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    Printed board unit
    51.
    发明专利
    Printed board unit 审中-公开
    打印板单元

    公开(公告)号：JP2007317806A

    公开(公告)日：2007-12-06

    申请号：JP2006144702

    申请日：2006-05-24

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： MATSUI AKIKO

    IPC: H05K1/18 ,  H05K3/46

    CPC classification number: H05K1/183 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0228

    Abstract: PROBLEM TO BE SOLVED: To provide a printed board unit, capable of ensuring a bonding strength of a solder and through-hole without changing the length of a terminal. SOLUTION: In a main board unit 13, the thickness of a printed board 14 is partially decreased based on a depression 15. Even when a length of a terminal 19 is smaller than an original thickness of the printed board 14, a distal end of the terminal 19 can protrude from the rear face of the printed board 14. The length of the terminal 19 need not be changed. Moreover, the bonding strength of a solder 21 and a through-hole 18 is amply ensured, by an operation of a fillet 22 around the terminal 19. The terminal 19 is bonded to the through-hole 18 at a sufficient strength. An omission of an electronic part 14 can be avoided from the printed board 14. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够确保焊料和通孔的接合强度而不改变端子长度的印刷电路板单元。 解决方案：在主板单元13中，印刷电路板14的厚度基于凹陷部分15部分地减小。即使当端子19的长度小于印刷电路板14的原始厚度时， 端子19的端部可以从印刷电路板14的后表面突出。端子19的长度不需要改变。 此外，通过端子19周围的圆角22的操作，确保了焊料21和通孔18的接合强度。端子19以足够的强度结合到通孔18。 可以避免印刷电路板14省略电子部件14.版权所有：（C）2008，JPO＆INPIT

    Pitch changing connector and its manufacturing method
    53.
    发明专利
    Pitch changing connector and its manufacturing method 审中-公开
    PITCH CHANGING连接器及其制造方法

    公开(公告)号：JP2006253014A

    公开(公告)日：2006-09-21

    申请号：JP2005069291

    申请日：2005-03-11

    Applicant: Tyco Electronics Amp Kk ,  タイコエレクトロニクスアンプ株式会社

    Inventor： SAKAMOTO KATSUHIKO ,  KUROKAWA NORIHARU

    IPC: H01R31/08 ,  H01R24/00 ,  H01R43/00

    CPC classification number: H01R13/2414 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10704

    Abstract: PROBLEM TO BE SOLVED: To provide a pitch changing connector and its manufacturing method which is easy to manufacture, having no deformation to the heat applied from the outside and with high reliability in electrical connection. SOLUTION: The pitch changing connector 1 is provided with a ceramic substrate in which a plurality of green sheets formed with numerous conductive paths on one face of a rectangular ceramic green sheet are laminated and calcined in the same direction in thickness direction of the green sheet so that it may become from a narrow pitch to a wide pitch from one one side edge to the other side edge. Electrodes 4a, 4b are formed on the numerous conductive paths exposed on one edge side and the other edge side of the ceramic substrate. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种易于制造的俯仰改变连接器及其制造方法，其对从外部施加的热没有变形，并且在电连接中具有高可靠性。 变压连接器1设置有陶瓷基板，其中在矩形陶瓷生片的一个表面上形成有多个导电路径的多个生坯层压并沿相同方向在厚度方向上煅烧 使得它可以从一个侧边缘到另一个侧边缘从窄的间距变成宽的间距。 电极4a，4b形成在暴露在陶瓷基板的一个边缘侧和另一个边缘侧的多个导电路径上。 版权所有（C）2006，JPO＆NCIPI

    Mounting method of electronic component
    54.
    发明专利
    Mounting method of electronic component 审中-公开
    电子元件的安装方法

