Abstract:
The field emission type cathode is made as a multilayered structure (33) in which conductive platelike corpuscles (30) are piled, whereby an edge portion of end surface of a field emission type cathode for emitting electrons is formed sharply and easily.
Abstract:
A process for fabricating, in a planar substrate, a hermetically sealed chamber for a field-emission cell or the like, allows operating the device in a vacuum or a low pressure inert gas. The process includes methods of covering an opening (160), enclosing the vacuum or gas, and methods of including an optional quantity of gettering material. An example of a device using such a hermetically sealed chamber is a lateral-emitter field-emission device (10) having a lateral emitter (100) parallel to a substrate (20) and having a simplified anode structure (70). In one simple embodiment, a control electrode (140) is positioned in a plane above the emitter edge (110) and automatically aligned to that edge. The simplified devices are specially adapted for field emission display arrays. An overall fabrication process uses steps (S1-S18) to produce the devices and arrays. Various embodiments of the fabrication process allow the use of conductive or insulating substrates (20), allow fabrication of devices having various functions and complexity, and allow covering a trench opening (160) etched through the emitter and insulator, thus enclosing the hermetically sealed chamber.
Abstract:
A Reflective Field Emission Display system, components and methods for fabricating the components is disclosed. In the FED system disclosed, a plurality of reflective edge emission pixed elements (10) are arranged in a matrix of N rows and M columns, the pixel elements contain an edge emitter (140) that is operable to emit electrons and a reflector (110) that is operable to extract and laterally reflect emitted electrons. A collector layer (310), laterally disposed from said reflector layer (110) is operable to attract the reflected electrons. Deposited on the collector layer (310) is a phosphor layer (195) that emits a photon of a known wavelength when activated by an attracted electron. A transparent layer (185) that is oppositely positioned with respect to the pixel elements (100) is operable to attract reflected electrons and prevent reflected electrons from striking the phosphor layer (195). Color displays are further contemplated by incorporating individually controlled sub-pixel elements in each of the pixel elements (100). The phosphor layers (195) emit photons having wavelenghts in the red, green or blue color spectrum.
Abstract:
A cathode structure for use in field emission display (FED) devices includes four layers. A first layer consists of conducting lines (14) supported on an insulating substrate. A second layer consists of thin non-conducting lines (18) crossing the conducting lines (14). A third layer consists of a thick layer (22) of non-conducting material with holes centered between the thin non-conducting lines (18) of the second layer and extending over a portion (38) of the thin non-conducting lines (18). A fourth layer consists of conducting lines (30) containing holes (34) of the same dimension as and aligned with the holes in the third layer exposing portions of the conducting lines (14) of the first layer and of the non-conducting lines (18) of the second layer. Emissive material is deposited on the exposed portions of the conducting lines (14) of the first layer to produce a cathode for an FED device. The four-layer cathode structure improves emission characteristics such as current density and uniformity for planar edge emitters and surface emitters.
Abstract:
A lateral-emitter field emission device (10) has a gate (60) that is separated by an insulating layer (80) from a vaccum- or gas-filled microchamber environment (20) containing other elements of the device (10). For example, the gate (60) may be disposed external to the microchamber (20). The insulating layer (80) is disposed such that there is no vaccum- or gas-filled path to the gate for electrons that are emitted from a lateral emitter (40, 100). The insulating layer (70, 80) disposed between the emitter and the gate preferably comprises a material having a dielectric constant greater than one. The insulating layer also preferably has a low secondary electron yield over the device's operative range of electron energies. For display applications, the insulating layer is preferably transparent. Emitted electrons are confined to the microchamber (20) containing their emitter (100). Thus, the gate current component of the emitter current consists of displacement current only. This displacement current is a result of any change in potential of the gate relative to other elements such as, for example, relative to the emitter. Direct electron current from the emitter to the gate is prevented. An array of the devices comprises an array of microchambers, so that electron current from each emitter (100) can reach only the anode (50, 55) in the same microchamber, even for diode devices lacking a gate electrode (60). A fabrication process (S1-S28) is specially adapted for fabricating the device and arrays of such devices.
