公开(公告)号：US08300422B2

公开(公告)日：2012-10-30

申请号：US12762123

申请日：2010-04-16

Applicant: Osamu Nagasaki

Inventor： Osamu Nagasaki

IPC: H05K7/02 ,  H01L41/107

CPC classification number: H05K3/3468 ,  G03G15/80 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/099 ,  H05K2201/10083 ,  H05K2201/10689 ,  H05K2201/1081 ,  H05K2203/044 ,  H05K2203/046 ,  H01L2924/00

Abstract: An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.

Abstract translation: 电子设备例如包括具有电子部件和压电元件的电路板，向电子部件和压电元件中的至少一个赋予参考电位的基准电位图形以及连接到基准电极的焊接焊盘 潜在的模式。 在电路板上，电子部件在将压电元件和电子部件安装在焊锡焊盘上时位于电路基板的输送方向的下游侧，压电元件位于输送路径的上游侧 方向。

公开(公告)号：US20090124099A1

公开(公告)日：2009-05-14

申请号：US12007017

申请日：2008-01-04

Applicant: Ming-Ta Chen

Inventor： Ming-Ta Chen

IPC: H01R12/00

CPC classification number: H01R43/0256 ,  H01M10/425 ,  H05K1/116 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10818

Abstract: A printed circuit board (PCB), which can be implemented on a battery set, having a plurality of soldering holes thereon. A soldering portion and a non-soldering portion are separately arranged around each of the soldering holes on both surfaces of the PCB. Each corresponding conductive stick can respectively pierce each soldering hole and be fixed to each soldering portion of the PCB with the fused solder or move from the soldering portion to the non-soldering portion in the soldering hole. Thus, this invention provides a convenient and efficient way for assembling the PCB on the battery set or disassembling the PCB apart from the battery set.

Abstract translation: 可以在电池组上实施的印刷电路板（PCB），其上具有多个焊接孔。 焊接部分和非焊接部分分别布置在PCB的两个表面上的每个焊接孔周围。 每个相应的导电棒可以分别刺穿每个焊接孔，并用熔融焊料固定到PCB的每个焊接部分，或者从焊接部分移动到焊接孔中的非焊接部分。 因此，本发明提供了一种用于将PCB组装在电池组上或将PCB与电池组拆开的方式和有效的方式。

公开(公告)号：US07364442B2

公开(公告)日：2008-04-29

申请号：US11783182

申请日：2007-04-06

Applicant: Won-Kyu Bang ,  Myoung-Kon Kim

Inventor： Won-Kyu Bang ,  Myoung-Kon Kim

IPC: H01R4/66

CPC classification number: H05K1/116 ,  H05K1/0213 ,  H05K1/0215 ,  H05K1/119 ,  H05K7/142 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10863 ,  Y10S439/947

Abstract: A fixing structure for a circuit board includes at least one board mounting hole in the circuit board, the board mounting hole having a guide hole and an insertion hole, and at least one board mounting member inserted through the board mounting hole, the board mounting member having a main body, a cover, and an insertion portion therebetween, wherein the insertion portion has a cross-sectional area smaller than either of the main body or the cover and is capable of fitting in the insertion hole of the board mounting hole.

Abstract translation: 电路板的固定结构包括电路板中的至少一个电路板安装孔，具有引导孔和插入孔的电路板安装孔以及插入板安装孔的至少一个电路板安装构件，板安装构件 在其间具有主体，盖和插入部分，其中插入部分的横截面面积小于主体或盖子的横截面面积，并且能够装配在板安装孔的插入孔中。

公开(公告)号：US20060255147A1

公开(公告)日：2006-11-16

申请号：US11442698

申请日：2006-05-26

Applicant: William Havens ,  Robert Hennick ,  John Izzo ,  Michael Robinson

Inventor： William Havens ,  Robert Hennick ,  John Izzo ,  Michael Robinson

IPC: G06K7/10

CPC classification number: G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/10861 ,  G06K7/14 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: An indicia decoding device can have an image sensor and a laser diode assembly configured to project laser light onto a substrate. When a trigger signal is received by the indicia decoding device, the device can calculate a delay and enable the laser diode assembly if a delay threshold is satisfied. The indicia decoding device, in one embodiment, can include a hand held housing and an imaging module carrying the image sensor.

