公开(公告)号：JP2005227525A

公开(公告)日：2005-08-25

申请号：JP2004035973

申请日：2004-02-13

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  IWABUCHI TOMOKO ,  NISHIO HISAHIRO ,  KAJITA TORU

IPC: G03F7/031 ,  G02B5/20 ,  G02F1/13 ,  G02F1/1339 ,  G03F7/038

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high sensitivity, capable of faithfully reproducing the design sizes of a mask pattern, excellent in adhesiveness to a substrate, capable of achieving a satisfactory space shape and thickness even with a light exposure of ≤1,500 J/m 2 , and capable of forming spacers for a display panel excellent also in compressive strength and rubbing resistance. SOLUTION: The radiation sensitive resin composition contains as essential components a copolymer of (a1) an unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride, (a2) an epoxy-containing unsaturated compound and (a3) another unsaturated compound, a polymerizable compound having an ethylenically unsaturated bond, and a compound represented by formula (1) or formula (2). In the formulae (1) and (2), R 1 denotes alkyl or phenyl; R 2 denotes H, alkyl or phenyl; and R 3 denotes H or alkyl. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供具有高灵敏度的辐射敏感性树脂组合物，能够忠实地再现掩模图案的设计尺寸，对基材的粘合性优异，即使使用具有良好的空间形状和厚度也能实现令人满意的空间形状和厚度 曝光≤1,500J/ m 2 ，并且能够形成耐压强度和耐摩擦性优异的显示面板用间隔物。 解决方案：辐射敏感性树脂组合物含有（a1）不饱和羧酸和/或烯键式不饱和羧酸酐的共聚物，（a2）含环氧基的不饱和化合物和（a3）另一种不饱和化合物 ，具有烯键式不饱和键的可聚合化合物和由式（1）或式（2）表示的化合物。 在式（1）和（2）中，R“1”表示烷基或苯基; R 2 表示H，烷基或苯基; R 3表示H或烷基。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003005372A

公开(公告)日：2003-01-08

申请号：JP2001185662

申请日：2001-06-19

Applicant: Jsr Corp ,  ジェイエスアール株式会社

Inventor： SANO KIMIYASU ,  MISHIMA KENJI ,  KAJITA TORU ,  MIYAMATSU TAKASHI

IPC: G03F7/039 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency particularly to ArF excimer laser light and excellent in basic solid state properties as a resist such as sensitivity, resolution and pattern shape.
SOLUTION: The radiation sensitive resin composition contains (A) an acid dissociable group-containing resin which is made alkali-soluble by the action of an acid, such as a copolymer of an unsaturated ether typified by n-butyl vinyl ether or 3,4-dihydro-2H-pyran, maleic anhydride and 2-methyl-2-adamantyl (meth)acrylate and (B) a radiation sensitive acid generator typified by 2,5- hexylene-(1-n-butoxynapht-4-yl) sulfonium nonafluoro-n-butanesulfonate, 4-(2- norbornylmethoxy)naphthyltetrahydrothiophenium nonafluoro-n-butanesulfonate or 2,5-hexylene-(1-hydroxy-2,6-dimethylphen-4-yl)sulfonium nonafluoro-n- butanesulfonate.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供具有高透明度的辐射敏感性树脂组合物，特别是ArF准分子激光，并且具有优异的基本固态特性，作为诸如灵敏度，分辨率和图案形状的抗蚀剂。 解决方案：辐射敏感性树脂组合物含有（A）含酸解离基团的树脂，其通过酸的作用而制成碱溶性，例如以正丁基乙烯基醚为代表的不饱和醚或3,4 - 二氢-2H-吡喃，马来酸酐和（甲基）丙烯酸2-甲基-2-金刚烷酯和（B）以2,5-亚己基 - （1-正丁氧基萘-4-基）锍为代表的辐射敏感酸产生剂 九氟正丁磺酸盐，4-（2-降冰片基甲氧基）萘基四氢噻吩六氟正丁磺酸盐或2,5-亚己基 - （1-羟基-2,6-二甲基苯-4-基）锍九氟正丁基磺酸盐。

公开(公告)号：JP2002229192A

公开(公告)日：2002-08-14

申请号：JP2001027408

申请日：2001-02-02

Applicant: JSR CORP

Inventor： EHATA SATOSHI ,  USUI NOBUSHI ,  ISHII HIROYUKI ,  KATAOKA ATSUKO ,  KAJITA TORU

IPC: G03F7/004 ,  C07D333/16 ,  C08K5/45 ,  C08L101/00 ,  G03F7/038 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive acid generating agent capable of giving positive and negative radiation sensitive resin compositions having high transparency particularly to far UV typified by ArF excimer laser light (193 nm wavelength) and excellent in sensitivity, resolution, pattern shape, etc., and to provide positive and negative radiation sensitive resin compositions containing the radiation sensitive acid generating agent. SOLUTION: The radiation sensitive acid generating agent is typified, e.g. by a compound having a sulfonium cation of formula (1), (2) or (3) and C4F9SO3- as a counter anion. The positive radiation sensitive resin composition contains the radiation sensitive acid generating agent and an acid dissociable group- containing resin. The negative radiation sensitive resin composition contains the radiation sensitive acid generating agent, an alkali-soluble resin and a crosslinker.

