Abstract:
PURPOSE: A semiconductor package prevents defects generated in a reflow process by omitting the reflow process in manufacturing processes. CONSTITUTION: Multiple contact pads (115) are formed on one surface of a semiconductor chip (100). Multiple main bumps (140a) are formed on the contact pads. The main pump includes a first pillar layer (142a) formed on the contact pad and a first solder layer (146a) formed on the first pillar layer. The lower sidewall of the first solder layer is substantially vertical. The upper part of the first solder layer is round. Multiple dummy bumps (140b) are formed on the semiconductor chip around the contact pads.
Abstract:
A method and an apparatus for processing audio of a portable terminal with a T(Terrestrial)-DMB(Digital Multimedia Broadcasting) function are provided to watch the T-DMB at any place irrespective of the audio standard of DMB. When a T-DMB signal is received, a process for sensing the channel frequency of the T-DMB signal and then confirming the service area of the channel frequency is performed(S303). Thereafter, a process for setting the audio codec of the service area into the audio codec of the T-DMB is performed(S304). When the T-DMB is outputted, a process for decoding and outputting the audio signal of the T-DMB signal through the set audio codec is performed(S305). Thereafter, a process for encoding the user's sound inputted by a portable terminal through the set audio codec is performed(S306). When the sensed channel frequency is 174.928 Mhz, a control member discriminates that the service area of the T-DMB is China and Europe, not Korea.
Abstract:
A method of manufacturing a standard specimen for metal contamination analysis is provided to manufacture the standard specimen existing in a certain depth and uniformly distributed in a semiconductor wafer. A method of manufacturing a standard specimen for metal contamination analysis includes a step of applying an organic silica solution(14a) including metal impurities(12) on a semiconductor wafer(10). The metal impurities are intentionally contained in the organic silica solution to analyze a metal contamination source. Concentration of the metal impurities can be adjusted by an operator. The metal impurities include iron, nickel, and so on. Before applying the organic silica solution on the semiconductor wafer, a natural oxide layer remaining on the semiconductor wafer can be removed. The semiconductor wafer is submerged in a first solution including ammonia, peroxide, and so on. Then, the semiconductor wafer is submerged in a second solution including fluoride.
Abstract:
프로토콜 변환중재회로 및 이를 구비하는 시스템과 신호 변환중재방법이 개시된다. 상기 프로토콜 변환중재회로는 마스터가 사용하는 프로토콜에 따른 신호들을 수신하고, 수신된 신호들을 슬레이브의 시스템 버스가 사용하는 프로토콜에 따른 신호로 변환하는 프로토콜 변환회로; 및 상기 프로토콜 변환회로의 출력신호들을 수신하고, 수신된 신호들을 상기 슬레이브가 사용하는 프로토콜에 따른 신호들로 변환하기 위한 변환회로를 구비한다. 다중포트 메모리 컨트롤러와 본 발명에 따른 적어도 하나의 프로토콜 변환중재회로를 구비하는 시스템은 다수개의 모듈들 각각이 시스템 버스를 통하지 않고 직접적으로 상기 다중포트 메모리 컨트롤러를 통하여 외부 메모리와 데이터를 주고받을 수 있으므로, 데이터 프로세싱 시간이 상당히 감소되는 효과가 있다.
Abstract:
PURPOSE: A voice-recognition device is provided to improve voice recognition speed by installing dedicated calculator having a self-processing function to process loads which requires system usage rate. CONSTITUTION: A codec module(440) samples an inputted aural signal and makes sample data as block by predetermined time and output it. A register file module(404) buffers the blocks of sample data belong to an effective voice section among the blocks of sample data. An FFT(Fast Fourier Transform) module(412) transforms the data blocks into a frequency domain, or executes an inverse operation, and stores the result at the register file module. An MAC(Multiply And Accumulate) module(408) compares feature values extracted based on a frequency spectrum obtained by the FFT with feature values of each word syllable preliminarily selected, so the MAC module calculates the observation probability.
Abstract:
A multi-chip package according to the present invention comprises a first semiconductor chip, a second semiconductor chip, an insulating film structure, and a plug structure. The first semiconductor chip includes first bonding pads. The second semiconductor chip is located on the first semiconductor chip and includes second bonding pads. The insulating film structure covers the first and second semiconductor chips. The plug structure, which is located inside the insulating film structure and placed apart from sides of the first and second semiconductor chips, is formed by using a plating process and connects the first bonding pad and second bonding pad electrically. Therefore, problems caused by a micro-bump forming process can be completely resolved.
Abstract:
PURPOSE: A semiconductor package and a semiconductor package module are provided to arrange a bump with a fine pitch by preventing bridge generation, thereby reducing the size of the semiconductor package. CONSTITUTION: Connection bumps(140a) are formed on each connection pad. The connection bumps include a first pillar part(142a) and a first solder part(144a). Support bumps(140b) are formed on a position near the connection pad with a height higher than the upper surface of the connection pad. The support bumps comprises a second pillar part(142b) and a second solder part(144b). A solder induction part is formed on the second pillar part.
Abstract:
프로토콜 변환중재회로 및 이를 구비하는 시스템과 신호 변환중재방법이 개시된다. 상기 프로토콜 변환중재회로는 마스터가 사용하는 프로토콜에 따른 신호들을 수신하고, 수신된 신호들을 슬레이브의 시스템 버스가 사용하는 프로토콜에 따른 신호로 변환하는 프로토콜 변환회로; 및 상기 프로토콜 변환회로의 출력신호들을 수신하고, 수신된 신호들을 상기 슬레이브가 사용하는 프로토콜에 따른 신호들로 변환하기 위한 변환회로를 구비한다. 다중포트 메모리 컨트롤러와 본 발명에 따른 적어도 하나의 프로토콜 변환중재회로를 구비하는 시스템은 다수개의 모듈들 각각이 시스템 버스를 통하지 않고 직접적으로 상기 다중포트 메모리 컨트롤러를 통하여 외부 메모리와 데이터를 주고받을 수 있으므로, 데이터 프로세싱 시간이 상당히 감소되는 효과가 있다. 프로토콜, AMBA, OCP