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公开(公告)号：KR1020090124064A
公开(公告)日：2009-12-03
申请号：KR1020080050061
申请日：2008-05-29
Applicant: 전자부품연구원
CPC classification number: H01L2224/04105 , H01L2224/19 , H01L2224/73267 , H01L2924/00012
Abstract: PURPOSE: A substrate with active device chip embedded therein and fabricating method thereof are provided to prevent the damage of chip in the polymer laminate process. CONSTITUTION: The second copper layer(120) is formed at the upper part of the polymer film(100). The first copper layer(110) is formed at the lower part of the polymeric film. A part of the polymer thin layer and the first copper layer is eliminated to form the cavity. The both sides of the first copper layer and the second copper layer are eliminated to expose the polymer film. The active device chip(200) is bonded in the second copper layer exposing inside cavity. Polymer is laminated while protecting the active device chips, and the first copper layer and the second copper layer. The third copper layer(170) is formed at the upper part of the laminated polymer(150).
Abstract translation: 目的：提供一种嵌有有源器件芯片的衬底及其制造方法，以防止聚合物层压工艺中芯片的损坏。 构成：第二铜层（120）形成在聚合物膜（100）的上部。 第一铜层（110）形成在聚合物膜的下部。 聚合物薄层和第一铜层的一部分被消除以形成空腔。 消除第一铜层和第二铜层的两面以露出聚合物膜。 有源器件芯片（200）接合在暴露在腔内的第二铜层中。 聚合物层压，同时保护有源器件芯片，以及第一铜层和第二铜层。 第三铜层（170）形成在层压聚合物（150）的上部。
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公开(公告)号：KR100648235B1
公开(公告)日：2006-11-24
申请号：KR1020050122243
申请日：2005-12-13
Applicant: 전자부품연구원
IPC: H05K3/46
Abstract: A method for manufacturing a multilayered PCB(Printed Circuit Board) is provided to reduce manufacturing time by manufacturing the multilayered PCB by using a bulk lamination process. Metal films are formed on both surfaces of plural insulation layers(10), such that plural lamination plates are formed. Through-holes are formed to penetrate the respective lamination plates. A conductive paste is condensed inside the respective through-holes, such that a conductive bump(13) is formed. A circuit pattern(14) is formed by etching the respective lamination plates. Then, the lamination plates are pressed against one another. Coating films are formed at both surfaces of the respective lamination plates between the conductive bump forming process and the circuit pattern forming process.
Abstract translation: 提供一种用于制造多层PCB（印刷电路板）的方法，以通过使用体积层压工艺制造多层PCB来减少制造时间。 在多个绝缘层（10）的两个表面上形成金属膜，从而形成多个层压板。 通孔形成为贯穿各个层压板。 导电膏在相应的通孔内冷凝，从而形成导电凸块（13）。 通过蚀刻各个层压板形成电路图案（14）。 然后，层压板相互压靠。 在导电凸点形成工艺和电路图案形成工艺之间的各个层压板的两个表面上形成涂膜。
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公开(公告)号：KR100547168B1
公开(公告)日：2006-01-31
申请号：KR1020040044047
申请日：2004-06-15
Applicant: 전자부품연구원
IPC: H01F27/245 , H01F41/00
Abstract: 본 발명은 사진 식각공정으로 후막 해상도가 우수하며, 50㎛이하의 선폭을 갖는 인덕터 패턴을 그린시트에 형성하여 인덕터가 차지하는 면적 및 체적을 줄일 수 있어 소자를 소형화시킬 수 있는 효과가 있다.
또한, 인덕터 패턴이 형성된 그린시트를 캐패시터가 형성된 그린시트들 사이에 개재해서 적층하여 소자를 형성함으로써, 외부로부터 차폐 효율이 우수해 소자의 성능을 우수히 할 수 있는 효과가 있다.
발룬, 트랜스포머, 사진식각, 인덕터, 패턴Abstract translation: 在生片上形成线宽为50μm或更小的电感器图案，并且可以减小电感器所占的面积和体积，从而可以使器件小型化。
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公开(公告)号：KR1020050118901A
公开(公告)日：2005-12-20
申请号：KR1020040044047
申请日：2004-06-15
Applicant: 전자부품연구원
IPC: H01F27/245 , H01F41/00
Abstract: 본 발명은 사진 식각공정으로 후막 해상도가 우수하며, 50㎛이하의 선폭을 갖는 인덕터 패턴을 그린시트에 형성하여 인덕터가 차지하는 면적 및 체적을 줄일 수 있어 소자를 소형화시킬 수 있는 효과가 있다.
