Abstract:
A method for fabricating an air-gap type FBAR, an FBAR fabricated thereby, and a filter and a duplexer using an FBAR are provided to form simply an air gap without a CMP process, and a process for removing a sacrificial layer by laminating an LCP thin film on a silicon substrate having a cavity part. A first substrate(200) includes a cavity part formed on a predetermined region of an upper surface thereof. A dielectric layer(220) is formed on the first substrate(200) in order to form a first air gap(210) on the cavity part of the first substrate(200). A stacked resonance part(230) is formed by laminating a bottom electrode/piezoelectric layer/top electrode on the dielectric layer(220). A second substrate(240) includes a cavity part formed on a predetermined region of a bottom surface thereof.
Abstract:
본 발명은 플라즈마 상태의 분자를 이용하지 않고 건식 에칭을 함으로써 에어갭형 박막 벌크 음향 공진기(Film Bulk Acoustic Resonator:이하 "FBAR"이라 한다)를 제조하는 방법 및 그 방법으로 제조된 FBAR에 관한 것이다. 본 발명에 따른 에어갭형 FBAR은, 기판 상부표면에 증착된 에칭 방지 박막, 상기 에칭 방지 박막 상에 증착된 후 그 일정부분이 공동부를 형성하도록 패터닝된 폴리 실리콘층, 상기 공동부 및 폴리 실리콘층 간의 경계면에 증착된 에칭 방지 벽, 상기 공동부 상부 및 폴리 실리콘층 상에 증착된 멤브레인층, 상기 멤브레인층 상부표면의 일정 부분에 증착된 하부전극, 상기 하부전극 상부 표면 중에서 하부에 공동부가 위치하는 부분 상에 증착된 압전층, 상기 압전층의 상부 표면 및 상기 하부전극이 증착되지 않은 멤브레인층 상부표면에 증착된 상부전극을 포함하는 것을 특징으로 한다. 한편, 본 발명에 따른 에어갭형 FBAR의 제조 방법은, 기판 상에 에칭 방지 박막을 증착시키는 단계, 상기 에칭 방지 박막 상에 폴리 실리콘층을 증착시키는 단계, 상기 절연 층에 비아홀을 에칭하는 단계, 상기 비아홀 및 폴리 실리콘층 상부에 에칭 방지 물질을 증착시켜 에칭 방지 벽을 형성하는 단계, 상기 에칭 방지 물질을 평탄화하여 멤브레인층을 형성하는 단계, 상기 멤브레인층 중 하부에 공동부가 존재하는 부분을 포함한 일정부분에 하부전극을 증착시키는 단계, 상기 하부전극 상부표면 중에서 하부에 공동부가 존재하는 부분 및 상기 멤브레인층의 일정 부분에 압전층을 증착시키는 단계, 상기 압전층 및 멤브레인층 상부에 상부전극을 증착시키는 단계 및 상기 에칭방지벽 사이에 존재하는 폴리 실리콘층을 식각하는 단계를 포함하는 것을 특� �으로 한다. 본 발명에 따라 FBAR을 제조하게 되면, 폴리 실리콘층을 희생층으로 사용하여 건식 에칭함으로써 플라즈마 상태의 분자가 필요하지 않고, 따라서, 플라즈마 상태에서 오는 소자에의 물리적 충격 및 열화등의 문제점을 방지할 수 있고, 에칭 방지 벽을 이용함으로써 에칭의 범위를 쉽게 조절할 수 있으며, 에칭 과정에서 소자에 전혀 손상을 입히지 않을 수 있다. 또한, 기존의 FBAR제조 공정에 비하여 쉽고, 신속하게 제조할 수 있으며, 보다 견고한 구조의 FBAR을 제작할 수 있게 된다.
Abstract:
PURPOSE: A micro switch is provided to be capable of increasing on/off rate and the degree of isolation, simplifying the structure of the micro switch, and easily carrying out manufacturing processes. CONSTITUTION: A micro switch is provided with a substrate, a dielectric layer(2) having an oscillating region, a conductive layer(3) located at the upper predetermined portion of the oscillating region, a dielectric film(3') formed at the upper portion of the conductive layer, and the first and second conductive part(9a,9b) spaced apart from each other at the upper portion of the dielectric film. The micro switch further includes a plurality of lower electrodes(4) arranged at the upper surface of the oscillating region and a plurality of upper electrodes(10) spaced apart from each other at the upper portion of the lower electrodes for flowing an AC(Alternating Current) signal between the first and second conductive part.
Abstract:
A method for fabricating a MEMS device having a fixing part, driving part, electrode part, and contact parts on a substrate. A driving electrode is formed on the substrate, and then an insulation layer is formed thereon. The insulation layer is patterned, and the regions of the insulation layer in which the fixing part and the contact parts are formed are etched. A metal layer is formed on the substrate. The metal layer is planarized down to the insulation layer, and the driving electrode is formed. A sacrificial layer is formed on the substrate, and a groove-shaped space is formed in a region in which the fixing part is formed. A MEMS structure layer is formed on the sacrificial layer. Sidewalls are formed in the groove-shaped space, and the fixing part and driving part are formed, leaving the sacrificial layer underneath the fixing part.
