Abstract:
A method for nanoprobing a device structure (82) of an integrated circuit includes scanning a primary charged particle beam (25) across a first region of the device structure with at least one probe (24a, 26a, 28a, 30a) proximate to the first region and a second region (91) of the device structure is masked from the primary charged particle beam. The method further includes collecting secondary electrons (35) emitted from the first region of the device structure and the at least one probe to form a secondary electron image (94). The secondary electron image includes the first region and the at least one probe as imaged portions and the second region as a non-imaged portion. Alternatively, the second region may be scanned by the charged particle beam at a faster scan rate than the first region so that the second region is also an imaged portion of the secondary electron image.
Abstract:
An analyzer module of an ion implanter includes beam deflection apparatus adjacent to a resolving opening from which a terminal ion beam portion of an ion beam emanates. In response to a beam deflection voltage of a first value of substantially zero volts in a first operating condition, the beam deflection apparatus directs a source ion beam portion of the ion beam toward the resolving opening to generate the terminal ion beam portion. When the beam deflection voltage has a high second value in a second operating condition, the beam deflection apparatus directs the species of the source ion beam portion away from the resolving opening such that the terminal ion beam portion is substantially extinguished. Beam control circuitry is operative during the second operating condition to transition the ion implanter to the first operating condition by rapidly switching the beam deflection voltage from the second value to the first value. An implantation method employs the features of the implanter to recover from glitches during implantation and thereby improve the yield of implanted wafers.
Abstract:
An electron beam detection apparatus includes a first aperture element including a first set of apertures. The apparatus includes a second aperture element including a second set of apertures. The second set of apertures is arranged in a pattern corresponding with the pattern of the first plurality of apertures. The detection apparatus includes an electron-photon conversion element configured to receive electrons of the electron beam transmitted through the first and second aperture elements. The electron-photon conversion element is configured to generate photons in response to the received electrons. The detection apparatus includes an optical assembly including one or more optical elements. The detection apparatus includes a detector assembly. The optical elements of the optical assembly are configured to direct the generated photons from the electron-photon conversion system to the detector assembly.
Abstract:
The present invention relates to a plasma electron source apparatus (150). The apparatus comprises a cathode discharge chamber (100) in which a plasma is generated, an exit hole (120) provided in the cathode discharge chamber from which electrons from the plasma (107) are extracted by an accelerating field provided between the cathode discharge chamber (100) and an anode (104), at least one plasma confinement device (e.g. an electromagnetic coil 103), and a switching mechanism (190) for switching the at least one plasma confinement device between a first value allowing for electron extraction from the plasma and a second value prohibiting electron extraction from the plasma. Associated methods are also provided, in particular use of the apparatus (150) for forming a three dimensional article through successive fusion of parts of at least one layer of a powder bed provided on a work table.
Abstract:
An apparatus (10) for use with an electron beam (30) for imaging a sample (26). The apparatus has a down-conversion detector (14) configured to detect an electron microscopy signal (32) generated by the electron beam incident on the sample, a direct bombardment detector (16) adjacent to the down-conversion detector and configured to detect the electron microscopy signal, and a mechanism (18) selectively exposing the down-conversion detector and the direct bombardment detector to the electron microscopy signal. A method using the apparatus is also provided.
Abstract:
The invention provides methods for conjugate blanking of a charged particle beam within a charged particle column using a beam blanker. The beam blanker comprises a first deflector, a second deflector and a blanking aperture, the first deflector being positioned between a gun lens and a main lens, the second deflector being positioned between the first deflector and the main lens, the blanking aperture being positioned between the second deflector and the main lens, and the first deflector, the second deflector and the blanking aperture being aligned on the optical axis of the column. A method according to the invention comprises the steps of: configuring electron optical elements of said charged particle column to form a beam in the column either with or without a crossover; configuring the main lens to focus the beam formed by the gun lens onto a substrate plane; deflecting the beam with a first deflector in a first direction; and deflecting the beam with a second deflector in a second direction onto the blanking aperture, wherein the first direction is parallel or anti-parallel to the second direction; and wherein the image at the substrate plane does not move during blanking.
Abstract:
An analyzer module of an ion implanter includes beam deflection apparatus adjacent to a resolving opening from which a terminal ion beam portion of an ion beam emanates. In response to a beam deflection voltage of a first value of substantially zero volts in a first operating condition, the beam deflection apparatus directs a source ion beam portion of the ion beam toward the resolving opening to generate the terminal ion beam portion. When the beam deflection voltage has a high second value in a second operating condition, the beam deflection apparatus directs the species of the source ion beam portion away from the resolving opening such that the terminal ion beam portion is substantially extinguished. Beam control circuitry is operative during the second operating condition to transition the ion implanter to the first operating condition by rapidly switching the beam deflection voltage from the second value to the first value. An implantation method employs the features of the implanter to recover from glitches during implantation and thereby improve the yield of implanted wafers.
Abstract:
The invention relates to a method for performing charged particle beam proximity effect correction, comprising the steps of: receiving a digital layout pattern to be patterned onto a target using one or more charged particle beams; selecting a base proximity function comprising a sum of an alpha and a beta proximity function, wherein said alpha proximity function models a short range proximity effect and said beta proximity function models a long range proximity effect, wherein a constant η is defined as a ratio between the beta proximity function and the alpha proximity function in said sum, with 0
Abstract:
An apparatus for use with an electron beam for imaging a sample. The apparatus has a down-conversion detector configured to detect an electron microscopy signal generated by the electron beam incident on the sample, a direct bombardment detector adjacent to the down-conversion detector and configured to detect the electron microscopy signal, and a mechanism selectively exposing the down-conversion detector and the direct bombardment detector to the electron microscopy signal. A method using the apparatus is also provided.