Abstract translation: 标记解码装置可以具有被配置为将激光投射到基板上的图像传感器和激光二极管组件。 当标记解码装置接收到触发信号时，如果延迟阈值被满足，则该装置可以计算延迟并启用激光二极管组件。 在一个实施例中，标记解码装置可以包括手持外壳和承载图像传感器的成像模块。

公开(公告)号：US07055747B2

公开(公告)日：2006-06-06

申请号：US10252484

申请日：2002-09-23

Applicant: William H. Havens ,  Robert J. Hennick ,  John Izzo ,  Michael Robinson

Inventor： William H. Havens ,  Robert J. Hennick ,  John Izzo ,  Michael Robinson

IPC: G02B26/08

CPC classification number: G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/10861 ,  G06K7/14 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: An indicia decoding device can have an image sensor and a laser diode assembly configured to project laser light onto a substrate. When a trigger signal is received by the indicia decoding device, the device can calculate a delay and enable the laser diode assembly if a delay threshold is satisfied. The indicia decoding device, in one embodiment, can include a hand held housing and an imaging module carrying the image sensor.

公开(公告)号：US20040035933A1

公开(公告)日：2004-02-26

申请号：US10440729

申请日：2003-05-19

Inventor： William H. Havens ,  Robert J. Hennick ,  John Izzo ,  Michael Robinson

IPC: G06K007/10 ,  G06K007/14

CPC classification number: G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/10861 ,  G06K7/14 ,  H05K1/116 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: An optical reader including an image sensor, imaging optics, a short range aiming assembly, and a long range aiming assembly. The short range aiming assembly may comprise a plurality of LEDs. The long range aiming assembly may comprise a laser diode assembly which projects an aiming pattern that is readily visible at reading distances of several feet. The optical reader can be configured so that long range aiming assembly is enabled or disabled depending upon a present operating condition.

Abstract translation: 包括图像传感器，成像光学元件，短距离瞄准组件和远程瞄准组件的光学读取器。 短距离瞄准组件可以包括多个LED。 长距离瞄准组件可以包括激光二极管组件，其投射在几英尺的读取距离处容易看见的瞄准图案。 光学读取器可以被配置为使得远程瞄准组件被启用或禁用，这取决于当前的操作条件。

公开(公告)号：US06290118B1

公开(公告)日：2001-09-18

申请号：US09499761

申请日：2000-02-08

Applicant: Masayoshi Muramatsu ,  Kenichi Watanabe

Inventor： Masayoshi Muramatsu ,  Kenichi Watanabe

IPC: B23K3100

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09463 ,  H05K2201/09854 ,  H05K2201/10969

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract translation: 一对烙铁以预定间隔固定在滑板上。 烙铁一体地移动，以相对于传送带沿矩形方向往复运动。 其中一个烙铁被传送到传送带的工作位置，另一个与传送带分离。 虽然其中一个烙铁焊接电路板，另一个被清洁。 电路板具有插入和焊接金属板的狭缝。 对于狭缝，设置由主焊盘和副焊盘构成的焊接区域。 主槽沿着狭缝的较长一侧形成。 子区域沿着狭缝的较短侧从主体区域延伸。 焊缝不会形成在狭缝周围，因此当电路板浸焊时狭缝不被焊料封闭。

