Abstract:
본 발명은 그래픽(graphic), 비디오/오디오(Video/Audio) 그리고 사운드(Sound)에 관한 데이터의 처리 기능을 갖는 멀티미디어 데이터 처리 장치(an apparatus with processing multi-media data)에 관한 것으로서, 그래픽 데이터 처리부(50)에 의해 2/3차원 그래픽 데이터의 처리가 고속으로 이루어지며, MPEG 데이터 처리부(70)에 의해 MPEG 데이터의 변환/재생에 따른 포맷팅/디포맷팅이 이루어지며 이외의 변환/재생에 따른 데이터의 처리는 호스트에 의해 처리되며, 사운드 데이터 처리부(80)에 의해 사운드/미디 데이터의 처리가 이루어진다. 또한 이상의 멀티미디어 데이터 처리장치(200)는 하나의 반도체 칩에 직접되는 원칩의 형태로 제공될 수 있다.
Abstract:
The method corrects errors with a simple hardware to simplify the correcting process. The apparatus includes a syndrome generator (101) for generating syndromes according to the received word data of 1 block and parity inspecting process, a word position counter (104) for counting word position value (α) by a block, an error value calculator (106) for calculating error value, and a buffer memory (109) for delaying received word and supplying it to an adder (108).
Abstract:
The ROM circuit for simplifying the ciruit construction of the AND circuit portion (3) to reduce the required area generates N bit of data programed at the respective cross section of output lines (D0- D2) and word lines (W0-W3) by decoding M bit of address signals. The ROM circuit comprises a decoder (10), a gate unit (22), a memory cell array (24) and a precharger (26). The decoder generates a word signal from an input address signal. The gate unit supplies a word signal to a corresponding word line according to a clock signal. The memory cell array stores the desired data according to the combinational existance of MOS transistors at the respective cross section of the word lines and the output lines. The respective output lines are precharged according to the clock signal.
Abstract:
상변화메모리소자의형성방법을제공할수 있다. 이를위해서, 하부전극및 층간절연막을가지는반도체기판이준비될수 있다. 상기하부전극은층간절연막으로둘러싸일수 있다. 상기반도체기판을반도체증착장비의공정챔버내 안착시킬수 있다. 상기공정챔버내 소오스가스들, 반응가스및 퍼지가스를주입해서반도체기판상에상변화물질막을형성할수 있다. 상기소오스가스들은공정챔버에동시에주입될수 있다. 상기상변화물질막은층간절연막을통해서하부전극과접촉할수 있다. 상기층간절연막을노출시키도록상변화물질막을식각해서층간절연막에상변화메모리셀을형성할수 있다. 상기상변화메모리셀 상에상부전극을형성할수 있다.
Abstract:
PURPOSE: An apparatus and method for manufacturing phase change materials are provided to obtain the phase change materials with high film property by using a metal organic source and a tellurium source with high vapor pressure. CONSTITUTION: A first source supply unit supplies tellurium source to a process chamber(180) and includes a source container(150), a flow controller(160), and a vaporizer(170). A second source supply unit supplies a metal organic source to a process chamber with a bubbler method and includes an antimony source container(140), a first valve, and pipes(141,142). A reactive gas supply unit includes a reactive gas container(110) and a pipe(111).
Abstract:
PURPOSE: A method of forming a phase change memory device is provided to supply electrical bit to a phase change device by forming a void in the phase change memory cell. CONSTITUTION: A first to third source gas(G1-G3) are inserted into a process chamber. The first source gas has a germanium precursor. A second source gas has an antimony precursor. A third source gas has a tellurium precursor. A reaction gas is inserted into a process chamber during the time of inserting the first to the third gas. A purge gas is inserted into the process chamber during the time of inserting the first to the third gas. A phase change material layer is filled into the opening the inter-layer insulating film of the semiconductor substrate.
Abstract:
PURPOSE: A method for forming a contact structure, a method for manufacturing a semiconductor device using the same, and the semiconductor device are provided to minimize a reset current of a phase change memory device by minimizing an interfacial area between a phase change material film and an electrode. CONSTITUTION: A first molding pattern(24) including a first opening is formed on a substrate(1). An insulating film which covers the sidewall of the first opening is formed. A second molding pattern(30) which fills the rest of the first opening is formed. A mask exposing a part of the insulating layer is formed on the substrate including the second molding pattern. An insulating pattern(27a) is formed between the first and the second molding patterns. The exposed insulating layer is selectively etched.