公开(公告)号：US20150041928A1

公开(公告)日：2015-02-12

申请号：US14524986

申请日：2014-10-27

Applicant: SiTime Corporation

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.

Abstract translation: 与第一衬底的第一和第二部分彼此分开并与第一衬底的其余部分分开的沟槽在第一衬底内形成空腔。 第一衬底的第一部分设置在空腔内并构成微机电结构，而衬底的第二部分至少部分地设置在空腔内并且构成电接触的第一部分。 第二衬底在空腔上固定到第一衬底以限定包含微机电结构的腔室。 第二基板具有构成电触点的第二部分的第一部分，并且设置成与第一基板的第二部分电接触，使得电触头从腔室内延伸到腔室的外部。

公开(公告)号：US08669664B2

公开(公告)日：2014-03-11

申请号：US13681065

申请日：2012-11-19

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/498 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A stacked die package for an electromechanical resonator system includes an electromechanical resonator die bonded or fixed to a control IC die for the electromechanical resonator by, for example, a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Certain packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package may provide small package footprint and/or low package thickness, and low thermal resistance and a robust conductive path between the dice.

Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括通过例如热和/或导电环氧树脂结合或固定到用于机电谐振器的控制IC管芯的机电谐振腔。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的某些封装结构包括芯片引线（COL），片上芯片（COP）和芯片芯片（COT）封装。 堆叠的管芯封装可以提供小的封装封装和/或低的封装厚度，以及低的热阻和在管芯之间的坚固的导电路径。

公开(公告)号：US20250007455A1

公开(公告)日：2025-01-02

申请号：US18412695

申请日：2024-01-15

Applicant: SiTime Corporation

Inventor： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

IPC: H03B5/04 ,  B81B3/00 ,  B81B7/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H03B5/30 ,  H03H9/08 ,  H03L1/04

Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate-in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

公开(公告)号：US12095447B1

公开(公告)日：2024-09-17

申请号：US16591717

申请日：2019-10-03

Applicant: SiTime Corporation

Inventor： Charles I. Grosjean ,  Ginel C. Hill ,  Paul M. Hagelin ,  Renata Melamud Berger ,  Aaron Partridge ,  Markus Lutz

IPC: H03H9/24 ,  B81C1/00 ,  H03H3/00 ,  H03H3/007 ,  H03H9/10

CPC classification number: H03H9/2457 ,  B81C1/0069 ,  H03H3/0072 ,  H03H3/0076 ,  H03H9/1057 ,  B81C2201/0164 ,  B81C2201/0171

Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

公开(公告)号：US11990908B1

公开(公告)日：2024-05-21

申请号：US16807979

申请日：2020-03-03

Applicant: SiTime Corporation

Inventor： Aaron Partridge ,  Samira Zaliasl ,  Meisam Heidarpour Roshan ,  Sassan Tabatabaei

IPC: G01K7/32 ,  H03K3/03 ,  H03L1/02 ,  H03L7/099 ,  H03L7/18 ,  H03L7/197

CPC classification number: H03K3/0315 ,  G01K7/32 ,  H03L1/027 ,  H03L7/0991 ,  H03L7/18 ,  H03L7/1976

Abstract: In a high resolution temperature sensor, first and second MEMS resonators generate respective first and second clock signals and a locked-loop reference clock generator generates a reference clock signal having a frequency that is phase-locked to at least one of the first and second clock signals. A frequency-ratio engine within the MEMS temperature sensor oversamples at least one of the first and second clock signals with the reference clock signal to generate a ratio of the frequencies of the first and second clock signals.

公开(公告)号：US11909354B2

公开(公告)日：2024-02-20

申请号：US17824389

申请日：2022-05-25

Applicant: SiTime Corporation

Inventor： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

IPC: H03B5/04 ,  H03B5/30 ,  H01L23/31 ,  H01L23/34 ,  B81B3/00 ,  H01L23/00 ,  B81B7/00 ,  H03L1/04 ,  H03H9/08

CPC classification number: H03B5/04 ,  B81B3/0081 ,  B81B7/0096 ,  H01L23/3121 ,  H01L23/345 ,  H01L24/16 ,  H03B5/30 ,  H03L1/04 ,  B81B2207/012 ,  B81B2207/098 ,  H01L2224/16145 ,  H01L2924/1461 ,  H03H9/08

Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

公开(公告)号：US11708264B2

公开(公告)日：2023-07-25

申请号：US17827437

申请日：2022-05-27

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: B81B7/00 ,  B81C1/00 ,  H10N30/30 ,  H01L23/34 ,  H01L23/498 ,  H01L23/31

CPC classification number: B81B7/0083 ,  B81B7/007 ,  B81B7/0077 ,  B81C1/0023 ,  B81C1/00301 ,  B81C1/00333 ,  B81C1/00341 ,  H01L23/34 ,  H01L23/498 ,  H10N30/302 ,  B81B2201/0271 ,  B81B2207/07 ,  B81B2207/094 ,  B81C2201/016 ,  B81C2203/0118 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

公开(公告)号：US20220356059A1

公开(公告)日：2022-11-10

申请号：US17827437

申请日：2022-05-27

Applicant: SiTime Corporation

Inventor： Pavan Gupta ,  Aaron Partridge ,  Markus Lutz

IPC: B81B7/00 ,  B81C1/00 ,  H01L41/113 ,  H01L23/34 ,  H01L23/498

Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

公开(公告)号：US11323071B1

公开(公告)日：2022-05-03

申请号：US17199772

申请日：2021-03-12

Applicant: SiTime Corporation

Inventor： Aaron Partridge ,  Sassan Tabatabaei ,  Lijun Chen ,  Kamran Souri

IPC: H03B5/36 ,  H03F3/04 ,  H03F3/70 ,  G01C19/5726 ,  G01C19/56

Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.

公开(公告)号：US11218984B1

公开(公告)日：2022-01-04

申请号：US16655560

申请日：2019-10-17

Applicant: SiTime Corporation

Inventor： Markus Lutz ,  Sassan Tabatabaei ,  Charles I. Grosjean ,  Paul M. Hagelin ,  Aaron Partridge

IPC: H04W56/00 ,  H04W40/24 ,  B81B7/02 ,  G06F7/58 ,  H04W88/08

Abstract: In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.