Abstract:
A lateral-emitter electron field-emission display device structure (10) incorporates a thin-film emitter (100) having an emitting edge (110) in direct contact with a non-conducting or very high resistivity phosphor (75), thereby eliminating a gap between the emitter and the phosphor. Such a gap has been a part of all field-emission display devices in the prior art. The ultra-thin-film lateral emitter (100) of the structure is deposited in a plane parallel to the device's substrate (20) and has an inherently small radius of curvature at its emitting edge, which may extend into phosphor (75). A fabrication process specially adapted to make the structure includes a directional trench etch (S15), which both defines the emitting edge and provides an opening (160) to receive a non-conducting phosphor (75). This phosphor covers an anode (70) and is automatically aligned in contact with the emitter edge (110). When an electrical bias voltage is applied between the emitter and anode, electrons are injected directly into the phosphor material from the emitter edge, exciting cathodoluminescence in the phosphor to emit light which is visible in a wide range of viewing angles. With minor variations in the fabrication process, a lateral-emitter electron field emission display device may be made with an extremely small emitter-phosphor gap, having a width less than 100 times the thickness of the ultra-thin emitter (100) or preferably zero gap width. Triode or tetrode embodiments include control electrodes (140).
Abstract:
An electron beam apparatus is provided having an electron emitting device which has a simple configuration, exhibits high electron emission efficiency, operates stably, and in which emitted electrons are effectively converged. The electron beam apparatus includes: an insulator having a notch on its surface; a gate positioned on the surface of the insulator; at least one cathode having a protruding portion protruding from an edge of the notch toward the gate, and positioned on the surface of the insulator so that the protruding portion is opposed to the gate; and an anode arranged to be opposed to the protruding portion via the gate, wherein the gate is formed on the surface of the insulator so that at least a part of a region opposed to the cathode is projected outward and recessed portions are provided in which ends of the gate are recessed and interpose the projected region.
Abstract:
The following method is provided: a method of readily fabricating an electron-emitting device (10), coated with a low-work function material, having good electron-emitting properties with high reproducibility. Differences in electron-emitting properties between electron-emitting devices each fabricated by the method are reduced. Before a structure (3) is coated with the low-work function material, a metal oxide layer (4) is formed on the structure (3).
Abstract:
A field emission display has an element including a first electrode (4), and a second electrode (2) laminated to the first electrode (4) through an insulating layer (3). The first electrode (4) has an opening (7); the second electrode (2) has a hole (9) of a planar shape corresponding to that of the opening (7) at a position matched with the opening (7); and the insulating layer (3) has a through-hole (8) continuous to the opening (7) and the hole (9). An upper edge portion of the hole (9) is formed into a cross-sectional shape having an edge angle in a range of 80 to 100°, and at least part of the upper edge portion of the hole (9) is exposed in the through-hole (8). In this element, electrons are emitted from the second electrode (2) through the upper edge portion of the hole (9) exposed in the through-hole (8) by applying a specific voltage between the first electrode (4) and the second electrode (2). With this configuration, a distance between the gate electrode (4) and a field emission portion of the cathode electrode (2) can be accurately controlled with a simple structure. To enhance an emission efficiency of electrons, a second gate electrode (16) may be provided on the lower side of the cathode electrode (2) through an insulating layer (17).
Abstract:
A lateral field-emission device (10) has a lateral emitter (100) substantially parallel to a substrate (20) and has a simplified anode structure (70). The anode's top surface is precisely spaced apart from the plane of the lateral emitter and receives electrons emitted by field emission from the edge of the lateral emitter cathode, when a suitable bias voltage is applied. The device may be configured as a diode, or as a triode, tetrode, etc. having control electrodes (140) positioned to allow control of current from the emitter to the anode by an electrical signal applied to the control electrode.