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    Method for producing laminate board containing uniformly distributed filler particles
    42.
    发明授权
    Method for producing laminate board containing uniformly distributed filler particles 失效
    含有均匀分布的填料颗粒的层压板的制造方法

    公开(公告)号：US4661301A

    公开(公告)日：1987-04-28

    申请号：US765476

    申请日：1985-08-14

    Applicant: Reisuke Okada ,  Hisami Fujino

    Inventor： Reisuke Okada ,  Hisami Fujino

    IPC: B32B27/12 ,  H05K1/03 ,  B29C47/34

    CPC classification number: H05K1/0373 ,  B32B27/12 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0254 ,  Y10S264/06 ,  Y10T29/49126 ,  Y10T29/49158

    Abstract: A process for continuously molding a plate for an electrical printed circuit board wherein a resin containing uniformly distributed hollow microspheres having a specific gravity different from that of the resin is extruded into a vertically disposed moving double belt press maintained at a temperature which allows the extruded plate to harden almost completely. The plate exists the vertically disposed press maintaining a flexibility sufficient to be passed around a roller into a horizonal position where subsequent processing steps may be applied, such as lamination of reinforcing fiber and coating with a conductive material.

    Abstract translation: 一种用于连续模制用于电气印刷电路板的板的方法，其中将具有不同于树脂的比重的均匀分布的中空微球的树脂挤出成垂直布置的移动双带压机，保持在允许挤出板 几乎完全硬化。 该板存在垂直设置的压力机，保持足够的柔性以使辊子绕过水平位置，其中可以应用后续的加工步骤，例如增强纤维的层压和导电材料的涂层。

    WIRING SUBSTRATE
    43.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240206061A1

    公开(公告)日：2024-06-20

    申请号：US18537877

    申请日：2023-12-13

    Applicant: IBIDEN CO., LTD.

    Inventor： Ryo ANDO ,  Nobuhisa KURODA ,  Shogo FUKUI ,  Kosei ICHIKAWA ,  Makoto KATO

    IPC: H05K1/03 ,  H05K1/02

    CPC classification number: H05K1/0373 ,  H05K1/0298 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0269

    Abstract: A wiring substrate includes an insulating layer including a first layer and a second layer, and a conductor layer including a metal film formed on a surface of the second layer of the insulating layer such that the conductor layer includes a conductor pattern. The first layer includes resin and first inorganic particles, the second layer includes resin and second inorganic particles at the content rate that is lower than the content rate of the first inorganic particles in the first layer, and the thickness of the first layer is 90% or more of the thickness of the insulating layer. The second layer of the insulating layer includes a composite layer having the thickness in the range of 0.1 to 0.3 μm, and the composite layer includes part of the metal film in the conductor layer formed in gaps between the second inorganic particles and resin in the second layer.

    Reducing dielectric loss in solder masks
    44.
    发明授权
    Reducing dielectric loss in solder masks 有权
    降低焊料掩模中的介电损耗

    公开(公告)号：US09526180B2

    公开(公告)日：2016-12-20

    申请号：US13995667

    申请日：2011-12-09

    Applicant: Dennis J. Miller

    Inventor： Dennis J. Miller

    IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  B01F3/12

    CPC classification number: H05K3/0076 ,  B01F3/12 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0254

    Abstract: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.

    Abstract translation: 电路板可以包括衬底，与衬底相关联的互连结构，以及与互连结构和衬底相关联的焊接掩模。 焊接掩模可以基于包括环氧树脂和粉末的混合物。 粉末可以是中空玻璃微球。

    Polymerizable composition
    48.
    发明授权
    Polymerizable composition 有权
    可聚合组合物

    公开(公告)号：US07964685B2

    公开(公告)日：2011-06-21

    申请号：US12521502

    申请日：2007-12-27

    Applicant: Akihiko Yoshiwara ,  Junji Kodemura

    Inventor： Akihiko Yoshiwara ,  Junji Kodemura

    IPC: C08G61/08 ,  C08F2/02 ,  C08F4/70 ,  C08F36/00 ,  B32B15/08

    CPC classification number: C08L65/00 ,  C08G61/08 ,  C08G2261/418 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/36 ,  C08K7/26 ,  H01B3/448 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0254

    Abstract: A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.

