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    FORMING OF HTC DENDRITIC FILLERS
    47.
    发明申请
    FORMING OF HTC DENDRITIC FILLERS 审中-公开
    形成HTC渗透填料

    公开(公告)号：WO2007114874A1

    公开(公告)日：2007-10-11

    申请号：PCT/US2007/000087

    申请日：2007-01-03

    Applicant: SIEMENS POWER GENERATION, INC. ,  SMITH, James D.B. ,  STEVENS, Gary ,  WOOD, John W.

    Inventor： SMITH, James D.B. ,  STEVENS, Gary ,  WOOD, John W.

    IPC: C08K3/00 ,  C08K9/00

    CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

    Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

    Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，其包括将HTC种子42加入到主体树脂基质中。 HTC种子已经被表面官能化以基本上不相互反应。 然后，种子积聚HTC构件块42，并且HTC构建块也被表面功能化以基本上不相互反应。 然后将HTC构建块与HTC种子组装，以在主体树脂基质内产生HTC树枝状填料40。

    PRINTABLE COMPOSITIONS HAVING ANISOMETRIC NANOSTRUCTURES FOR USE IN PRINTED ELECTRONICS
    48.
    发明申请
    PRINTABLE COMPOSITIONS HAVING ANISOMETRIC NANOSTRUCTURES FOR USE IN PRINTED ELECTRONICS 审中-公开
    具有用于印刷电子产品的非均质纳米结构的可印刷组合物

    公开(公告)号：WO2005047007A2

    公开(公告)日：2005-05-26

    申请号：PCT/US2004/030763

    申请日：2004-09-17

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. ,  PAN, Alfred I-Tsung ,  JEON, Yoocharn ,  HAUBRICK, Scott

    Inventor： PAN, Alfred I-Tsung ,  JEON, Yoocharn ,  HAUBRICK, Scott

    IPC: B41M5/00

    CPC classification number: H05K1/097 ,  B41M1/06 ,  B41M1/10 ,  B41M1/12 ,  B41M3/006 ,  B82Y30/00 ,  C09D11/30 ,  H01L29/7869 ,  H05K2201/0248 ,  Y10S977/786 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T428/24893

    Abstract: Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can have an aspect ration of at least about 5:1 within the liquid carrier. Examples of nanostructures include nanobelts, nanoplates, nanodiscs, nanowires, nanorods, and mixtures of these materials. These printable compositions can be used to form a conductive path on a substrate. The printable composition can be applied to a substrate using any number of conventional printing techniques. Following application of the printable composition at least a portion of the liquid carrier can be removed such that the nanostructures can be in sufficient contract to provide a conductive path. The nanostructures arranged in a conductive path can be sintered opr used as a conductive material without sintering.

    Abstract translation: 用于制备导电路径的组合物和方法可以包括可印刷组合物，其包括液体载体和多个纳米结构。 多个纳米结构可以在液体载体内具有至少约5:1的纵横比。 纳米结构的实例包括纳米带，纳米板，纳米棒，纳米线，纳米棒以及这些材料的混合物。 这些可印刷组合物可用于在基材上形成导电路径。 可印刷组合物可以使用任何数量的常规印刷技术施加到基材上。 在施加可印刷组合物之后，可以除去液体载体的至少一部分，使得纳米结构可以处于足够的收缩状态以提供导电路径。 布置在导电路径中的纳米结构可以烧结用作导电材料而不烧结。

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