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公开(公告)号：KR1020060116559A
公开(公告)日：2006-11-15
申请号：KR1020050039017
申请日：2005-05-10
Applicant: 삼성전기주식회사
Abstract: An imprint mold for printed circuit board obtained from PTFE(polytetrafluoroethylene) is provided to exhibit excellent durability and patterns, and to have fluorine concentration in the inner surface of the mold higher than at the center portion of the mold by loading PTFE into a master mold so as to form electroless nickel plating layer, and decomposing the loaded PTFE through heat treatment. The mold(200) is fabricated by the steps of: (a) preparing a master mold with structure pattern including multiple via-holes and circuit pattern; (b) preparing electroless nickel plating solution dispersed with PTFE powder; (c) forming an electroless nickel plating layer(210) by contacting the plating solution with the master mold; (d) separating the nickel plating layer charged with PTFE(220) out of the master mold; and (e) heat-treating the separated nickel plating layer so as to disassemble at least a part from PTFE charged in the nickel plating layer. Contents of PTFE in the electroless nickel plating solution range from 5 to 50mg/L.
Abstract translation: 提供由PTFE（聚四氟乙烯）得到的印刷电路板的印模，以显示出优异的耐久性和图案，并且通过将PTFE装载到母模中，使模具的内表面中的氟浓度高于模具的中心部分的氟浓度 以形成无电镀镍层，并通过热处理分解负载的PTFE。 通过以下步骤制造模具（200）：（a）制备具有包括多个通孔和电路图案的结构图案的母模; （b）制备用PTFE粉末分散的无电镀镍溶液; （c）通过使电镀液与母模接触而形成化学镀镍层（210）; （d）将装有PTFE（220）的镍镀层分离出母模; 和（e）对分离的镍镀层进行热处理，从而将填充在镍镀层中的PTFE的至少一部分拆卸。 化学镀镍溶液中PTFE的含量范围为5〜50mg / L。
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公开(公告)号：KR100645646B1
公开(公告)日：2006-11-14
申请号：KR1020050030260
申请日：2005-04-12
Applicant: 삼성전기주식회사
Abstract: 본 발명은 경화촉진이형제를 금형에 도포한 후, 금형을 반경화 수지에 전사함으로써, 금형과 반경화 수지간의 이형을 용이하게 하고, 반경화 수지의 경화를 촉진시키기 위한 임프린트법을 이용한 인쇄회로기판의 제조방법에 관한 것이다.
인쇄회로기판, 임프린트, 이형, 경화촉진, 금형-
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公开(公告)号：KR1020140077533A
公开(公告)日：2014-06-24
申请号：KR1020120146447
申请日：2012-12-14
Applicant: 삼성전기주식회사
IPC: G02B6/12
CPC classification number: G02B6/13 , G02B2006/12166 , H05K3/1258 , H05K3/429
Abstract: A method for manufacturing an optical substrate according to the present invention includes the steps of: preparing a base substrate having circuit patterns on both surfaces thereof; forming an optical waveguide on one surface of the base substrate; forming photosensitive insulation layers on the surface of the optical waveguide and the other surface of the base substrate; forming, on the photosensitive insulation layers, an aperture for forming a mirror groove to expose the surface of the optical waveguide and an aperture for forming an optoelectronic element to expose the other surface of the base substrate; respectively forming the mirror groove and a via hole on the optical waveguide exposed through the aperture for forming the mirror groove and on the base substrate exposed through the aperture for forming the optoelectronic element; forming a metal layer on the photosensitive insulation layers including the inner walls of the mirror groove and the via hole; and patterning the metal layer to form a metal mirror layer, an external layer circuit, and an optoelectronic element connection pad.
