公开(公告)号：WO2017111917A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067184

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： NAIR, Vijay K. ,  OSTER, Sasha N. ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  EID, Feras

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

Abstract translation: 本发明的实施例包括一种波导结构，其包括下部件，至少一个连接到下部件的侧壁件和上部件。 下部构件，至少一个侧壁构件和上部构件包括至少一个导电层，以在基底中形成空腔，以允许耦合或附接到基底的装置之间的通信。

公开(公告)号：WO2007078867A2

公开(公告)日：2007-07-12

申请号：PCT/US2006047844

申请日：2006-12-15

Applicant: INTEL CORP ,  HORINE BRYCE D ,  BRIST GARY A ,  HALL STEPHEN H

Inventor： HORINE BRYCE D ,  BRIST GARY A ,  HALL STEPHEN H

IPC: H05K1/02 ,  H01P11/00

CPC classification number: H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981 ,  Y10T156/1002

Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。

公开(公告)号：WO02037910A1

公开(公告)日：2002-05-10

申请号：PCT/SE2001/002025

申请日：2001-09-20

IPC: H01P3/12 ,  H01P11/00 ,  H05K1/02 ,  H05K3/46 ,  H01P3/00

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/0237 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09809

Abstract: The invention relates to a microwaveguide that is integrated in the dielectric layer of a conductor carrier, e.g. a printed circuit board. The waveguide enables differeht types of active and/or passive functions intened to influence the signals sent through the waveguide to be integrated at appropriate positions in the waveguide.

Abstract translation: 本发明涉及一种集成在导体载体的介电层中的微波导体，例如， 印刷电路板。 波导使得不同类型的有源和/或无源功能能够影响通过波导发送的信号，以集成在波导中的适当位置。

公开(公告)号：WO00024080A1

公开(公告)日：2000-04-27

申请号：PCT/US1999/024116

申请日：1999-10-15

IPC: B32B7/02 ,  H01P1/18 ,  H01P3/00 ,  H01P3/02 ,  H01P3/06 ,  H01P3/08 ,  H01P3/12 ,  H01P3/16 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antenna, microstrip lines, coplanar lines, and waveguides.

Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置中。

公开(公告)号：US11929189B2

公开(公告)日：2024-03-12

申请号：US16954886

申请日：2019-06-19

Applicant: Yunan Han

Inventor： Yunan Han ,  Xueying Han

IPC: H01B11/10 ,  H05K1/02 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/46

CPC classification number: H01B11/10 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4673 ,  H05K2201/037 ,  H05K2201/10356

Abstract: The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.

公开(公告)号：US11757166B2

公开(公告)日：2023-09-12

申请号：US17155949

申请日：2021-01-22

Applicant: Aptiv Technologies Limited

Inventor： Biswadeep Das Gupta ,  Sara J. Cavazos ,  Kurt E. Gilbertson

IPC: H01P5/107 ,  H01Q1/22 ,  H05K1/18 ,  H01Q1/32

CPC classification number: H01P5/107 ,  H01Q1/2283 ,  H01Q1/3233 ,  H05K1/181 ,  H05K2201/037 ,  H05K2201/09985 ,  H05K2201/10098

Abstract: Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).

公开(公告)号：US20190254168A1

公开(公告)日：2019-08-15

申请号：US16397594

申请日：2019-04-29

Applicant: TT Electronics PLC

Inventor： Brent Hans Larson ,  Shivesh Langhanoja

IPC: H05K1/18 ,  G01L19/00 ,  H05K3/32 ,  H05K1/11 ,  H05K1/09 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K1/185 ,  G01L13/025 ,  G01L19/0007 ,  G01L19/0076 ,  G01L19/148 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K3/28 ,  H05K3/32 ,  H05K7/02 ,  H05K2201/037 ,  H05K2201/10 ,  H05K2201/10151 ,  H05K2203/1327 ,  H05K2203/308

Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.

公开(公告)号：US20180310399A1

公开(公告)日：2018-10-25

申请号：US15771833

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID

IPC: H05K1/02 ,  H01P3/12 ,  H01P5/107 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

公开(公告)号：US09402322B1

公开(公告)日：2016-07-26

申请号：US14638686

申请日：2015-03-04

Applicant: David G. Findley

Inventor： David G. Findley

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/0306 ,  B28B1/001 ,  B29C64/165 ,  B32B18/00 ,  B33Y10/00 ,  C04B35/522 ,  C04B35/524 ,  C04B35/532 ,  C04B35/5626 ,  C04B35/565 ,  C04B35/571 ,  C04B35/583 ,  C04B35/62645 ,  C04B35/65 ,  C04B35/806 ,  C04B2235/3826 ,  C04B2235/404 ,  C04B2235/427 ,  C04B2235/48 ,  C04B2235/483 ,  C04B2235/5288 ,  C04B2235/5292 ,  C04B2235/5454 ,  C04B2235/6026 ,  C04B2235/80 ,  C04B2235/94 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/68 ,  G02B6/12002 ,  G02B6/132 ,  G02B6/32 ,  G02B6/4204 ,  G02B2006/12035 ,  G02B2006/12135 ,  G02B2006/1219 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/162 ,  H05K2201/0323 ,  H05K2201/037 ,  H05K2201/064

Abstract: According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

Abstract translation: 根据一些实施例，一种装置包括由多晶金刚石制成的电路板。 电路板由预陶瓷聚合物的层的热分解形成。 在电路板内形成多个管，并且在电路板的一个或多个表面上包括多个终端。 每个管包括可操作以允许每个管传导电流的石墨烯层。 每层石墨烯通过多晶金刚石电路板在大于或等于900摄氏度的温度下进行热解来形成。 该装置还包括形成在电路板内的多个光波导。 每个光波导包括由多晶金刚石包围的多晶碳化硅芯。 多晶金刚石通过聚（氢化碳炔）的热分解形成，并且碳化硅通过聚（甲基甲硅烷基）的热分解形成。

公开(公告)号：US08669834B2

公开(公告)日：2014-03-11

申请号：US12922588

申请日：2009-03-17

Applicant: Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

Inventor： Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

IPC: H01P3/16 ,  H01P11/00 ,  H01Q13/22

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/092 ,  H05K2203/1572 ,  Y10T29/49016

Abstract: A substrate integrated waveguide (10) comprises a top conductive layer (14) and a bottom conductive layer (15) provided on either sides a substrate (11). At least one wall (12, 13) of conductive material is provided in the substrate (11) to define, together with the top and bottom layers (14, 15), the waveguide. The at least one wall (12, 13) comprise a multitude of thin conductive wires densely arranged close to each other in the substrate (11) and having respective short ends connected to the top and bottom layers (14, 15). The high number of wires per surface unit in the wall (12, 13) effectively prevent significant amount of power leakage through the wall (12, 13) during operation of the substrate integrated waveguide (10).

Abstract translation: 衬底集成波导（10）包括设置在衬底（11）的两侧的顶部导电层（14）和底部导电层（15）。 导电材料的至少一个壁（12,13）设置在衬底（11）中以与顶层和底层（14,15）一起限定波导。 所述至少一个壁（12,13）包括在所述基板（11）中彼此靠近彼此密集布置并且具有连接到所述顶层和底层（14,15）的相应短端的多根细导线。 在基板集成波导（10）的操作期间，每个表面单元在壁（12,13）中的大量电线有效地防止了通过壁（12,13）的大量的电力泄漏。