    Abstract translation: 通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。 通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。 通过使交联性树脂复合体交联而得到交联树脂复合体。

    Inorganic hollow particle, process for producing the same, and composition containing the same
    49.
    发明授权
    Inorganic hollow particle, process for producing the same, and composition containing the same 有权
    无机中空颗粒，其制造方法和含有它们的组合物

    公开(公告)号：US07816428B2

    公开(公告)日：2010-10-19

    申请号：US12278156

    申请日：2007-04-24

    Applicant: Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

    Inventor： Shuji Sasaki ,  Yasuhisa Nishi ,  Shinji Yamano ,  Mitsuyoshi Iwasa

    IPC: C08J9/32

    CPC classification number: C01B33/18 ,  C01B13/322 ,  C01P2004/32 ,  C01P2004/34 ,  C01P2006/12 ,  C03C11/002 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/2982

    Abstract: The present invention herein provides fine inorganic hollow powder having a high hollowness rate, which can be incorporated into, for instance, a low dielectric rubber or resin composition. The inorganic hollow powder has an average hollowness rate of higher than 70% by volume and an average particle size ranging from 3 to 20 μm and the powder preferably has an average hollowness rate ranging from 75 to 85% by volume, an average particle size ranging from 5 to 15 μm, a maximum particle size of not more than 25 μm, a specific surface area of not more than 10 m2/g, an average sphericity degree of not less than 0.90 and a purity of not less than 99% by mass. The inorganic hollow powder can be prepared by a method comprising the steps of forming a flame using a burner provided with at least a triplet-tubular portion comprising, in order from the outermost side, a combustion-improving gas-supply pipe, a combustible gas-supply pipe and an inorganic raw powder-supply pipe assembled together; injecting, into the flame at a high discharge speed, inorganic raw powder having a specific particle size through the inorganic raw powder-supply pipe, while the powder is entrained with a carrier gas having a specific relative humidity, to thus subject the powder to a heat-treatment.

    Abstract translation: 本发明提供具有高中空率的细小的无机中空粉末，其可以结合到例如低介电橡胶或树脂组合物中。 无机中空粉末的平均中空率高于70体积％，平均粒径为3〜20μm，粉末的平均中空率优选为75〜85体积％，平均粒径为 5〜15μm，最大粒径为25μm以下，比表面积为10m 2 / g以下，平均球形度为0.90以上，纯度为99质量％以上 。 无机中空粉末可以通过以下方法制备：使用设置有至少三重管状部分的燃烧器形成火焰的步骤，其包括从最外侧开始的燃烧改善气体供给管，可燃气体 供应管和无机原料粉供应管组装在一起; 通过无机原料粉供给管以高放电速度向火焰喷射具有特定粒径的无机原料粉末，同时将粉末夹在具有特定相对湿度的载气中，从而将粉末置于 热处理。

    Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
    50.
    发明授权
    Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof 失效
    低介电损耗角正切树脂组合物，固化膜和固化产物，使用其的电气部件及其制造方法

    公开(公告)号：US06756441B2

    公开(公告)日：2004-06-29

    申请号：US09951414

    申请日：2001-09-14

    Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

    Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Takao Miwa

    IPC: C08L900

    CPC classification number: C08K5/01 ,  C08F212/14 ,  C08F212/32 ,  C08F257/02 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0254 ,  C08L65/00 ,  C08F236/02

    Abstract: According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], wherein R is a hydrocarbon skeleton which may have a substituent, R1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

    Abstract translation: 根据本发明，提供一种低介电损耗角正切树脂组合物，其含有重均分子量不大于1000的交联组分和多个苯乙烯基团并由式[1]表示，其中R为 可以具有取代基的烃骨架，R 1是氢，甲基或乙基，m是1-4的整数，n是2以上的整数，并且还含有至少一种选自具有 重均分子量为5000以上的填料，该树脂组合物可以得到具有良好柔软性，高拉伸强度，低介电常数和介电损耗角正切的固化物。

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