公开(公告)号：WO2007122281A1

公开(公告)日：2007-11-01

申请号：PCT/ES2007/070084

申请日：2007-04-26

Applicant: CONSEJO SUPERIOR DE INVESTIGACIONES CIENTÍFICAS ,  UNIVERSIDAD DE OVIEDO ,  JORDA SANUY, Xavier ,  GÁLVEZ SÁNCHEZ, Jose Luís ,  VELLVEHI HERNÁNDEZ, Miquel ,  GODIGNON, Philippe ,  JOSE PRIETO, Miguel Angel ,  MARTÍN RAMOS, Juan Antonio

Inventor： JORDA SANUY, Xavier ,  GÁLVEZ SÁNCHEZ, Jose Luís ,  VELLVEHI HERNÁNDEZ, Miquel ,  GODIGNON, Philippe ,  JOSE PRIETO, Miguel Angel ,  MARTÍN RAMOS, Juan Antonio

IPC: H02M1/096

CPC classification number: H02M1/096 ,  H01L25/162 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/045 ,  H01L2924/00

Abstract: La presente invención constituye un método de fabricación de un interruptor modular e inteligente, bidireccional en corriente y tensión eléctrica con aplicación principal en las fuentes de potencia. Las características más destacables de este nuevo dispositivo es que integra las distintas etapas de potencia, control y protección de los circuitos para garantizar la bidireccionalidad en tensión y en corriente, junto con los circuitos y algoritmos de control necesarios para una conmutación segura y robusta. Su modularidad también permite al usuario una combinación de electos para constituir circuitos complejos y de amplias aplicaciones prácticas como los convertidores matriciales de potencia, así como una fácil sustitución en caso de reparación.

Abstract translation: 本发明是一种用于制造模块化智能开关的方法，其在电流和电压方面是双向的，主要应用于电源。 这种新型器件最值得注意的特点是它集成了电路的各种功率，控制和保护级，以保证电压和电流方面的双向性，以及安全鲁棒切换所需的电路和控制算法 。 其模块化特性还为用户提供了组合复杂电路与各种实际应用（如矩阵功率转换器）的选择，并且在修复的情况下也可轻松更换。

公开(公告)号：WO2006105521A3

公开(公告)日：2007-04-05

申请号：PCT/US2006012586

申请日：2006-03-31

Applicant: INTEL CORP ,  CAMPINI EDOARDO ,  SAFFARIAN ANDY ,  KHOURY MARWAN

Inventor： CAMPINI EDOARDO ,  SAFFARIAN ANDY ,  KHOURY MARWAN

IPC: H05K7/14 ,  H05K3/36

CPC classification number: G06F1/186 ,  G06F1/184 ,  G06F1/185 ,  H01R12/52 ,  H05K1/141 ,  H05K1/144 ,  H05K3/323 ,  H05K3/325 ,  H05K7/1429 ,  H05K2201/0314 ,  H05K2201/045

Abstract: A method according to one embodiment may include providing a circuit board having a connector footprint including a plurality of electrical contacts and providing a mezzanine card including a first plurality of conductive traces on a first side of the mezzanine card. The method of this embodiment may also include providing a first wiring board disposed between at least a portion of the circuit board and at least a portion of the mezzanine card. The first wiring board may electrically couple at least a portion of the electrical contacts of the connector footprint to at least a portion of the conductive traces of the mezzanine card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 根据一个实施例的方法可以包括提供具有包括多个电触点的连接器封头的电路板，并且提供夹层卡，该夹层卡在夹层卡的第一侧上包括第一多个导电迹线。 该实施例的方法还可以包括提供设置在电路板的至少一部分与夹层卡的至少一部分之间的第一布线板。 第一布线板可以将连接器覆盖区的电触点的至少一部分电耦合到夹层卡的导电迹线的至少一部分。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：WO2006099562A3

公开(公告)日：2006-12-14

申请号：PCT/US2006009619

申请日：2006-03-10

Applicant: INTEL CORP ,  STAHL DOUGLAS ,  FORMISANO DAVID ,  SAFFARIAN ANDY ,  KHOURY MARWAN

Inventor： STAHL DOUGLAS ,  FORMISANO DAVID ,  SAFFARIAN ANDY ,  KHOURY MARWAN

IPC: G06F13/40 ,  H05K1/14

CPC classification number: H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045