    公开(公告)号：JP2014187177A

    公开(公告)日：2014-10-02

    申请号：JP2013060964

    申请日：2013-03-22

    Applicant: Fujitsu Ltd ,  富士通株式会社

    Inventor： MURATA YOKO

    IPC: H05K3/34 ,  H05K1/18

    CPC classification number: H05K3/306 ,  H05K3/3447 ,  H05K2201/10704 ,  H05K2203/0182 ,  Y10T29/49139

    Abstract: PROBLEM TO BE SOLVED: To provide a mounting method of an electronic component which improves joint reliability achieved when a terminal of an electronic component is welded to a through hole by a solder paste applied to the through hole.SOLUTION: In a mounting method of an electronic component, a solder paste is applied to a through hole of a printed circuit board on which an electronic component is mounted. The electronic component is placed on the printed circuit board in a state where a restriction member, which restricts a terminal of the electronic component from moving into the through hole, is sandwiched between the electronic component and the printed circuit board. Then, reflow soldering is performed at a temperature, at which the restriction member is melted, to weld the terminal into the through hole by the solder paste.

    Abstract translation: 要解决的问题：提供一种电子部件的安装方法，其通过施加到通孔的焊膏将电子部件的端子焊接到通孔时提高了接合可靠性。解决方案： 电子部件，将焊膏施加到其上安装有电子部件的印刷电路板的通孔。 在限制电子部件的端子移动到通孔中的限制部件被夹在电子部件和印刷电路板之间的状态下，将电子部件放置在印刷电路板上。 然后，在限制部件熔化的温度下进行回流焊接，通过焊膏将端子焊接到通孔中。

    Lsi package with interface module and interposer used for it, interface module, connecting monitor circuit and signal processing lsi
    57.
    发明专利
    Lsi package with interface module and interposer used for it, interface module, connecting monitor circuit and signal processing lsi 有权
    具有接口模块的LSI封装和用于其的接口模块，连接监视器电路和信号处理LSI

    公开(公告)号：JP2005197316A

    公开(公告)日：2005-07-21

    申请号：JP2003435836

    申请日：2003-12-26

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： FURUYAMA HIDETO ,  HAMAZAKI HIROSHI

    IPC: G02B6/42 ,  H01L23/12 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L25/10 ,  H01L25/16 ,  H01L31/0232 ,  H05K1/02 ,  H05K1/14 ,  H05K7/02

    CPC classification number: H01L23/49827 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0268 ,  H05K1/141 ,  H05K7/023 ,  H05K2201/049 ,  H05K2201/10704 ,  H05K2201/10719 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an LSI package with an interface module capable of being produced by an existing production line and having no complication of a structure, an interposer, the interface module, a connecting monitor circuit and a signal processing LSI. SOLUTION: The interface module 4 has the signal processing LSI 1, and the interposer 2 on which the LSI is loaded and which has interposer-side electrical connecting terminals 3a to 3x and interposer-side monitor terminals. The interface module 4 further has interface-module side electrical connecting terminals 5a to 5x and interface-module side monitor terminals 12a to 12d mechanically brought into contact with the interposer-side electrical connecting terminals and the interposer-side monitor terminals, respectively. The electrical connections of the interposer-side electrical connecting terminals and the interface-module side electrical connecting terminals are confirmed by the interposer-side monitor terminals and the interface-module side monitor terminals. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供具有能够由现有生产线生产并且不具有结构复杂性的接口模块的LSI封装，插入器，接口模块，连接监视器电路和信号处理LSI 。 解决方案：接口模块4具有信号处理LSI1和其上装载有LSI的插入器2，并且具有插入器侧电连接端子3a至3x和插入器侧监视器端子。 接口模块4还具有分别与插入器侧电连接端子和插入器侧监视器端子机械地接触的接口模块侧电连接端子5a至5x和接口模块侧监视器端子12a至12d。 插入器侧电连接端子和接口模块侧电气连接端子的电气连接由插入器侧监视器端子和接口模块侧监视器端子确认。 版权所有（C）2005，JPO＆NCIPI

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