또한, 인덕터 패턴이 형성된 그린시트를 캐패시터가 형성된 그린시트들 사이에 개재해서 적층하여 소자를 형성함으로써, 외부로부터 차폐 효율이 우수해 소자의 성능을 우수히 할 수 있는 효과가 있다.-
公开(公告)号：KR1020050072955A
公开(公告)日：2005-07-13
申请号：KR1020040001113
申请日：2004-01-08
Applicant: 전자부품연구원
IPC: H03B5/32
Abstract: 본 발명은 유전체기판 적층형 전압제어발진기에 관한 것으로서, 인덕터나, 커패시터 등의 전압 제어 발진기용 단위 소자들이 PCB기판에 칩 부품 형태로 실장되는 종래의 2차원적인 구조와는 달리, 관련 단위 소자들이 유전체 기판, 예컨대 세라믹 시트(sheet)를 적층하고 일체화시켜 3차원적인 구조로 형성함으로써, 종래와 같이 칩부품을 사용하지 않아도 되어 칩부품 비용과 그 실장 비용을 절감할 수 있고, 3차원적으로 모듈을 제조할 수 있어 그 크기를 최소화할 수 있도록 한다.
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Patent Agency Ranking
公开(公告)号：KR1020050066372A
公开(公告)日：2005-06-30
申请号：KR1020030097648
申请日：2003-12-26
Applicant: 전자부품연구원
IPC: H05K1/16
CPC classification number: H05K1/162 , H05K1/115 , H05K3/429 , H05K3/4629
Abstract: 본 발명은 이종 유전체를 이용한 내장형 캐패시터 및 그의 제조 방법에 관한 것으로, 상부 및 하부 전극 사이에 존재하는 유전체를 상대적으로 낮은 유전율을 갖는 그린시트와 상기 그린시트의 비아홀들 내부에 채워진 높은 유전율을 갖는 유전체막으로 형성함으로써, 이종 유전체를 그린시트로 제작하여 소성할 때, 발생할 수 있는 수축율과 열팽창계수 불일치에 따른 모듈기판의 휨을 염려할 필요가 없으며, 재료의 불필요한 낭비를 방지할 수 있고, 유전체 페이스트 인쇄를 이용하는 방식보다 공정이 간단하고, 일정한 두께의 형성이 가능하기 때문에 기판 내에서 특성편차를 줄일 수 있으며, 이종 유전체를 이용하여 고정전용량의 내장형 캐패시터를 제작함으로써, 소자의 소형화가 가능한 효과가 있다.
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公开(公告)号：KR1020050000182A
公开(公告)日：2005-01-03
申请号：KR1020030040777
申请日：2003-06-23
Applicant: 전자부품연구원
IPC: H03H9/46
CPC classification number: H03H9/46 , H01P1/203 , H01P1/212 , H01P11/007
Abstract: PURPOSE: A method for fabricating band pass filter is provided to obtain high resolution and accurate fine patterns by using photosensitive Ag paste to forming a conductive layer. CONSTITUTION: A filter layer(21) is formed on an upper surface of a substrate. An exposure process is performed to expose a part of the filter layer. A development process is performed to form a filter pattern by developing the exposed part of the filter layer and removing an unexposed part of the filter layer from the filter layer. A firing process for the filter layer having the filter pattern is performed. The filter pattern includes one or more unit cells having a cuneal opening.