Abstract: An Advanced Mezzainine Card An Advanced Mezzanine Card (AMC) adapter may be used to connect a non-AMC mezzanine cared to an AMC carrier. The AMC adapter may include a card edge connector configured to be connected to an AMC connector on the AMC carrier and one or more mezzanine connectors configured to be connected to the non-MC mezzanine card. The AMC adapter may also include a bridge to convert between communication protocols used by the non-AMC mezzanine card and the AMC carrier. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

Abstract translation: 高级Mezzainine卡高级夹层卡（AMC）适配器可用于将非AMC夹层连接到AMC运营商。 AMC适配器可以包括被配置为连接到AMC载体上的AMC连接器并且被配置为连接到非MC夹层卡的一个或多个夹层连接器的卡缘连接器。 AMC适配器还可以包括用于在非AMC夹层卡和AMC载波之间使用的通信协议之间进行转换的桥接器。 当然，在不脱离本实施例的情况下，可以进行许多替换，变化和修改。

公开(公告)号：EP3007343A1

公开(公告)日：2016-04-13

申请号：EP15186377.6

申请日：2015-09-23

Applicant: International Rectifier Corporation

Inventor： Cho, Eung San ,  Ribarich, Thomas J. ,  Fernando, Dean ,  Park, Dae Keun ,  Cheah, Chuan ,  Moody, Kevin

IPC: H02M3/145 ,  H05K1/14 ,  H01L23/48

CPC classification number: H05K7/1092 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/40245 ,  H01L2224/41113 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/13091 ,  H01L2924/181 ,  H01R12/7076 ,  H02M3/145 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/045 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/37099

Abstract: In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board.

Abstract translation: 在一个实施方式中，用于插入母板的功率单元包括位于基板上的功率模块。 基板位于导电板条上，每个导电板条具有远离电源模块的延伸端。 每个导电板条提供动力单元的安装接触。 每个安装触头通过在衬底中的电路径电耦合到功率模块。 安装触头被配置为在电源模块和母板之间提供电连接。

公开(公告)号：EP2559327A1

公开(公告)日：2013-02-20

申请号：EP11730863.5

申请日：2011-04-11

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Johannes ,  LEITGEB, Markus

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: - providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), - arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and - connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract translation: 一种用于INTEGRA廷方法的部件到印刷电路板，包括以下步骤：提供两个完成印刷电路板元件，其更特别地由相互连接的板层或层中的多个，worin至少一个印刷电路板元件具有切口或凹陷 ，安排部件到印刷电路板元件中的一个或在所述至少一个印刷电路板元件的切口被集成，以及连接与所述部件的印刷电路板元件被容纳在该切口中，作为结果 有可能在一个印刷电路板，以获得组件或传感器的安全和可靠的住宿。 进一步，提供了一种这种类型的，其包括集成在其中的电子元件的的印刷电路板。

公开(公告)号：EP1582990A1

公开(公告)日：2005-10-05

申请号：EP05102431.3

申请日：2005-03-25

Applicant: EUROTECH SpA

Inventor： Rossi, Mauro ,  Tecchiolli, Gianpietro

IPC: G06F13/40 ,  G06F1/18

CPC classification number: G06F13/409 ,  G06F1/185 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: Connection system to connect a plurality of communication channels (31) to an electronic apparatus such as a personal computer, a PC-cluster or suchlike, and expansion card (10) to manage the communication channels (31) on the electronic apparatus. The electronic apparatus has a chassis (15). The system consists of a first printed circuit (18a), which supports first connectors (13a) for managing a first pair of communication channels (31) on the electronic apparatus and connection members (17b) for assembling at least a second printed circuit (18b). The second printed circuit (18b) supports in turn second connectors (13b) for managing a second pair of communication channels (31) on the electronic apparatus. The first (18a) and the second (18b) printed circuit develop at least partly outside the chassis (15).

