former compd. to the latter of (1:3) to (3:1). The compsn. may further contain a glass filler surface-treated with an aminosilane and an alkoxysilane to increase pin penetration strength.
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公开(公告)号:JPH0616914A
公开(公告)日:1994-01-25
申请号:JP17316992
申请日:1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor: KUMAKI JIRO , OKITA KIYOMI , OTAWA HIDETOSHI
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公开(公告)号:JPH0616912A
公开(公告)日:1994-01-25
申请号:JP17319292
申请日:1992-06-30
Applicant: TORAY INDUSTRIES , EASTMAN KODAK CO
Inventor: OKITA KIYOMI , OTAWA HIDETOSHI , KUMAKI JIRO
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公开(公告)号:JPH051217A
公开(公告)日:1993-01-08
申请号:JP15710591
申请日:1991-06-27
Applicant: TORAY INDUSTRIES
Inventor: HAYASHI RYOJI , KUMAKI JIRO , KUWATA JOSHIN
Abstract: PURPOSE:To obtain a polyester composition which has a high crystallization rate and excellent moldability in a low-temperature mold and can give a molding excellent in mechanical properties, etc., by mixing a specified thermoplastic polyester with a nucleator and a specified polycarbonate. CONSTITUTION:This composition is prepared by mixing 100 pts.wt. thermoplastic polyester comprising an 8-20C aromatic dicarboxylic acid (lower alkyl ester) (e.g. dimethyl terephthalate) and a 2-20C diol (e.g. ethylene glycol) with 0.005-20 pts.wt. nucleator (e.g. sodium p-phenolsulfonate) and 0.5-30 pts.wt. polycarbonate of the formula (wherein R is at least one group selected between a 2-20C aliphatic hydrocarbon group and a 6-14C alicyclic hydrocarbon group).
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公开(公告)号:JPH04348154A
公开(公告)日:1992-12-03
申请号:JP12146791
申请日:1991-05-27
Applicant: TORAY INDUSTRIES
Inventor: INOUE SHUNEI , OKITA KIYOMI , KUMAKI JIRO
IPC: C08G63/183 , C08G59/00 , C08G63/181 , C08G63/199 , C08J5/00 , C08K5/1515 , C08L63/00 , C08L67/00 , C08L67/02
Abstract: PURPOSE:To obtain a polyester resin composition useful as an engineering plastics, having excellent weld strength, heat resistance and moldability. CONSTITUTION:100 pts.wt. total amount of (A) 1-99wt.%, preferably 20-80wt.% thermotropic liquid crystal polyester preferably comprising structural units shown by formula I, formula II and formula III or formula I, formula II, formula III and formula IV [R1 is group shown by formula V to formula VIII, etc.; R2 is group shown by formula V to formula VII or formula IX (X is H or Cl), etc.] and (B) 99-1wt.%, preferably 8-20wt.% polycyclohexanedimethylene terephthalate-based polyester having a cis/trans ratio (molar ratio) of 60/40-10/90, a ratio of cis structure and trans structure of cyclohexane ring, is blended with (C) 0.01-20 pts.wt., preferably 0.1-2 pts.wt. epoxy compound.
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公开(公告)号:JPH02292357A
公开(公告)日:1990-12-03
申请号:JP11390289
申请日:1989-05-06
Applicant: TORAY INDUSTRIES
Inventor: KUMAKI JIRO , NAKAMURA SEIICHI , YONETANI KIICHI
IPC: C08K5/3492 , C08L67/00 , C08L67/02
Abstract: PURPOSE:To improve crystallization speed, moldability in a mold at low temp., resistance to hydrolysis, mechanical properties of a cured product, etc., by incorporating a specified amt. of a metal salt of a phenol with a benzotriazole group in a thermoplastic polyester. CONSTITUTION:A thermoplastic polyester resin compsn. is prepd. by incorporating 0.005 to 10 pts.wt. metal salt of a phenol with a benzotriazole group (A) in 100 pts.wt. thermoplastic polyester (B) (e.g. polybutylene terephthalate). As pref. practical examples of the component A, sodium salts, etc., of compd. of formulas I, II, III, etc., are cited. As the obtd. polyester resin compsn. is incorporated with the component A as a crystallization accelerator, the crystallization speed is large and the moldability is excellent when a mold at low temp. is used. In addition, little decrease in mol.wt. occurs in molding and the molded item exhibits good mechanical properties and is suitably used as automotive parts, etc.
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公开(公告)号:JP2003260721A
公开(公告)日:2003-09-16
申请号:JP2002061692
申请日:2002-03-07
Applicant: TORAY INDUSTRIES
Inventor: UTAZAKI KENICHI , KUMAKI JIRO
Abstract: PROBLEM TO BE SOLVED: To provide a polyamide multilayer injection molding whose sound insulation property is improved while properties inherent in a polyamide resin is maintained and which is usable for applications for components around engines of automobiles, motorcycles, equipment for marine vessels, agricultural equipment, equipment for civil engineering and construction. SOLUTION: This polyamide multilayer injection molding has a structure including a skin layer (A) and a core layer (B). The skin layer is formed of a composition in which 99 to 40 wt.% of a polyamide (A1) is compounded in 1 to 60 wt.% of a reinforcing filler (A2). The core layer is formed of a composition in which 100 to 40 wt.% of a thermoplastic elastomer (B1) is compounded in 0 to 60 wt.% of a reinforcing filler (B2). The multilayer injection molding is prepared by simultaneous injection of the skin layer (A) and the core layer (B). COPYRIGHT: (C)2003,JPO
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公开(公告)号:JP2003113298A
公开(公告)日:2003-04-18
申请号:JP2002222594
申请日:2002-07-31
Applicant: TORAY INDUSTRIES
Inventor: OOME HIROKAZU , KUMAZAWA SADANORI , KUMAKI JIRO
IPC: C08J5/18 , C08L67/04 , C08L101/16
Abstract: PROBLEM TO BE SOLVED: To provide a resin composition excellent in moldability, processability, mechanical properties, heat resistance and transparency. SOLUTION: This resin composition is obtained by compounding polylactic resin and polyacetal resin at a specified ratio, wherein the resin composition is a compatible compound of polylactic resin with the polyacetal resin, has
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