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    APPARATUS FOR ELECTRICALLY CONNECTING A FLEXIBLE CIRCUIT TO A RECEIVER
    51.
    发明公开
    APPARATUS FOR ELECTRICALLY CONNECTING A FLEXIBLE CIRCUIT TO A RECEIVER 有权
    设备以用于电连接柔性电路到接收器

    公开(公告)号：EP2856564A4

    公开(公告)日：2016-01-06

    申请号：EP13798145

    申请日：2013-03-05

    Applicant: HI REL CONNECTORS INC

    Inventor： RITNER WILLIAM

    IPC: H01R12/79 ,  H01R13/52 ,  H05K3/36

    CPC classification number: H01R12/771 ,  H01R12/79 ,  H01R13/193 ,  H01R13/5219 ,  H05K3/365 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/10303

    Abstract: An electrical assembly combination includes (a) a receiver having a receiver housing and a plurality of receiver housing electrical contacts, and (b) a connector device comprising a connector housing capable of accepting and retaining a terminal end of a flexible assembly having a plurality of flexible assembly electrical contacts. The connector device is capable of being reversibly attached to the receiver housing such that each of the receiver housing electrical contacts is electrically connected to a flexible assembly electrical contact in a removable, non-permanent manner.

    Abstract translation: 的电气组件的组合包括（a）具有一个接收器外壳和接收器外壳电接触的多个，并且一个接收器（b）中的连接器装置，其包括能够接纳和保持具有多个A挠性组件的末端的连接器壳体 柔性装配的电接触。 该连接器装置能够被可逆地附连到接收器外壳搜索做每个接收器外壳的电触点的电连接到在可移除的，非永久的方式一个柔性装配电接触。

    FUSION BONDED ASSEMBLY WITH ATTACHED LEADS
    54.
    发明公开
    FUSION BONDED ASSEMBLY WITH ATTACHED LEADS 审中-公开
    带有连接导线的FUSION粘合组件

    公开(公告)号：EP1741323A2

    公开(公告)日：2007-01-10

    申请号：EP05713705.1

    申请日：2005-02-17

    Applicant: Merrimac Industries, Inc.

    Inventor： LAURIELLO, Philip, J.

    IPC: H05K1/03

    CPC classification number: H05K3/4092 ,  H05K3/328 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/1034 ,  Y10T29/49126

    Abstract: A signal processing module (100) can be manufactured from a plurality of composite substrate layers (104-106), each substrate layer includes elements of multiple individual processing modules. Surfaces of the layers are selectively metalicized to form signal processing elements when the substrate layers (104-406) are fusion bonded in a stacked arrangement. Prior to bonding, the substrate layers are milled to form gaps located at regions between the processing modules. Prior to bonding, the leads (110) are positioned such that they extend from signal coupling points on said metalicized surfaces into the gap regions. The substrate layers (104-106) are then fusion bonded to each other such that the plurality of substrate layers (104-106) form signal processing modules (100) with leads (110) that extend from an interior of the modules into the gap areas. The individual modules (100) may then be separated by milling the substrate layers to de-panel the modules.

    Abstract translation: 信号处理模块（100）可以由多个复合衬底层（104-106）制造，每个衬底层包括多个单独处理模块的元件。 当衬底层（104-406）以层叠布置熔接时，层的表面被选择性地金属化以形成信号处理元件。 在结合之前，研磨衬底层以形成位于处理模块之间区域的间隙。 在键合之前，引线（110）被定位成使得它们从所述金属化表面上的信号耦合点延伸到间隙区域中。 然后将衬底层（104-106）彼此熔接，使得多个衬底层（104-106）形成具有引线（110）的信号处理模块（100），引线（110）从模块的内部延伸到间隙 区域。 然后可以通过研磨衬底层来分离各个模块（100）以去除模块的面板。

    Electrically connectable module
    56.
    发明公开
    Electrically connectable module 失效
    Elektrisch verbindbares模块

    公开(公告)号：EP0520740A1

    公开(公告)日：1992-12-30

    申请号：EP92305752.5

    申请日：1992-06-23

    Applicant: XEROX CORPORATION

    Inventor： Mantell, David Allen

    IPC: H05K3/10 ,  H01B5/16 ,  H01L23/538

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R13/03 ,  H01R29/00 ,  H05K3/105 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10S428/901 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49224 ,  H01L2924/00

    Abstract: An electrically connectable module is manufactured from a substrate (s) of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a fibre-doped substrate (s). One end (12) of an electrical connector (10) is embedded in the fibre-doped substrate (s) to locate the one end (12) adjacent the surface (14) of the substrate (s) while exposing an opposite end (16) of the electrical connector (10). The surface (14) of the fibre-doped substrate (s) is locally heated preferably with a laser to form a conductive trace (20) by the in-situ heat conversion of the electrically insulating fibrous filler, the localised heating including the one end (12) of the electrical connector (10) to electrically connect the electrical connector (10) to the conductive trace. In another embodiment, a conductive material is electrodeposited on the conductive trace (20) by applying a voltage to the opposite end (16) of the electrical connector (10). The substrate (s) is moulded into a desired shape to form the module, and a plurality of electrical connectors (10) can be embedded into the substrate (s) in any one of several different standardised arrangements.

