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    Switch structure based on thermoresponsive polymer, or structure of the same kind
    51.
    发明专利
    Switch structure based on thermoresponsive polymer, or structure of the same kind 审中-公开
    基于热稳定聚合物的开关结构或其相同结构

    公开(公告)号：JP2010196710A

    公开(公告)日：2010-09-09

    申请号：JP2010066539

    申请日：2010-03-23

    Applicant: Intel Corp ,  インテル・コーポレーション

    Inventor： CHEE CHOONG KOOI

    IPC: F03G7/06

    CPC classification number: B81B3/0024 ,  A61M5/16881 ,  A61M5/1723 ,  A61M2205/0266 ,  B81B2201/018 ,  B81B2201/045 ,  B81B2201/054 ,  H01H2037/008 ,  Y10T137/8242

    Abstract: PROBLEM TO BE SOLVED: To provide a switch using a thermoresponsive polymer. SOLUTION: A switch structure 100 or a structure of the same kind such as a valve, motor, or optical switch, may be constructed based on the thermoresponsive polymer 112. At a first temperature the thermoresponsive polymer 112 may be in a first volume state, and at a second temperature the thermoresponsive polymer 112 may be in a second volume state. The change in volume of the thermoresponsive polymer 112 may be operative to push or pull the mechanical structures of the switch, valve, motor, optical switch, and so on, to effectuate operation of the structures. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供使用热能聚合物的开关。 解决方案：基于热电聚合物112，可以构建开关结构100或相同类型的结构，例如阀，电动机或光学开关。在第一温度下，热可聚合物112可以处于第一 体积状态，并且在第二温度下，热可聚合物112可以处于第二体积状态。 热可聚合物112的体积变化可以用于推动或拉动开关，阀门，电动机，光学开关等的机械结构，以实现结构的操作。 版权所有（C）2010，JPO＆INPIT

    A method of making a microfluidic device
    55.
    发明公开
    A method of making a microfluidic device 有权
    一种制造微流体装置的方法

    公开(公告)号：EP2554510A3

    公开(公告)日：2014-07-23

    申请号：EP12177755.1

    申请日：2012-07-25

    Applicant: Teledyne Dalsa Semiconductor Inc.

    Inventor： Johnstone, Robert ,  Martel, Stéphane

    IPC: B81C1/00

    CPC classification number: B81C1/00182 ,  B81B2201/054 ,  B81C2201/019 ,  B81C2203/0735

    Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

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