Abstract:
In a field emission electron source (10), a strong field drift layer (6) and a surface electrode (7) composed of a thin metal film are arranged on an n-type silicon substrate (1). On the back surface of the n-type silicon substrate (1), an ohmic electrode (2) is arranged. DC voltage is applied so that the surface electrode (7) has a positive potential with respect to the ohmic electrode (2). Thus, electrons injected from the ohmic electrode (2) via the n-type silicon substrate (1) to the strong field drift layer (6) drift in the strong field drift layer (6) and are emitted outside via the surface electrode (7). The strong field drift layer (6) includes a plenty of fine semiconductor crystals (63) of nanometer order formed in a part of the semiconductor layer constituting the strong field drift layer (6) and a plenty of insulation films (64) formed on the surface of the fine semiconductor crystals (63) and having a film thickness generating the electron tunneling phenomenon.
Abstract:
An electron emission element (10A) includes an emitter (12) formed by a dielectric body, an upper electrode (14) and a lower electrode (16) to which a drive voltage Va for emitting electrons is applied. The upper electrode (14) is formed by scale-shaped conductive particles on the upper surface (12a) of the emitter (12) and has a plurality of openings (20). The portion of the upper electrode (14) opposing to the emitter (12) in the circumferential portion (26) of the openings (20) is apart from the emitter (12). Moreover, a circumferential portion (26) of the openings (20) has an acute angle shape, in a cross sectional view, toward the inner brim (26b) of the openings (20) as the tip end of the circumferential portion (26), i.e., a shape in which electric lines of force are concentrated. With the aforementioned configuration, it is possible to increase the electron emission amount as compared to the conventional electron emission element.
Abstract:
An electron emission element in which electron emission efficiency is enhanced while protecting the element against damage. The electron emission element comprises an amorphous electron supply layer (4), an insulator layer (5) formed on the electron supply layer (4), and an upper electrode (6) formed on the insulator layer (5), and emits electrons when an electric field is applied between the electron supply layer (4) and the upper electrode (6). The electron emission element has a recess (7), which is formed by cutting the upper electrode (6) and the insulator layer (5) to expose the electron supply layer (4), and a carbon layer (8) covering the upper electrode (6) and the recess (7) excepting the inside portion (4b) of the exposed surface (4a) of the electron supply layer (4) while being in contact with the edge portion (4c) thereof.
Abstract:
A field emission source (10) comprises a p-type silicon substrate (1), an n-type region (8) formed into stripes in a major surface of the substrate (1), strong-field drift layers (6) which are formed on the n-type region (8) in which electrons injected from the n-type region (8) drift, and which are made of oxidized porous polysilicon, a polysilicon layer (3) formed between the strong field drift layers (6), surface electrodes (7) formed into stripes in a direction perpendicular to the stripes of the n-type region (8). A voltage is selectively applied to either the n-type region (8) or the surface electrodes (7) so as to emit electrons from predetermined areas of the surface electrodes (7).
Abstract:
Metal-insulator-metal planar electron emitters (PEES) have potential for use in advanced lithography for future generations of semiconductor devices. The PEE has, however, a limited lifetime, which restricts its commercial applicability. It is believed that the limited lifetime of the PEE is limited by in-diffusion of metal ions from the anode. The in-diffusion may be countered in a number of different ways. One way is to cool the PEE to temperatures below room temperature. This lowers the metal ion mobility, and so the metal ions are less likely to diffuse into the insulator layer. Another way is to occasionally reverse the electrical potential across the PEE from the polarity used to generate the electron beam. This counteracts the electrical driving force that drives the positively charged metal ions from the PEE anode to the PEE cathode.