公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US20170243049A1

公开(公告)日：2017-08-24

申请号：US15477084

申请日：2017-04-01

Applicant: SHENZHEN HUIDING TECHNOLOGY CO., LTD.

Inventor： Haoxiang DONG

IPC: G06K9/00 ,  A61B5/00 ,  H05K3/28 ,  H01L27/146 ,  H01L31/18 ,  H01L23/31 ,  H01L23/00 ,  H01L31/0203 ,  H05K3/06

CPC classification number: G06K9/00053 ,  A61B5/02416 ,  A61B5/0531 ,  A61B5/1172 ,  A61B5/14551 ,  A61B2562/04 ,  A61B2562/12 ,  A61B2562/166 ,  A61B2562/242 ,  A61B2562/247 ,  G06K9/0002 ,  G06K9/00114 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/18 ,  H01L2924/15 ,  H05K3/067 ,  H05K3/284 ,  H05K2201/09818

Abstract: A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.

公开(公告)号：US09699919B2

公开(公告)日：2017-07-04

申请号：US15041104

申请日：2016-02-11

Applicant: Yazaki Corporation

Inventor： Akemi Maebashi ,  Pharima Akanitsuk

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/09818 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.

公开(公告)号：US20160366764A1

公开(公告)日：2016-12-15

申请号：US14750656

申请日：2015-06-25

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： BO PENG

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/181 ,  H05K2201/09818 ,  H05K2201/10015 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A circuit board includes a circuit board body, a first capacitor, and a second capacitor. The circuit board body includes a first side portion and a second side portion. The first capacitor and the second capacitor are surrounded by an electronic field. The first capacitor is mounted in the first side portion. The second capacitor is mounted in the second side portion. The first capacitor is configured to generate a first force. The first force is configured to be exerted on the first side portion. The first force is in a first direction. The second capacitor is configured to generate a second force when the first capacitor generates the first force. The second force is configured to be exerted on the second side portion. The second force is in a second direction. The first direction is opposite to the second direction.

Abstract translation: 电路板包括电路板主体，第一电容器和第二电容器。 电路板主体包括第一侧部和第二侧部。 第一电容器和第二电容器被电子场包围。 第一电容器安装在第一侧部分中。 第二电容器安装在第二侧部分中。 第一电容器被配置成产生第一力。 第一力构造成施加在第一侧部上。 第一个力量在第一个方向。 第二电容器被配置为当第一电容器产生第一力时产生第二力。 第二力构造成施加在第二侧部上。 第二个力是第二个方向。 第一方向与第二方向相反。

公开(公告)号：US20150359103A1

公开(公告)日：2015-12-10

申请号：US14759459

申请日：2013-02-08

Applicant: FUJIKURA LTD.

Inventor： Yoshinori SANO ,  Masahiro OKAMOTO

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/145 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/186 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/4697 ,  H05K2201/09818 ,  H05K2203/061

Abstract: Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.

Abstract translation: 提供了一种部件嵌入式板，其包括：第一板，包括第一绝缘层，形成在第一绝缘层的第二面上的第一导电层和穿过第一绝缘层的层间导电部分，以连接到第一绝缘层 导电层，并从第一绝缘层的第一面突出; 连接到所述层间导电部的电气部件; 以及第二基板，包括具有结合有电气部件的开口部的第二绝缘层，以及形成在第二绝缘层的第一面和第二面的至少任一个上的第二导电层。 第二导电层包括框架部分。 开口部形成为在其整体的框部的内部区域的厚度方向上贯通第二绝缘层。

公开(公告)号：US09934419B2

公开(公告)日：2018-04-03

申请号：US15477084

申请日：2017-04-01

Applicant: Shenzhen Goodix Technology Co., Ltd.

Inventor： Haoxiang Dong

IPC: H05K7/00 ,  G06K9/00 ,  H01L31/0203 ,  H05K3/28 ,  H05K3/06 ,  H01L31/18 ,  H01L27/146 ,  A61B5/024 ,  A61B5/053 ,  A61B5/1455 ,  A61B5/1172

CPC classification number: G06K9/00053 ,  A61B5/02416 ,  A61B5/0531 ,  A61B5/1172 ,  A61B5/14551 ,  A61B2562/04 ,  A61B2562/12 ,  A61B2562/166 ,  A61B2562/242 ,  A61B2562/247 ,  G06K9/0002 ,  G06K9/00114 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/18 ,  H01L2924/15 ,  H05K3/067 ,  H05K3/284 ,  H05K2201/09818

Abstract: A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.

公开(公告)号：US09674950B1

公开(公告)日：2017-06-06

申请号：US14268775

申请日：2014-05-02

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.

公开(公告)号：US09615468B2

公开(公告)日：2017-04-04

申请号：US14458232

申请日：2014-08-12

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K5/00 ,  H05K5/02 ,  B29C45/14 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  F21V8/00 ,  D06F39/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

公开(公告)号：US09591756B2

公开(公告)日：2017-03-07

申请号：US14119295

申请日：2012-01-12

Applicant: Tomoyuki Unno ,  Kazuyoshi Inami ,  Kosuke Yasooka

Inventor： Tomoyuki Unno ,  Kazuyoshi Inami ,  Kosuke Yasooka

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H01L23/66 ,  H01P5/02 ,  H01P5/08

CPC classification number: H05K1/115 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01P5/028 ,  H01P5/085 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/09818 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.

Abstract translation: 在多层基板中，形成准同轴线作为用于将由安装的高频装置产生的高频信号从最上层发送到最外层的结构，以外部输出并传输外部输入的高频 信号从最下层到高频器件。 准同轴线具有：中心导体，其是垂直通孔，其连接在形成在最上层的上表面上的金属图案和形成在最下层的下表面上的金属图案之间; 而外部导体是围绕中心导体圆周布置并在两层或更多层之间连接的多个层间通孔。 垂直通孔通孔的整体或一部分由不具有通孔的彼此相对的导体焊盘形成的电容器结构代替。

公开(公告)号：US09338915B1

公开(公告)日：2016-05-10

申请号：US14228021

申请日：2014-03-27

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K3/10

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.

Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 一个或多个电子模块中的每一个包括一个或多个电镀通孔，每个电镀通孔中的每一个都连接有导电线。 导电线穿过电镀通孔和连接电子模块的织物。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。