Abstract translation: 根据本发明的光学基板的制造方法包括以下步骤：准备在其两面具有电路图案的基底基板; 在所述基底基板的一个表面上形成光波导; 在光波导的表面和基底基板的另一个表面上形成感光绝缘层; 在感光绝缘层上形成用于形成反射镜槽以露出光波导表面的孔和用于形成光电子元件以暴露基底衬底的另一表面的孔; 分别在通过用于形成反射镜槽的孔露出的光波导上形成反射镜槽和通孔，以及通过用于形成光电元件的孔露出的基底基板; 在包括反射镜槽和通孔的内壁的感光绝缘层上形成金属层; 并且图案化金属层以形成金属镜面层，外部层电路和光电子元件连接焊盘。
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55.发明公开
公开(公告)号：KR1020140008871A
公开(公告)日：2014-01-22
申请号：KR1020120076253
申请日：2012-07-12
Applicant: 삼성전기주식회사
CPC classification number: H01B3/40 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H05K1/0326 , H05K1/0373 , H05K1/162 , H05K1/165 , H05K1/185 , H05K3/4676
Abstract: The present invention provides an epoxy resin composition, an insulating film produced therefrom, and a printed circuit board. More specifically the present invention relates to: an epoxy resin having improved dielectric properties for a build-up type multilayer printed circuit board by reducing dielectric constant and dielectric tangent; an epoxy resin composition containing an acid anhydride hardener; an insulating film produced therefrom; and a printed circuit board forming multiple layers by insulating an inner circuit formed of copper using the insulating film.
Abstract translation: 本发明提供环氧树脂组合物，由其制造的绝缘膜和印刷电路板。 更具体地说，本发明涉及：通过降低介电常数和介电正切，对于积聚型多层印刷电路板具有改进的介电特性的环氧树脂; 含有酸酐硬化剂的环氧树脂组合物; 由其制成的绝缘膜; 以及通过使用绝缘膜绝缘由铜形成的内部电路形成多层的印刷电路板。
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Patent Agency Ranking
公开(公告)号：KR1020130138561A
公开(公告)日：2013-12-19
申请号：KR1020120062253
申请日：2012-06-11
Applicant: 삼성전기주식회사
CPC classification number: H01G4/008 , H01G4/12 , H01G4/2325 , H01G4/30
Abstract: The present invention relates to a conductive paste composition for external electrode and multi-layered ceramic electronic parts fabricated by using the same. The conductive paste composition includes one or more resins selected from a group comprising metal powder, epoxy resin and phenoxy resin, and a resin composition additionally including Polyvinyl formal resing with the resin. And the high reliable multi-layered ceramic electronic parts are provided.
Abstract translation: 本发明涉及一种用于外部电极的导电糊剂组合物和使用该导电浆料组合物制造的多层陶瓷电子部件。 导电性糊剂组合物包含选自由金属粉末，环氧树脂和苯氧基树脂组成的组中的一种或多种树脂，以及另外包含与树脂的聚乙烯醇缩甲醛树脂的树脂组合物。 并提供高可靠性的多层陶瓷电子部件。
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公开(公告)号：KR1020120096342A
公开(公告)日：2012-08-30
申请号：KR1020110015710
申请日：2011-02-22
Applicant: 삼성전기주식회사
IPC: C08J7/14 , C08J5/18 , C08L101/12 , H01B1/12
Abstract: PURPOSE: A post treatment method of a conductive film is provided to obtain a conductive film with low surface resistance and high electric conductivity by removing non-conducting molecular chain nearby a conductive polymer through post treatment of the conductive film. CONSTITUTION: A post treatment method of a conductive film comprises: a step of providing a base element; a step of obtaining a conductive film by coating and drying the conductive polymer composition to the base material, and a step of post-treating the conductive film by a mixture solution comprising anthraquinone-2-sulfonic acid, dopant, and organic solvent. The mixture solution comprises 0.5-20 weight% of anthraquinone-2-sulfonic acid, 1-10 weight% of dopant, and 70-90 weight% of organic solvent.
