Abstract:
This device includes boards housing a large number of LEDs electrically connected with the tracks of a printed circuit, arranged in the board according to an equilateral triangular distribution and separated from one another at a fixed distance ‘a’, these light emitting diodes project beams of light interlacing from a certain distance ‘d’ of the board, giving even mass of light to the device at the above mentioned distance ‘d’, without points or appreciable zones of shadow. The boards are equipped with interlocking sections on both edges which are used as a guide for centering for the side connection of successive boards, as in a jigsaw puzzle, and the formation of a lighting panel having a larger surface.
Abstract:
Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.
Abstract:
A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine.
Abstract:
A circuit comprises a first circuit portion that includes an electrically insulative first body having a first connector and a first circuit element coupled to the first body. The circuit further comprises a second circuit portion that includes an electrically insulative second body having a second connector coupled to the first connector and a second circuit element coupled to the second body. The circuit further comprises a first electrical conductor coupled to the first and second circuit elements.
Abstract:
A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place. The connector members are multi-layered members having the conductive bars attached to a dielectric substrate and having an elastomeric material captured between a dielectric substrate and a metallic cap.
Abstract:
A modular building block for electronic circuitry is provided with areas for mounting circuitry thereon. Posts of a particular geometric shape and receptacles of a complementary geometric shape are provided on the substrate. The posts and receptacles are coated with an electrically conductive material and connected to nodes within the circuit such that when blocks are interconnected, post within receptacle, the interconnection provides both physical and electrical connection. An alternate embodiment is disclosed having fingers and edge cards, configured such that the fingers of one block grasp the edge cards of another block, providing physical and electrical connection between the blocks.
Abstract:
A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine.
Abstract:
A method for producing a light emitting diode arrangement. A plurality of LED modules are provided, which in each case comprise at least one radiation emitting semiconductor component on a carrier body. At least one separately fabricated connection carrier is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.
Abstract:
According to a construction kit for module type circuit elements disclosed in the present invention, individual circuit elements for forming an electronic circuit are formed in the shape of a module, a circuit diagram and the actual elements of the circuit elements can be intuitionally identified through an upper surface and a lower surface of a circuit element block module having the shape of module, user convenience is improved by coupling the circuit element block module with a lead line connection block module without using a soldering process or a wire connection process, a connection error and a malfunction of a port occurring in existing SMD or dip type circuit elements are prevented, and the learning of the electronic circuit elements can be improved by enhancing an intuitive learning approach of a learner.
Abstract:
A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.