Abstract:
A method of fabricating a poly crystalline silicon thin film transistor (TFT) is provided. The method includes the operations of forming a poly crystalline silicon having a source, a drain, and a channel region between the source and the drain on a substrate in a predetermined pattern; forming an insulating layer on the poly crystalline silicon; forming a silicon-based heat absorption material layer on the insulating layer; exposing the source and the drain by patterning the insulating layer and the heat absorption material layer and forming a gate and a gate insulating layer corresponding to the channel region; injecting impurities into the source, the drain, and the gate; and heat processing the gate insulating layer and the heat absorption material layer by applying thermal energy to the heat absorption material layer. In the heat treatment, the gate material absorbs some of the heat and passes the remaining heat. The heat treatment of the gate insulating layer under the gate can be performed efficiently.
Abstract:
전기적신뢰성이향상된능동형표시장치의스위칭소자및 그구동방법이개시된다. 개시된능동형표시장치의스위칭소자는직렬연결된다수의박막트랜지스터를포함한다. 따라서, 하나의스위칭소자내에서다수의박막트랜지스터가동시에온(ON)이되는시간이외에는, 하나의스위칭소자내의각각의박막트랜지스터에비동시적으로양의전압을인가함으로써스위칭소자의신뢰성을향상시킬수 있다.
Abstract:
폴리 실리콘막 형성 방법, 이 방법으로 형성된 폴리 실리콘막을 구비하는 박막 트랜지스터 및 그 제조방법에 관해 개시되어 있다. 개시된 본 발명은 기판 상에 적층된 제1 열전도막, 상기 제1 열전도막 상에 적층된, 상기 제1 열전도막보다 열전도도가 낮은 제2 열전도막, 상기 제2 열전도막과 상기 제2 열전도막 양쪽의 상기 제1 열전도막 상에 적층된 폴리 실리콘막 및 상기 제2 열전도막을 덮는 상기 폴리 실리콘막 상에 적층된 게이트 적층물을 구비하는 것을 특징으로 하는 박막 트랜지스터 및 그 제조방법을 제공한다. 상기 제2 열전도막은 상기 제1 열전도막 상에 형성되는 대신, 상기 제1 열전도막의 일부와 대체될 수 있다. 상기 폴리 실리콘막은 상기 제1 및 제2 열전도막 상에 형성된 비정질 실리콘막에 엑시머 레이저광을 한번 조사하여 형성한 것이다. 또한, 상기 게이트 적층물은 상기 폴리 실리콘막의 채널영역으로 사용된 부분의 아래쪽에 구비될 수 있다.
Abstract:
PURPOSE: A transistor, a method for manufacturing the same, and an electronic device including the transistor are provided to improve the reliability of a flat display apparatus by being adapted to the flat display apparatus. CONSTITUTION: A multi-layered structure includes a silicon oxide layer(10), a silicon oxynitride layer(20), and a silicon nitride layer(30). The silicon oxide layer is capable of being formed at low temperature between 100 and 250 degrees Celsius or at high temperature between 250 and 450 degrees Celsius. The characteristic change of a channel layer(C1) is suppressed by a protective layer(P1). The thicknesses of a gate(G1), the channel layer, a gate insulating layer, a source electrode(S1), a drain electrode(D1), and a protective layer are respectively between 50 and 300nm, between 40 and 100nm, between 50 and 400nm, between 10 and 200nm, between 10 and 200nm, and between 250 and 1200nm.
Abstract:
PURPOSE: A transistor, a method for manufacturing the same, and an electronic element including the same are provided to suppress the change of a threshold voltage in the transistor by including a photo relaxation layer. CONSTITUTION: A transistor includes a source, a drain, a channel layer, a gate insulating layer(GI1), and a gate(G1). The channel layer includes an amorphous oxide semiconductor. The amorphous oxide semiconductor is a ZnO-based oxide. A photo relaxation layer(R1) suppresses the change of a threshold voltage in the transistor due to light. The photo relaxation layer is based on Al_2O_3. The gate insulating layer is based on a silicon oxide.
Abstract:
PURPOSE: A method for manufacturing a thin film transistor by reducing off current of high drain area is provided. CONSTITUTION: A thin film transistor comprises a gate(11), gate insulation layer(12), channel(13), intermediate layer(14), source and drain(16a,16b). The gate is formed on one are of a substrate. The gate insulation layer is formed on the substrate and gate. The channel is formed on an area corresponding to the gate on the gate insulation layer. The intermediate layer is formed at both upper sides of the channel and on the gate insulation layer.
Abstract:
PURPOSE: An atomic layer deposition apparatus and an atomic layer deposition method using the same are provided to rapidly deposit a film of desired thickness on a substrate by injecting a first source gas, a first purge gas, a second source gas, and a second purge gas at the same time while the substrate or a shower head is moved. CONSTITUTION: A substrate supporting bar(120) is installed inside a reaction chamber, and supports a substrate(10). A shower head(130) includes a nozzle set capable of injecting a first source gas, a second source gas, and a purge gas on the substrate at the same time. At least one among the substrate supporting bar and the shower head is movably installed according to a first direction. A first source gas injection nozzle(31) is arranged in a first row. A purge gas injection nozzle(41,42) is arranged in a second row. A second source gas injection nozzle(32) is arranged in a third row.
Abstract:
PURPOSE: A display device and a manufacturing method thereof for improving the real feeling and immersion are provided to improve the image quality by changing FOV within a predetermined range. CONSTITUTION: A display device includes a flexible base(10) and a hard base(30). An image display structure(20) is formed on a second surface of the flexible base. The hard base comprises a plurality of pieces. A plurality of pieces is closely fixed to the flexible base. The flexible base is bend in a direction of the image display structure. The image display structure is roundly changed. The reality is improved by increase of FOV(Field Of View) by bending of the display device.