公开(公告)号：US20100304580A1

公开(公告)日：2010-12-02

申请号：US12454908

申请日：2009-05-26

Applicant: Thomas Baycura

Inventor： Thomas Baycura

IPC: H01R12/00 ,  H05K3/34

CPC classification number: H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/049 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09963 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/167 ,  Y10T29/49144

Abstract: An apparatus and method of providing an electrical component interface is disclosed. For one embodiment, the electrical component interface includes an electrical component adapter. The electrical component adapter includes an electronic component solder pattern for receiving and allowing attachment of an electrical component. An adhesive backing is adjacent a surface of the electrical component adapter. The adhesive backing provides attachment of the electrical component adapter to a second surface.

Abstract translation: 公开了一种提供电气部件接口的装​​置和方法。 对于一个实施例，电气部件接口包括电气部件适配器。 电气部件适配器包括用于接收和允许电气部件的附接的电子部件焊接图案。 粘合剂背衬邻近电气部件适配器的表面。 粘合背衬提供电气部件适配器附接到第二表面。

公开(公告)号：US20100142198A1

公开(公告)日：2010-06-10

申请号：US12331383

申请日：2008-12-09

Applicant: Chih-Wen Yang

Inventor： Chih-Wen Yang

IPC: F21V21/00 ,  F21K7/00

CPC classification number: F21S2/005 ,  F21V21/08 ,  F21V21/088 ,  F21V21/35 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K1/142 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/10325

Abstract: A configurable light emitting system includes a plurality of light emitting units, at least a first external conductor, and at least a second external conductor. Each of the light emitting units includes an anode, a cathode, a first electrical contact electrically connected to the anode, and a second electrical contact electrically connected to the cathode. The first external conductor is electrically connected to the first electrical contact of each of the light emitting unit, and configured to supply a positive voltage thereto. The second external conductor is electrically connected to the second electrical contact of each of the light emitting unit, and configured to supply a negative voltage thereto. The plurality of the light emitting units are configured as a tile structure or a brick structure, and are electrically connected together through the first external conductor and second external conductor.

Abstract translation: 可配置的发光系统包括多个发光单元，至少第一外部导体和至少第二外部导体。 每个发光单元包括阳极，阴极，电连接到阳极的第一电触点和电连接到阴极的第二电触点。 第一外部导体电连接到每个发光单元的第一电触点，并且被配置为向其提供正电压。 第二外部导体电连接到每个发光单元的第二电触点，并且被配置为向其提供负电压。 多个发光单元被构造为瓦片结构或砖结构，并且通过第一外部导体和第二外部导体电连接在一起。

公开(公告)号：US20080068816A1

公开(公告)日：2008-03-20

申请号：US11788369

申请日：2007-04-18

Applicant: In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

Inventor： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

IPC: H05K7/00 ,  H01R11/30

CPC classification number: H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

Abstract: Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

Abstract translation: 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。

公开(公告)号：US07281931B2

公开(公告)日：2007-10-16

申请号：US10897465

申请日：2004-07-23

Applicant: Nagao Miyazaki ,  Yoshihiko Suzuki

Inventor： Nagao Miyazaki ,  Yoshihiko Suzuki

IPC: H01R4/58

CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

Abstract translation: 在将电气单元与其相对的接合面电连接的结构中，在每个电三维单元的功能元件形成表面上形成与变形量规电连接的布线图案，并延伸到形成在功能元件之间的边缘部分， 元件形成表面和相邻布线表面作为接合表面以形成第一焊盘; 在与第一焊盘对应的布线面的位置处形成从边缘部延伸规定距离的第二焊盘; 并且形成在被压在一起时显示接合性能的电连接器，以在与第一和第二焊盘保持紧密接触的同时桥接第一和第二焊盘。 多个三维电气单元可以以高精度牢固且容易地彼此电连接。

公开(公告)号：US20070158799A1

公开(公告)日：2007-07-12

申请号：US11322017

申请日：2005-12-29

Applicant: Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Meng-Ju Tsai

Inventor： Chin-Tien Chiu ,  Cheemen Yu ,  Hem Takiar ,  Jack Chien ,  Meng-Ju Tsai

IPC: H01L23/02

CPC classification number: H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/142 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/1053 ,  H05K2201/10727 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract translation: 公开了一种电子部件，其包括以并排配置焊接在一起的多个半导体封装。 包装在基板上进行批量处理。 面板包括穿过面板钻出的多个通孔，随后填充有诸如铜或金的金属。 这些填充的通孔沿着相邻封装之间的切割线位于相邻封装之间的切割线处，使得在分离时，填充的通孔被切割并且一部分填充的通孔在单个封装的侧边缘处露出。 填充的通孔的这些暴露部分形成垂直表面贴装技术（SMT）焊盘。 在半导体封装被单个化并且SMT焊盘限定在侧边缘之后，使用SMT来将第一半导体封装的SMT焊盘焊接到第二半导体封装的相应SMT焊盘，以将两个封装结合和电耦合在一起 旁边。