Abstract translation: 目的：提供一种制造带通滤波器的方法，通过使用感光Ag糊来形成导电层以获得高分辨率和精确的精细图案。 构成：在基板的上表面上形成有过滤层（21）。 执行曝光处理以暴露过滤层的一部分。 通过显影过滤层的暴露部分并从过滤层去除过滤层的未曝光部分，进行显影处理以形成过滤器图案。 执行具有滤波器图案的过滤层的点火处理。 过滤器图案包括一个或多个具有密闭开口的单元电池。
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公开(公告)号：KR100447032B1
公开(公告)日：2004-09-07
申请号：KR1020020075744
申请日：2002-12-02
Applicant: 전자부품연구원
IPC: H05K3/46
Abstract: PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
Abstract translation: 目的：提供一种具有电阻器的扁平LTCC（低温共烧陶瓷）多层基板及其制造方法，以通过同时执行烧制工艺和在顶侧上层压高温烧制材料的工艺来减少表面曲率，以及 LTF陶瓷层压机的底面。 构成：电阻图案和内部电极形成在第一低温共烧绿片上。 通孔形成在第二LTF（低温燃烧）生片上。 LTF陶瓷层压机通过层压第一和第二LTF生坯片形成。 制造HTF（高温烧制）生片，并在HTF生片上形成通孔。 通过在LTF陶瓷层压机的顶侧和底侧上粘合HTF生坯片来形成多层陶瓷基板。 LTF生片和HTF生片通过压制多层陶瓷基片而统一。 多层陶瓷基板的烧成工序在800〜900℃的温度下进行。 通过清洁和抛光HTF生片来形成LTCC基片。 表面电路图案印刷在LTCC衬底上。
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公开(公告)号：KR1020040048004A
公开(公告)日：2004-06-07
申请号：KR1020020075750
申请日：2002-12-02
Applicant: 전자부품연구원
CPC classification number: H01B3/12 , C04B35/453 , C04B35/46 , C04B35/495 , C04B35/6303
Abstract: PURPOSE: Provided is a low temperature co-fired ceramic composition having a middle dielectric constant, which is excellent in a quality coefficient and a resonant frequency temperature coefficient. CONSTITUTION: The low temperature co-fired ceramic composition is produced by a process comprising the steps of: ball-milling ZnO, Nb2O5, TiO2 raw powders in the ratio of 1:1:2; calcining the milled powder at 950-1100deg.C; adding 0.1-1.0wt% of SnO2 powder to the first calcined powder and then calcining at 950-1100deg.C to obtain a second calcined powder; adding a low temperature-sintering agent to the second calcined powder and then ball-milling to obtain a mixture powder; molding the mixture powder to obtain an article; and calcining the article at 850-950deg.C.
Abstract translation: 目的：提供具有中等介电常数的低温共烧陶瓷组合物，其质量系数和共振频率温度系数优异。 构成：低温共烧陶瓷组合物通过包括以下步骤的方法制备：将ZnO，Nb 2 O 5，TiO 2原料粉末以1:1:2的比例球磨; 将研磨粉末煅烧至950-1100℃; 向第一煅烧粉末中添加0.1-1.0重量％的SnO 2粉末，然后在950-1100℃下煅烧，得到第二煅烧粉末; 向第二煅烧粉末中加入低温烧结剂，然后进行球磨，得到混合粉末; 将混合粉末成型得到制品; 并在850-950℃下煅烧文章。
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公开(公告)号：KR1020040048000A
公开(公告)日：2004-06-07
申请号：KR1020020075744
申请日：2002-12-02
Applicant: 전자부품연구원
IPC: H05K3/46
CPC classification number: H05K3/4629 , H05K1/0306 , H05K3/1225 , H05K3/429
Abstract: PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
Abstract translation: 目的：提供一种具有电阻器的扁平LTCC（低温烧结陶瓷）多层基板及其制造方法，以通过同时进行焙烧工艺和在顶侧层压高温焙烧材料的工艺来降低表面曲率， LTF陶瓷层压机的底部。 构成：在第一低温共烧生片上形成电阻图案和内部电极。 在第二LTF（低温烧制）生坯上形成通孔。 通过层叠第一和第二LTF生片形成LTF陶瓷层压机。 制造HTF（高温烧制）生片，在HTF生片上形成通孔。 通过将HTF生片粘接在LTF陶瓷层压机的顶侧和底侧上来形成多层陶瓷基板。 通过挤压多层陶瓷基板将LTF生片和HTF生片均匀化。 多层陶瓷基板的烧成工序在800〜900℃的温度下进行。 通过清洗和研磨HTF生片来形成LTCC基片。 表面电路图案印刷在LTCC基板上。
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