Abstract:
PURPOSE: A MEMS(Micro Electro Mechanical System) switching device for switching an RF(Radio Frequency) signal by capacitance is provided to improve the efficiency of an RF signal transmission by generating and eliminating the capacitance according to a driving state of a switching contact point. CONSTITUTION: A pair of metal contacts(33) are formed at separate positions on a substrate(31) and transmit an RF signal. A dielectric film(39) is formed between the metal contacts(33) on the substrate(31) and contacts to the metal contacts(33). A switching contact(35) is provided on an upper portion of the dielectric film(39). The switching contact(35) is driven so as to contact to and divide the dielectric film(39) by a driving force from an external to generate capacitance between the metal contacts(33) through the dielectric film(39) when contacting to the dielectric film(39).
Abstract:
A passive device and a module for a transceiver are provided. The passive device for a transceiver includes a semiconductor substrate or a dielectric substrate, at least one capacitor, a dielectric layer, at least one inductor, a via hole, a metal electrode, radio frequency signal lines, and a radio frequency ground. The at least one capacitor is formed on the substrate. The dielectric layer is formed on the capacitor and the substrate. The at least one inductor is formed on the dielectric layer. The via hole penetrates through the dielectric layer. The metal electrode is formed in the via hole and electrically connects the capacitor and the inductor. The radio frequency signal lines are for the inductor and the capacitor. The radio frequency ground is formed on the substrate and isolated from the radio frequency signal lines. A reduction in the area required for mounting passive devices and modules thereof contributes to the downsizing of communication systems. Also, use of the MEMS technique can reduce insertion loss of inductors, which improves the communication quality of communication systems.
Abstract:
PURPOSE: A MEMS device and a method for fabricating the same are provided to improve reliability of the MEMS device with achieving a stable driving characteristic of the MEMS device. CONSTITUTION: A driving electrode layer(320) is formed on a substrate(310) by patterning a driving electrode. A planar mold is formed on the substrate(310) having the driving electrode layer(320). The planar mold functions as an insulating layer(330). After patterning the insulating layer(330), the insulating layer(330) formed in a predetermined area, in which a fixing section and a contact section are formed, is etched. Then, a metal layer(340) is formed on the substrate(310) including the fixing section and contact section.
Abstract:
PURPOSE: A low-loss inductor device is provided to be capable of preventing a flux generated at an inductor from flowing in a substrate or another circuit portion. CONSTITUTION: An inductor(150) is spirally formed on a substrate(110). At least one magnetic material film is disposed at one side of the inductor, is made of a flux guide material and induces a flux generated by the inductor. The magnetic material film is disposed between the inductor and the substrate. The magnetic material film comprises the first and second magnetic material films(120,190) which are disposed at upper and lower surfaces of the inductor. A flux guide is configured to connect the first and second magnetic material films.
Abstract:
A semiconducting yttrium-barium-copper-oxygen(YBCO) device which locally converts a semiconducting YBCO film to a nonconducting YBCO film by a conductive atomic force microscope (AFM), a superconducting YBCO device which locally converts a superconducting YBCO film to nonsuperconducting YBCO by an AFM, and manufacturing methods thereof are provided. According to a method of manufacturing a semiconducting YBCO device or a superconducting YBCO device locally converted by an AFM tip, a voltage is applied to the local region of a semiconducting YBCO channel or a superconducting YBCO channel by an AFM tip. This can produce a nonconducting YBCO region or nonsuperconducting YBCO region to thereby manufacture a tunnel junction easily without any patterning process by microfabrication including photolithography and dry/wet etching.
Abstract:
PURPOSE: An MEMS switch is provided using an RF blocking resistor instead of a relatively large-sized RF choke inductor conventionally used to block RF signals. CONSTITUTION: The MEMS switch has a semiconductor or dielectric substrate(10), a signal line(12) formed on the substrate(10) and having a gap(13) to form an open circuit, an RF ground(14a,14b) separated from the signal line(12), an anchor(20a,20b) formed on the substrate(10) and near both sides of the signal line(12), a driving electrode formed on the substrate(10) and between the signal line(12) and the anchor(20a,20b), a coupling dielectric(18) formed on the driving electrode, a flexible beam(22) extending from the top of the anchor(20a,20b) to face the opposite, a driving plate(24) connected to the beam(22) above the coupling dielectric(18) to form coupling capacitance structure together with the driving electrode and the dielectric(18), a contact plate(28) disposed above the gap(13) and between the driving plates to form resistance coupling together with the signal line(12), the RF blocking resistor(40) formed between the driving electrode and the ground(14a,14b), and an RF blocking part(42) formed between a pad(44) on the substrate(10) and the anchor(20a,20b).