Abstract:
LED devices having high-quality single crystal ZnO structures for spreading currents and extracting light out of the LEDs are disclosed. In one aspect, a LED device is provided to include a substrate; a first semiconductor layer exhibiting a first conductivity type and formed over the substrate; an active light-emitting structure formed over the first semiconductor layer, the active light-emitting structure operable to emit light under electrical excitation; a second semiconductor layer exhibiting a second conductivity type and formed over the active light-emitting structure; and a single crystal ZnO structure formed over the second semiconductor layer and including a bottom single crystal ZnO portion over the second semiconductor layer and a top single crystal ZnO portion extending from the bottom single crystal ZnO portion, wherein the bottom single crystal ZnO portion is a contiguous single crystal ZnO portion without having voids.
Abstract:
A light emitting diode includes: a light emitting structure including a second semiconductor layer and a first semiconductor layer; a first electrode electrically connected to the first semiconductor layer; a current blocking layer disposed on a lower surface of the light emitting structure; and a second electrode electrically connected to the second semiconductor layer, wherein the second electrode includes a first reflective metal layer adjoining the second semiconductor layer and a second reflective metal layer covering a lower surface of the current blocking layer and a lower surface of the first reflective metal layer while adjoining a portion of the second semiconductor layer, and wherein contact resistance between the second reflective metal layer and the second semiconductor layer is higher than contact resistance between the first reflective metal layer and the second semiconductor layer.
Abstract:
A light emitting device is disclosed. The light emitting device includes a first conductive type semiconductor layer having an m-plane as a growth plane; a stacking fault suppression (SFS) layer; an active layer; and a second conductive type semiconductor layer, wherein the SFS layer has lower band-gap energy than the first nitride layer and the first nitride layer, and includes a stack structure in which a second nitride layer containing In is stacked in one or more cycles, and the second nitride layer includes a lower region and an upper region, which have a relationship satisfying Equation 1 ([Equation 1] 0.8≤R D <1.0, (R D = standard deviation of In atomic density of the upper region per unit volume (1 nm 3 )/standard deviation of In atomic density of the lower region per unit volume (1 nm 3 )).
Abstract:
The disclosed invention relates to a multifunctional photocatalytic module which includes a duct 10 having a flow cross section with long sides 11 and short sides 12; a suction port 13 and a discharge port 14, the suction port 13 and the discharge port 14 being informed on both ends of the duct; a fan 20 disposed close to the suction port in the duct, the fan introducing air from the suction port and apply pressure to the air toward the discharge port; a photocatalytic filter 40 disposed close to the discharge port in the duct; and a light source disposed between the photocatalytic filter 40 and the fan 20 and configured to radiate ultraviolet light toward the photocatalytic filter.
Abstract:
Disclosed herein is a light source device using light-emitting diodes (LEDs). Specifically, a two-sided, surface light source device is implemented with point light sources such as LEDs in a simple configuration, such that even surface light is emitted. The two-sided, surface light source device includes: a substrate on which light-emitting diodes (LEDs) are disposed as a light source; and a two-sided diffusion unit having a plate-like shape with a front side face, a back side face, and a light-receiving face that is perpendicular to the front side face and the back side face and faces the substrate. Light emitted from the light source is diffused in the diffusion unit and exits through the front side face and the back side face.
Abstract:
A light emitting diode and a method for fabricating the same. The light emitting diode includes a light emitting structure including a second conductive type semiconductor layer, a first conductive type semiconductor layer and an active layer, the light emitting structure having a second hole formed through the active layer and the second conductive type semiconductor layer to expose the first conductive type semiconductor layer; a reflective metal layer; a cover metal layer; a first insulation layer; an electrode layer disposed under the first insulation layer and covering the first insulation layer while filling a second hole; and an electrode pad disposed on the light emitting structure, wherein the light emitting structure has a first hole formed above the cover metal layer, and the electrode pad is formed on the light emitting structure above the cover metal layer.
Abstract:
Disclosed herein is a light-emitting diode including: a substrate; and at least two light-emitting cell groups positioned on the substrate and having a plurality of light-emitting cells connected to each other in series, in which the at least two light-emitting cell groups each are separately driven, spaced apart from each other at a predetermined interval to be insulated from each other, and have different areas and the light-emitting cell group includes: a plurality of light-emitting cells including first semiconductor layers, active layers, and second semiconductor layers and provided with grooves through which the first semiconductor layers are exposed; a first electrode disposed on the second semiconductor layer; an insulating layer covering the plurality of light-emitting cells to expose portions of the first electrode and the first semiconductor layer; and a connection electrode electrically connected to the exposed portions of the first electrode and first semiconductor layer.
Abstract:
Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part. Within the flip-chip type light emitting diode chip, the light emitting diode part is placed together with reverse-parallel diode part, thereby providing a light emitting diode chip exhibiting strong resistance to electrostatic discharge.
Abstract:
Exemplary embodiments of the present invention relate to a method of growing gallium nitride-based semiconductor layers through metal-organic chemical vapor deposition, including disposing a substrate in a chamber, growing a first conductivity-type gallium nitride-based semiconductor layer on the substrate at a first chamber pressure, growing a gallium nitride-based active layer on the first conductivity-type gallium nitride-based semiconductor layer at a second chamber pressure higher than the first chamber pressure, and growing a second conductivity-type gallium nitride-based semiconductor layer on the active layer at a third chamber pressure lower than the second chamber pressure.
Abstract:
Exemplary embodiments of the present invention provide a light emitting diode including light emitting units disposed on a substrate, and wires connecting the light emitting units to each other, wherein the light emitting units each include a parallelogram-shaped light emitting unit having two acute angles and two obtuse angles, or a triangular light emitting unit having three acute angles.