公开(公告)号：US20010007373A1

公开(公告)日：2001-07-12

申请号：US09754836

申请日：2001-01-04

Inventor： Yoshinori Kadota ,  Yutaka Furukawa ,  Yoshiki Sota ,  Hiroyuki Juso

IPC: H01L029/40 ,  H01L021/44 ,  H01L023/48 ,  H01L023/52

CPC classification number: H05K1/116 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09463 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A tape carrier for a semiconductor device comprising a flexible insulation tape having via holes for a solder ball, a metal wiring layer formed on one surface of the insulation tape, the via halls for the solder balls having an opening on the other surface of the insulating tape, and a metal brace formed on the periphery of the opening of the respective via holes, wherein the metal brace is formed in a ring-shape provided with a cutout opening having a width up to 4% of the circumferential length of the periphery, or comprises a plurality of arcuate shape portions, such that gaps are simetorically provided and positioned between the arcuate shape portions,, and that the total width of the gaps is up to 40% of the circumferential length of the periphery, and wherein the metal braces have a surface to which Ni plating is applied, and Au plating is applied to the Ni plating.

Abstract translation: 一种用于半导体器件的带载体，包括具有用于焊球的通孔的柔性绝缘带，形成在绝缘带的一个表面上的金属布线层，用于焊球的通孔大厅在绝缘的另一表面上具有开口 磁带和形成在各个通孔的开口的周边上的金属支架，其中金属支架形成为具有宽度高达周边的周向长度的4％的切口的环形， 或者包括多个弧形形状部分，使得间隙被拟合地设置并定位在弧形形状部分之间，并且间隙的总宽度高达周边周向长度的40％，并且其中金属支架 具有施加Ni电镀的表面，并且对Ni镀层施加Au镀层。

公开(公告)号：US4556759A

公开(公告)日：1985-12-03

申请号：US627131

申请日：1984-07-02

Applicant: Ralph E. Iadarola

Inventor： Ralph E. Iadarola

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K1/00

CPC classification number: H05K1/116 ,  H05K2201/09463 ,  H05K2201/09545 ,  H05K3/3447 ,  H05K3/429

Abstract: A multi-layer printed circuit board (21) has through holes (15-17) which are plated without conventional pads. This avoids circuit board rejections which would occur from cosmetic defects resulting from incomplete solder coverage of the pads and from pad lifting. In order to provide the through holes (15-17) with an adequate supply of solder during solder operations, wicks (45) are provided for each through hole (15-16) which is isolated from circuit traces (37, 38) on the exterior surface (33) of the printed circuit board (21). If the through hole (17) is connected to a circuit trace (38) on the exterior surface (33), then a connecting run (48) is used to provide wicking action in lieu of a tab (45).

Abstract translation: 多层印刷电路板（21）具有通孔（15-17），其中没有常规垫片。 这避免了由于焊盘不完全的焊料覆盖和焊盘提升而导致的化妆品缺陷的电路板排除。 为了在焊接操作期间为通孔（15-17）提供足够的焊料供应，为每个通孔（15-16）提供灯芯（45），该通孔（15-16）与电路迹线（37,38）隔离， 印刷电路板（21）的外表面（33）。 如果通孔（17）连接到外表面（33）上的电路迹线（38），则连接线（48）用于提供芯吸作用以代替突片（45）。

公开(公告)号：US3567844A

公开(公告)日：1971-03-02

申请号：US3567844D

申请日：1969-06-23

Applicant: MC DONNELL DOUGLAS CORP

Inventor： KRCMAR LUDWIG L

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/34 ,  H05K3/32

CPC classification number: H05K3/3447 ,  H05K1/092 ,  H05K1/116 ,  H05K3/3468 ,  H05K2201/09463 ,  H05K2203/044

Abstract: Printed terminal pad structure is formed on a circuit board or substrate surface around and adjacent to the periphery of a terminal pin opening, the pad structure being characterized by a radially extending slot of appropriate width therein to prevent the pin opening from being plugged during a subsequent dip soldering process when a coating of solder is applied to the exposed surface of the pad structure. A solder-coated terminal pad around a solder-free terminal pin opening is thus obtained from the printed terminal pad structure.