公开(公告)号：JP2002182393A

公开(公告)日：2002-06-26

申请号：JP2001303791

申请日：2001-09-28

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, having excellent sensitivity, resolution, dry etching resistance, pattern shape, etc., and having small temperature dependence in heating after exposure. SOLUTION: The radiation sensitive resin composition contains (A) a resin comprising a copolymer of (meth)acrylic esters having an acid dissociable group- containing alicyclic structure represented by 5-t-butoxycarbonylnorbornyl (meth) acrylate and 8-t-butoxycarbonyltetracyclododecane (meth)acrylate and (meth) acrylic esters having a lactone-containing heterocyclic structure typified by compounds of formula (1) and (B) a radiation sensitive acid generating agent represented by 1-(3,5-dimethyl-4-hydroxyphenyl)tetrahydrothiophenium perfluoro-n- octanesulfonate, 1-(4-n-butoxy-1-naphthyl)tetrahydrothiophenium nonafluoro-n- butanesulfonate or the like.

公开(公告)号：JP2002023371A

公开(公告)日：2002-01-23

申请号：JP2000204223

申请日：2000-07-05

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F20/60 ,  C08F32/08 ,  C08K5/00 ,  C08L101/06 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a new radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) a resin having at least one heterocyclic structure of formula (1) (where R1 is H, a 1-6C linear, branched or cyclic alkyl, a 1-6C linear, branched or cyclic alkoxy or a 2-7C linear, branched or cyclic alkoxycarbonyl) in a side chain and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2001330959A

公开(公告)日：2001-11-30

申请号：JP2000151175

申请日：2000-05-23

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F8/12 ,  C08F20/30 ,  C08F32/00 ,  C08K5/00 ,  C08L33/14 ,  C08L45/00 ,  C08L101/08 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive type radiation sensitive resin composition having high transparency to radiation, excellent in resolution, sensitivity, pattern shape, etc., causing no development defect in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The positive type radiation sensitive resin composition contains (A) an alkali-insoluble or slightly alkali-soluble acid dissociable group-containing resin having a structure of formula (1) [where R1 is H, a 1-5C linear or branched alkyl or a 1-5C linear or branched alkoxyl] and/or a structure of formula (2) [where Z is a 4-20C trivalent alicyclic hydrocarbon group or its substituted derivative and X is a single bond or a 1-5C divalent organic group] and convertible to an alkali-soluble resin when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2001228612A

公开(公告)日：2001-08-24

申请号：JP2000037272

申请日：2000-02-15

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  IWAZAWA HARUO ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F2/50 ,  C08F220/02 ,  C08F232/00 ,  C08K5/00 ,  C08K5/12 ,  C08L33/00 ,  C08L45/00 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in sensitivity, resolution, etc. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive and generating agent and (C) an adamantine derivative of formula 1 [where each R1 is H, an optionally substituted 1-20C alkyl or -CH2 COOR2 (R2 is a 1-18C alkyl)].

公开(公告)号：JP2001188347A

公开(公告)日：2001-07-10

申请号：JP2000137757

申请日：2000-05-10

Applicant: JSR CORP

Inventor： ISHII HIROYUKI ,  DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08K5/00 ,  C08L33/14 ,  C08L45/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in shelf stability, having high transparency to radiation and excellent also in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape. SOLUTION: The radiation sensitive resin composition contains (A) an acid- dissociable group-containing resin having repeating units derived from a (meth) acrylic acid derivative having an alicyclic skeleton containing an oxygen- or nitrogen-containing polar group typified by 3-hydroxy-1-adamantyl (meth)acrylate or 3-(8'-cyanotetracyclo[4.4.0.12,5.17,10]dodecyl (meth)acrulate and repeating units derived from another (meth)acrylic acid derivative having an alicyclic skeleton typified by 2-methyl-2-adamantyl (meth)acrylate and convertible to an alkali- soluble resin when the acid-dissociable group is dissociated and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2001147535A

公开(公告)日：2001-05-29

申请号：JP32973999

申请日：1999-11-19

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: H01L21/027 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in dry etching resistance, sensitivity, resolution, etc., as a chemical amplification type resist, capable of avoiding a change of the line width of a resist pattern due to a change of the time elapsed from exposure to post-exposure heating and having superior process stability. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent. The component A is typified by a copolymer of a norbornene derivative typified by 8- hydroxytetracyclo[4.4.0.12,5.17,10]dodec-3-ene, itaconic anhydride and a (meth) acrylic acid derivative typified by a compound of formula 1.

公开(公告)号：JP2001109157A

公开(公告)日：2001-04-20

申请号：JP29129199

申请日：1999-10-13

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: H01L21/027 ,  G03F7/039

Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, causing no development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or hardly alkali-soluble acid-dissociable group-containing resin typified by a resin having repeating units of the below formula 1 and (B) a radiation sensitive acid generating agent. The resin A is made alkali-soluble when the acid-dissociable group is dissociated.