公开(公告)号：EP0855090A1

公开(公告)日：1998-07-29

申请号：EP97922877.0

申请日：1997-04-26

Applicant: ROBERT BOSCH GMBH

Inventor： NAPIERALA, Dieter

IPC: H01L23 ,  H01L25 ,  H05K1 ,  H05K3

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/73 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/045 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A multichip module with a substrate which is equipped on its component side with an IC component and other electronic components interconnected by electroconducting lines. Electric leadthroughs extend from the component side to the bottom side of the substrate and are connected to solder contacts arranged on the bottom side of the substrate to electrically connect the multichip module to a subassembly support. In order to reduce the density of printed circuits on the top side of the multichip module and to reduce the number of required substrate layers, a support is arranged between each IC component and the substrate and comprises printed circuits and components connected by means of first connecting surfaces to the corresponding IC component and by means of second connecting surfaces to connections on the substrate.

公开(公告)号：EP0642166B1

公开(公告)日：1997-12-10

申请号：EP94113641.8

申请日：1994-08-31

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kalivas, Vassilios ,  Nitsch, Alois ,  Peters, Heinz

IPC: H01L25/16 ,  H05K1/18

CPC classification number: H01L25/165 ,  H01L23/24 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0317 ,  H05K2201/045 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

公开(公告)号：EP0446367A1

公开(公告)日：1991-09-18

申请号：EP90913886.9

申请日：1990-09-21

Applicant: FANUC LTD.

Inventor： IMAZEKI, Ryoji ,  KURAKAKE, Mitsuo ,  YONEKURA, Mikio, c/o FANUC Mansion Harimomi 7-303

IPC: G05B11/01

CPC classification number: H05K7/1467 ,  G05B15/02 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10189

Abstract: A control device such as a numerical controller constituted of a plurality of printed boards on which are mounted various circuit components. Input/output interface connectors (9) are mounted on the printed board (1) in a manner that the lengthwise directions thereof are oriented in the vertical direction relative to the mounting surface of the printed board. Module boards (10) are mounted in the vertical direction relative to the mounting surface of the printed board (1). The module boards (10) have a height nearly equal to the height of the interface connectors (9). This makes it possible to increase the number of circuit components that can be mounted in a unit space, and to decrease the outer size of the whole control device.

Abstract translation: 输入/输出接口连接器（9）以相对于印刷电路板的安装表面沿垂直方向定向的方式安装在印刷电路板（1）上。 模块板（10）相对于印刷板（1）的安装表面沿垂直方向安装。 模块板（10）的高度几乎等于接口连接器的高度。 @（24pp Dwg.No.1 / 6）@。

公开(公告)号：EP0031240A2

公开(公告)日：1981-07-01

申请号：EP80304552.5

申请日：1980-12-17

Applicant: FUJITSU LIMITED

Inventor： Honda, Norio

IPC: H01L23/52 ,  H01L25/10

CPC classification number: H05K1/141 ,  H01L23/49805 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0306 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electrical component substantially consists of an assembly of ceramic chip carriers 12 and a mother board 11 wherein the mother board 11 is in effect partitioned into a plurality of portions or sub-sections, and the chip carriers 12 are mounted on the mother board 11 either directly or through unit boards 14, 15 on predetermined portions or sub-sections of the mother board 11. In this assembly, each unit board 14, 15 is fabricated in the same conventional manner as the mother board 11, and several chip carriers 12 may be mounted on one kind of unit board 14, which in turn may be mounted on another unit board 15 of larger size together with other chip carriers 12. One or more than one chip carrier 12 may be mounted directly on the mother board 11, on a unit board 14 of smaller size, or on a unit board 15 of larger size. External conductors may be fabricated on surfaces of these unit boards 14,15 and the mother board 11, and these conductors may be plated using conventional technique.

Abstract translation: 电气部件基本上由陶瓷芯片载体12和母板11组成，其中母板11实际上分成多个部分或子部分，芯片载体12安装在母板11上 直接或通过单元板14,15在母板11的预定部分或子部分上。在该组件中，每个单元板14,15以与母板11相同的常规方式制造，并且几个芯片载体12可以 安装在一种单元板14上，单元板14又可以与其他芯片载体12一起安装在较大尺寸的另一个单元板15上。一个或多于一个的芯片载体12可以直接安装在母板11上， 较小尺寸的单元板14或更大尺寸的单元板15。 可以在这些单元板14,15和母板11的表面上制造外部导体，并且这些导体可以使用常规技术进行电镀。