Abstract:
AN INFRARED PHOTOEMITTER AND PROCESS FOR FABRICATING SAME WHEREIN A THIN METAL LAYER IS SANDWICHED IN A COMPOSITE STRUCTURE BETWEEN A SUITABLE PHOTOABSORTIVE SEMICONDUCTIVE LAYER AND A LOW WORK FUNCTION INSULATING LAYER. THE SEMICONDUCTIVE LAYER SERVES AS A PHOTON ABSORBER AND PHOTOELECTION SOURCE FOR THE DEVICE. THE INSULATING LAYER IS CHOSEN FOR ITS LOW WORK FUNCTION. THE METAL INTERLAYER ELIMATES THE HETERJUNCTION WHICH IN ITS ABSENCE WOULD EXIST BETWEEN THE SEMICONDUCTIVE AND INSULATING LAYERS AND THEREBY ELIMINATES THE RESTRICTION THAT SUCH HETEROJUNCTIONS IMPOSE ON THE EFFICIENCY AND WAVELENGTH RESPONSE OF PRIOR ART COMPOSITION PHOTOEMITTERS.
Abstract:
A solid state radiation sensitive field emitter cathode comprising a single crystal semiconductor member having a body portion with a uniform array of closely spaced and very sharp electron emitting projections from one surface in the form of needles or whisker like members. Electrons are emitted into vacuum when a planar-parallel positive anode is mounted in close proximity to the surface. The cathode is responsive to input radiation such as electrons or light directed onto the cathode in modifying the electron emission from the array of electron emitter projections. The method of manufacturing the cathode by providing a predetermined pattern or mosaic of islands of a material exhibiting a greater etch resistant property than the semiconductor material, on a wafer of a semiconductor material and then etching out between and beneath the islands to undercut to a point where the islands are supported by only a small whisker of the semiconductor material. Removal of the islands results in an electron emitter being exposed from beneath each island wherein carriers generated within the body portion and also carriers generated within the depletion regions of the tips diffuse to the electron emitter projections wherein establishment of a high electric field at the tips of the electron emitter projections results in electron emission primarily due to conduction band tunneling. The device provides about 106 emitting points of close proximity so as to effect photographic-like imaging.
Abstract:
A junction-type photoemitter is disclosed. The photoemitter includes a heavily doped P-type semiconductive substrate for absorbing photons of radiation to be converted into electrons to be emitted. An alkali metal layer such as cesium metal is formed over the substrate member for filling the surface energy states of the P-semiconductive substrate. Finally, a layer of cesium oxide is formed over the alkali metal layer to provide a low-work function surface facing the vacuum into which the electrons are emitted from the photoemitter. The substrate member may be made of a III-V compound semiconductor or an alloy of two different III-V compound semiconductors (each compound semiconductor including one element from the third group of Periodic Table and another element of the fifth group of the Periodic Table) to provide a semiconductive band-gap energy which is equal to or slightly more than the work function of the cesium oxide layer. The P-type semiconductive substrate member is heavily doped with a concentration of acceptor dopant greater than 3 X 1018 acceptors per cubic centimeter. Likewise, the cesium oxide layer is heavily doped with donor atoms of cesium to provide the relatively low-work function characteristic of such material. In a preferred embodiment, the P-semiconductive substrate is formed of InP or an alloy of InP and InAs. The photoemitter has improved conversion efficiency in the wavelength range from 0.5 microns to 1.37 microns wavelength.
Abstract in simplified Chinese:一种光电阴极利用一体地形成于一硅基板上之一场发射极数组(FEA)来增强光电子发射,且利用直接安置于该FEA之输出表面上之一薄硼层来阻止氧化。该等场发射极系借由具有安置成一个二维周期性图案之各种形状(例如,角锥体或经修圆晶须)之突出部形成,且可经组态以在一反向偏压模式中操作。一选用闸极层经提供以控制发射电流。一选用第二硼层形成于经照射(顶部)表面上,且一选用抗反射材料层形成于该第二硼层上。在相对之该经照射表面与该输出表面之间产生一选用外部电位。借由一特殊掺杂方案且借由施加一外部电位而形成n型硅场发射极与p-i-n光电二极管膜之一选用组合。该光电阴极形成传感器及检验系统之一部分。
Abstract:
An electron beam source includes a cathode (200) having an electron emission surface including an active area (208) for emission of electrons and a cathode shield assembly (220) including a conductive shield disposed in proximity to the electron emission surface of the cathode. The shield has an opening (222) aligned with the active area. The electron beam source further includes a device for stimulating emission of electrons from the active area of the cathode (200), electron optics for forming the electrons into an electron beam and a vacuum enclosure for maintaining the cathode at high vacuum. The cathode (200) may be a negative electron affinity photocathode formed on a light-transmissive substrate (202). The shield protects non-emitting areas of the emission surface from contamination and inhibits cathode materials from contaminating components of the electron beam source. The cathode (200) may be moved relative to the opening (222) in the shield so as to align a new active area with the opening. Getter materials and sources of activation material may be incorporated into the shield assembly.
Abstract:
A night vision device (10) includes an image intensifier tube (14) which includes a photocathode (22) responsive both to white light and to infrared light to release photoelectrons. The photocathode (22) is particularly sensitive to infrared light at the 980 nm wavelength, and has desirable spectral response characteristics.
Abstract:
A semiconductor device (10) for emitting, upon receiving a light energy, a highly spin-polarized electron beam, including a first compound semiconductor layer (14) formed of gallium arsenide phosphide, GaAs 1-x P x , and having a first lattice constant; a second compound semiconductor layer (16) grown with gallium arsenide, GaAs, on the first compound semiconductor layer, and having a second lattice constant different from the first lattice constant; and a fraction, x, of the gallium arsenide phosphide GaAs 1-x P x and a thickness, t, of the second compound semiconductor layer defining a magnitude of mismatch between the first and second lattice constants, such that the magnitude of mismatch provides a residual strain, ε R , of not less than 2.0 x 10⁻³ in the second layer. The fraction x of the gallium arsenide phosphide GaAs 1-x P x and the thickness t of the second compound semiconductor layer may define the magnitude of mismatch between the first and second lattice constants, such that the magnitude of mismatch provides an energy splitting between a heavy and a light hole band in the second layer so that the energy splitting is greater than a thermal noise energy in the second layer.