公开(公告)号：US07203074B1

公开(公告)日：2007-04-10

申请号：US10738405

申请日：2003-12-16

Applicant: Andrew Yaung ,  Neal S. Greenberg ,  Che Wai Yeung

Inventor： Andrew Yaung ,  Neal S. Greenberg ,  Che Wai Yeung

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/1059 ,  Y10T29/49126

Abstract: Electronic Circuit Building Blocks are mechanically connected to each other to form larger circuit boards using a mechanical bridge connector. The Electronic Circuit Building Blocks include female interlocking elements formed on its edges, and the mechanical bridge connector includes male interlocking elements. Half parts of the male interlocking elements of the mechanical bridge connector are inserted into the corresponding female interlocking elements of the Electronic Circuit Building Blocks from one side of the circuit board. The Electronic Circuit Building Blocks include through-holes for mounting through-hole components and/or surface-mount pads for mounting surface-mount components. The Electronic Circuit Building Blocks also include traces interconnecting two or more of the through-hole components and the surface-mount components.

Abstract translation: 电子电路构建块彼此机械连接，以使用机械桥连接器形成较大的电路板。 电子电路构建块包括形成在其边缘上的阴互锁元件，机械桥连接器包括阳互锁元件。 机械桥连接器的阳联锁元件的半部分从电路板的一侧插入到电子电路构件的相应的阴互锁元件中。 电子电路构建块包括用于安装通孔部件的通孔和/或用于安装表面安装部件的表面安装焊盘。 电子电路构建块还包括将两个或多个通孔部件和表面安装部件相互连接的迹线。

公开(公告)号：US20060172614A1

公开(公告)日：2006-08-03

申请号：US11051393

申请日：2005-02-03

Applicant: Sang Ta

Inventor： Sang Ta

IPC: H01R4/48

CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K2201/09963 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2203/173

Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said Blocks, when joined together with other Blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other Blocks.

Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于并且可重用于原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

公开(公告)号：US5472828A

公开(公告)日：1995-12-05

申请号：US193660

申请日：1994-02-07

Applicant: Rickey D. Akins ,  John Walvoord

Inventor： Rickey D. Akins ,  John Walvoord

IPC: B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  G03F7/20 ,  G03F7/24 ,  H01Q1/42 ,  H01Q15/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06

CPC classification number: H01Q15/0013 ,  B23K26/032 ,  B23K26/066 ,  G03F7/2053 ,  G03F7/24 ,  H01Q1/425 ,  H05K3/027 ,  H05K2201/09018 ,  H05K2201/09963 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/061 ,  Y10S430/146

Abstract: In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

Abstract translation: 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 衬底包括底层和金属化层。 通过将元件烧蚀成抗蚀剂涂层或用相干光源将元件烧蚀到金属化层中来形成图案的至少第一元件。 相干光源优选地包括准分子激光器。 然后将衬底相对于相干光源移位，直到预定图案的所有元件形成在衬底的整个表面上。 当图案被烧蚀到抗蚀剂材料中时，使用蚀刻技术从基底去除金属化层的部分。

公开(公告)号：WO2010028006A3

公开(公告)日：2010-07-01

申请号：PCT/US2009055678

申请日：2009-09-02

Applicant: USG INTERIORS INC ,  BOSS DANIEL ,  QUALLS SCOTT ,  MCDONALD DAVID ,  KAISERMAN TERRANCE Z ,  MARGOLIN KEITH J ,  WASSIEF MICHAEL ,  CHAI LIANG

Inventor： BOSS DANIEL ,  QUALLS SCOTT ,  MCDONALD DAVID ,  KAISERMAN TERRANCE Z ,  MARGOLIN KEITH J ,  WASSIEF MICHAEL ,  CHAI LIANG

IPC: H01B3/00

CPC classification number: H01H59/00 ,  H01B5/02 ,  H01B13/165 ,  H01H49/00 ,  H01R4/2404 ,  H01R25/147 ,  H05K3/103 ,  H05K2201/09672 ,  H05K2201/09963 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T307/74

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract translation: 提供包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体上，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其供电，并且电气设备可以连接在第一和第二导体的两端。

公开(公告)号：WO2009028906A3

公开(公告)日：2009-04-30

申请号：PCT/KR2008005093

申请日：2008-08-29

Applicant: LG ELECTRONICS INC ,  LG INNOTEK CO LTD ,  KIM YONG SUK ,  HUR HOON

Inventor： KIM YONG SUK ,  HUR HOON

IPC: G02F1/13357

CPC classification number: H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

Abstract: Disclosed are a light emitting unit and a liquid crystal display device using the same. The light emitting unit includes a circuit board including circuit lines and a plurality of connecting members, and a plurality of unit modules connected to the connecting members of the circuit board. The unit module includes at least one light emitting device.

Abstract translation: 公开了一种发光单元和使用该发光单元的液晶显示装置。 发光单元包括具有电路线和多个连接构件的电路板以及连接到电路板的连接构件的多个单元模块。 单元模块包括至少一个发光器件。