Abstract translation: 目的：提供导电膜的后处理方法，通过后续处理导电膜去除导电聚合物附近的非导电分子链，从而获得具有低表面电阻和高导电性的导电膜。 构成：导电膜的后处理方法包括：提供基体元件的步骤; 通过将导电性聚合物组合物涂布干燥而形成基材的工序，以及通过包含蒽醌-2-磺酸，掺杂剂和有机溶剂的混合溶液对导电膜进行后处理的工序。 混合溶液包含0.5-20重量％的蒽醌-2-磺酸，1-10重量％的掺杂剂和70-90重量％的有机溶剂。
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58.发明公开빌드업 필름 구조체 및 이를 이용하여 제조된 회로기판, 그리고 상기 빌드업 필름 구조체를 이용한 회로기판의 제조 방법 无效使用建筑薄膜结构制造的建立薄膜结构和电路板以及使用建筑薄膜结构制造电路板的方法
公开(公告)号：KR1020120038052A
公开(公告)日：2012-04-23
申请号：KR1020100099576
申请日：2010-10-13
Applicant: 삼성전기주식회사
CPC classification number: H05K3/4673 , H05K3/0055 , H05K2201/0209 , H05K2201/0212
Abstract: PURPOSE: A build up film structure, a circuit board manufactured using the same, and a circuit board manufacturing method using the build up film structure are provided to increase exfoliation intensity between an insulating film and a circuit pattern by improving combining strength between the circuit pattern and the other surface of the insulating film. CONSTITUTION: An insulating film(110) comprises a first film(120) and a second film(130) which are combined to each other. The first film includes first filler which has a regular shape. The second film includes second filler(134) which has a irregular shape. A carrier film(150) is laminated on the upper surface of the insulating film. A protective film(140) is laminated on the lower surface of the insulating film.
Abstract translation: 目的：提供一种积层膜结构，使用其制造的电路板以及使用该积层膜结构的电路板制造方法，以通过提高电路图案之间的组合强度来提高绝缘膜和电路图案之间的剥离强度 和绝缘膜的另一个表面。 构成：绝缘膜（110）包括彼此组合的第一膜（120）和第二膜（130）。 第一膜包括具有规则形状的第一填料。 第二膜包括具有不规则形状的第二填料（134）。 载体膜（150）层叠在绝缘膜的上表面上。 在绝缘膜的下表面层叠保护膜（140）。
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公开(公告)号：KR1020120032871A
公开(公告)日：2012-04-06
申请号：KR1020100094414
申请日：2010-09-29
Applicant: 삼성전기주식회사
IPC: H01L33/64
CPC classification number: H01L33/641 , B82Y20/00 , B82Y30/00 , C08K3/042 , C08L63/00 , H01L21/4857 , H01L23/3737 , H01L23/49894 , H01L2224/16 , H01L2924/12044 , Y10T428/30
Abstract: PURPOSE: A heat dissipation substrate, a manufacturing method thereof, and a light emitting device package including the same are provided to significantly improve heat dissipation efficiency by forming graphene on the heat dissipation substrate which has excellent heat conductivity compared to a metal. CONSTITUTION: A light emitting device(110) is a light emitting diode or/and a laser diode. A heat dissipation substrate(120) releases heat generated from the light emitting device to the outside. The heat dissipation substrate includes a structure in which a plurality of build-up insulating films(122) is laminated. The insulating film includes a polymer resin and graphene. The light emitting device is electrically connected to an inner layer circuit patter(124) by being welded to an outer layer circuit pattern(126).
Abstract translation: 目的：提供一种散热基板及其制造方法以及包含该散热基板的发光器件封装，通过在与金属相比具有优异的导热性的散热基板上形成石墨烯来显着提高散热效率。 构成：发光器件（110）是发光二极管或/和激光二极管。 散热基板（120）将从发光装置产生的热量释放到外部。 散热基板包括层叠多个堆积绝缘膜（122）的结构。 绝缘膜包括聚合物树脂和石墨烯。 发光器件通过焊接到外层电路图案（126）而电连接到内层电路图案（124）。
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公开(公告)号：KR1020110116505A
公开(公告)日：2011-10-26
申请号：KR1020100035957
申请日：2010-04-19
Applicant: 삼성전기주식회사
Abstract: 본 발명은 기판 이송 장치에 관한 것으로, 본 발명의 실시예에 따른 기판 이송 장치는 기판의 양측 가장자리를 지지하며, 기판의 이송 방향을 따라 배치된 진공홀들을 갖는 이송 가이드, 기판의 양측 가장자리에 접촉되도록 이송 가이드에 이동가능하게 구비되는 이송 벨트, 이송 벨트에 놓여진 기판이 이송 방향을 따라 이동되도록, 이송 벨트를 구동시키는 구동부재, 그리고 진공홀들로 진공압을 제공하는 진공압 제공부재를 포함하되, 이송 벨트는 기판이 놓여지는 로딩부 및 로딩부에 한정되어 형성되며 진공홀들에 상응하는 관통홀들을 갖는다.
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