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公开(公告)号:KR1020050032171A
公开(公告)日:2005-04-07
申请号:KR1020030068181
申请日:2003-10-01
Applicant: 삼성전자주식회사
Inventor: 심동식
IPC: B81C1/00
CPC classification number: B81C1/00095 , B81C1/00063 , B81C1/00349 , B81C1/00436 , B81C2201/01
Abstract: An MEMS structure for a metal interconnection and a fabrication method thereof are provided to manufacture an MEMS structure having metal wires completely filled by depositing a seed layer. A seed layer is deposited with respect to the entire surface of the upper part of a substrate(100). A metal film is manufactured by plating a first metal on the entire surface of the upper part of the seed layer(120). A predetermined area of the lower part of the seed layer(120) is etched, thereby manufacturing at least one penetration hole. A second metal is plated in at least one penetration hole, thereby manufacturing a metal wiring for electrically connecting to external elements linked with the lower and upper surface of the substrate(100). The seed layer(120) and the metal film are removed.
Abstract translation: 提供了用于金属互连的MEMS结构及其制造方法,以制造具有通过沉积种子层完全填充金属线的MEMS结构。 相对于基板(100)的上部的整个表面沉积种子层。 通过在种子层(120)的上部的整个表面上电镀第一金属来制造金属膜。 蚀刻种子层(120)的下部的预定区域,从而制造至少一个贯通孔。 第二金属被镀在至少一个穿透孔中,从而制造用于电连接到与基底(100)的下表面和上表面连接的外部元件的金属布线。 种子层(120)和金属膜被去除。
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公开(公告)号:KR1020050017716A
公开(公告)日:2005-02-23
申请号:KR1020030054834
申请日:2003-08-08
Applicant: 동부일렉트로닉스 주식회사
Inventor: 박건욱
IPC: B81C1/00
CPC classification number: B81C1/00095 , B81C1/00063 , B81C1/00349 , B81C1/00436 , B81C2201/01
Abstract: PURPOSE: A method for fabricating a micro-mirror is provided to improve an entire reflection degree of a mirror by filling a pillar shaft hole formed in a surface of the mirror. CONSTITUTION: A structure is formed on a substrate. A micro-mirror(36) is formed at an upper portion of a driving part installed on the substrate. A method for fabricating the micro-mirror(36) includes a step of forming a coupling joint. Polymer is formed on an upper portion of the coupling joint and is patterned. An inner portion of the polymer is filled with a predetermined material. The micro-mirror(36) is formed on the substrate through a photography process and an etch back process. The polymer is removed by using solvent. The micro-mirror(36) is preferably formed by depositing aluminum, titanium, and nitride titanium on the substrate.
Abstract translation: 目的:提供一种制造微镜的方法,通过填充形成在反射镜表面中的柱轴孔来提高反射镜的整体反射度。 构成:在基板上形成结构。 微镜(36)形成在安装在基板上的驱动部件的上部。 一种制造微反射镜(36)的方法包括形成耦合接头的步骤。 聚合物形成在耦合接头的上部并被图案化。 聚合物的内部填充有预定的材料。 微镜(36)通过摄影过程和回蚀工艺在衬底上形成。 通过使用溶剂除去聚合物。 微反射镜(36)优选通过在基板上沉积铝,钛和氮化钛而形成。
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公开(公告)号:KR1020170129402A
公开(公告)日:2017-11-27
申请号:KR1020160060050
申请日:2016-05-17
Applicant: 한국과학기술원
IPC: B81C1/00
CPC classification number: B81C1/00 , B81C1/00015 , B81B2201/02 , B81C1/00349 , B81C1/00388 , B81C1/00436 , B81C2201/01
Abstract: 본발명은멤스디바이스제조방법및 이에의해제조되는멤스디바이스에관한것으로, 보다상세하게는구조물절연막을이용한보이드패턴의형성후, 희생층을증착함으로써, CMOS 호환성있는공정에의해종래와같은하부전극의박리현상이전혀발생되지않으며, 스핀온 절연막(SOD) 또는스핀온 글래스(SOG)를통한스핀증착에따라하부패턴에영향을받지않으면서평탄화가가능하며, 비아홀의형성시, 클리닝(cleaning) 공정을더 수행하여후속증착공정에서의오염을원천적으로방지할수 있는멤스디바이스제조방법및 이에의해제조되는멤스디바이스에관한것이다.