    Abstract translation: 可电连接的模块由掺杂有电绝缘纤维填料的电绝缘聚合物基体的基底制成，该电绝缘纤维填料能够热转化成导电纤维填料以形成掺杂纤维的基底。 电连接器（10）的一端（12）嵌入在光纤掺杂衬底中，以使一端（12）邻近衬底的表面（14），同时暴露出相对端（16 ）电连接器（10）。 纤维掺杂衬底的表面（14）优选通过激光局部加热，以通过电绝缘纤维填料的原位热转化形成导电迹线（20），局部加热包括一端 （10）的电连接器（10）的电连接器（10）与导电迹线电连接。 在另一个实施例中，通过向电连接器（10）的相对端（16）施加电压，将导电材料电沉积在导电迹线（20）上。 将基底模制成所需的形状以形成模块，并且多个电连接器（10）可以以几种不同的标准化布置中的任何一种嵌入到基底中。

    REDUCED LENGTH MEMORY CARD
    59.
    发明公开
    REDUCED LENGTH MEMORY CARD 审中-公开
    SPEICHERKARTE MIT REDUZIERTERLÄNGE

    公开(公告)号：EP2982225A1

    公开(公告)日：2016-02-10

    申请号：EP14779796.3

    申请日：2014-04-04

    Applicant: PNY Technologies, Inc.

    Inventor： STONE, Robert ,  PLUCHINO, Joseph

    IPC: H05K1/14

    CPC classification number: G06F1/185 ,  G06K19/07732 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999

    Abstract: A reduced length memory card is provided. The memory card, comprising a memory circuit, a housing for said memory circuit, said housing defining a first end, a second end opposite the first end and insertable into a port of a digital device, and opposing sidewalls between the first end and the second end, and a plurality of electrical contacts in electrical communication with said memory circuit, said contacts exposed through apertures formed in a bottom surface of the housing extending between the first end and the second end.

    Abstract translation: 提供了缩小的存储卡。 所述存储卡包括存储器电路，用于所述存储器电路的壳体，所述壳体限定第一端，与所述第一端相对的第二端，并且可插入数字设备的端口中，以及所述第一端与所述第二端之间的相对的侧壁 端部以及与所述存储器电路电连通的多个电触点，所述触点通过形成在壳体的底表面中的孔在第一端和第二端之间暴露，其中存储卡与安全数字 （SD）标准，并且其中在第一端和第二端之间延伸的卡的长度小于在相对侧壁之间延伸的卡的宽度。 存储器可以包括沿着卡的第一端的提取脊，并且当卡被插入数字设备的端口时被暴露。

    ELEKTRONISCHE ANORDNUNG MIT LEITERPLATTE
    60.
    发明公开
    ELEKTRONISCHE ANORDNUNG MIT LEITERPLATTE 审中-公开

    公开(公告)号：EP2929762A1

    公开(公告)日：2015-10-14

    申请号：EP13774673.1

    申请日：2013-10-11

    Applicant: Robert Bosch GmbH

    Inventor： GUECKEL, Richard ,  KROECKEL, Markus

    IPC: H05K5/00 ,  H05K1/11

    CPC classification number: H05K7/1417 ,  H05K1/117 ,  H05K5/006 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/09754

    Abstract: The invention relates to an electronic arrangement having a directly contactable circuit board (2), said electronic arrangement comprising: a circuit board (2) that includes at least one electric contact for electric contacting, a housing (3) inside which the circuit board (2) is arranged, and a plug shroud (33) that is arranged on the housing (3). The circuit board (2) includes a first circuit board half (24) that has a support (4) for supporting the circuit board (4), and a second circuit board half (25). The circuit board (2) is supported on the support (4) in such a way that the support (4) defines a swivel region, in particular a swivel axis of the circuit board (2), about which the circuit board (2) can swivel.

    Abstract translation: 本发明涉及一种具有可直接接触的电路板（2）的电子装置，所述电子装置包括：电路板（2），包括至少一个用于电接触的电触头，壳体（3），电路板 2）布置，并且布置在壳体（3）上的塞子罩（33）。 电路板（2）包括具有用于支撑电路板（4）的支撑件（4）和第二电路板半部（25）的第一电路板半部（24）。 电路板（2）被支撑在支撑件（4）上，使得支撑件（4）限定了电路板（2）的旋转区域，特别是电路板（2）的旋转轴线， 可以旋转。

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