Abstract translation: 本发明涉及一种制造MEMS器件的方法和由此制造的MEMS器件,并且更具体地涉及一种通过使用结构绝缘膜在形成空隙图案之后沉积牺牲层来制造MEMS器件的方法, 根据通过旋涂绝缘膜(SOD)或旋涂玻璃(SOG)的旋转沉积,可以在不受下层图案影响的情况下进行平坦碳化,在形成通孔时, 本发明涉及一种制造MEMS器件的方法和由此制造的MEMS器件。
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公开(公告)号:KR1020170066446A
公开(公告)日:2017-06-14
申请号:KR1020177010632
申请日:2015-09-28
Applicant: 쓰리엠 이노베이티브 프로퍼티즈 캄파니
CPC classification number: B81C1/00396 , A61B5/14532 , A61B5/150022 , A61B5/150274 , A61B5/150358 , A61B2562/0295 , A61B2562/125 , B01J2219/00382 , B41C1/003 , B41M1/12 , B41M1/26 , B81C1/00 , B81C1/00206 , B81C1/00388 , B81C2201/01 , H01L21/4867 , H05K1/0393 , H05K3/061 , H05K2203/0108 , H05K2203/1545 , B41K1/00
Abstract: 마스터공구는그의주 표면상에잉크패턴이마련된다. 잉크패턴은스크린인쇄공정에의해형성된다. 스탬프-제조재료를마스터공구의주 표면에적용하여, 마스터공구의잉크패턴에대해네거티브인스탬핑패턴을갖는스탬프를형성한다. 스탬핑패턴에잉크조성물을잉크칠하고금속화된표면과접촉시켜, 스탬핑패턴에따라기재의금속화된표면상에인쇄패턴을형성한다. 인쇄패턴을에칭마스크로서사용하여, 금속화된표면을에칭하여, 기재상에전기전도성트레이스들을형성한다.
Abstract translation: 主工具在其主表面上提供有墨水图案。 油墨图案通过丝网印刷工艺形成。 将印章制作材料施加到母版工具的母版表面上以形成具有用于母版工具的印刷图案的负冲压图案的印章。 油墨组合物在冲压图案上着墨并且与金属化表面接触,以根据冲压图案在基板的金属化表面上形成印刷图案。 使用印刷图案作为蚀刻掩模,蚀刻金属化表面以在衬底上形成导电迹线。
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公开(公告)号:KR1020120131788A
公开(公告)日:2012-12-05
申请号:KR1020110050200
申请日:2011-05-26
Applicant: 삼성전기주식회사
CPC classification number: B81C1/00158 , B81B3/0062 , B81B3/007 , B81B2201/0235 , B81B2203/053 , B81C1/00484 , B81C1/00531 , B81C1/00539 , B81C1/00571 , B81C2201/01 , B81C2201/0132 , B81C2201/0133 , B81C2201/014 , C09K13/00 , C09K13/08 , G01C19/56 , G01P15/0802 , G01P15/0922 , G01P15/18 , G01P2015/084 , G01P2015/0871
Abstract: PURPOSE: An inertia sensor and manufacturing method thereof are provided to promote sensitivity by reducing a spring constant of a membrane. CONSTITUTION: An inertia sensor(100) includes a membrane(110) of a plate, an adhesion unit(123), a mass(120), and a first adhesive layer(130). The adhesive unit is arranged at a center lower unit(113) of the membrane. The mass is arranged outside the adhesion unit and is passed through an upper and lower direction. The mass includes a patterning unit(125). The first adhesive layer is formed between the membrane and the adhesion unit.
Abstract translation: 目的:提供惯性传感器及其制造方法,以通过降低膜的弹簧常数来提高灵敏度。 构成:惯性传感器(100)包括板的膜(110),粘附单元(123),质量块(120)和第一粘合剂层(130)。 粘合单元布置在膜的中心下部单元(113)处。 该质量体布置在粘合单元的外部并通过上下方向。 质量包括图案形成单元(125)。 第一粘合剂层形成在膜和粘附单元之间。
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