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    METHOD AND SYSTEM FOR PROVIDING AN INTEGRAL RADIO FREQUENCY SHIELD IN A MOLDED ARRAY PACKAGE
    68.
    发明申请
    METHOD AND SYSTEM FOR PROVIDING AN INTEGRAL RADIO FREQUENCY SHIELD IN A MOLDED ARRAY PACKAGE 审中-公开
    用于在模制阵列包中提供整体无线电频率屏蔽的方法和系统

    公开(公告)号：WO2007076022A3

    公开(公告)日：2008-08-21

    申请号：PCT/US2006049046

    申请日：2006-12-21

    Applicant: ATMEL CORP ,  LAM KEN

    Inventor： LAM KEN

    IPC: H05K9/00

    CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09354 ,  H01L2924/00

    Abstract: A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature, and a protective layer. The electronics package is physically coupled to at least one additional electronics package through at least the substrate. The method and system include exposing a portion of the ground contact feature(s) by removing a portion of the electronics package above the ground contact feature(s). The exposing step forms at least one trench above the ground contact feature(s). The method and system also include depositing an electromagnetic radiation shield that substantially covers the electronics package, fills the trench(es), and is electrically connected to the ground contact feature(s).

    Abstract translation: 公开了一种用于制造电子封装的电磁辐射屏蔽的方法和系统。 电子封装包括衬底，至少一个接地接触特征和保护层。 所述电子封装通过至少所述衬底与至少一个额外的电子封装物理耦合。 该方法和系统包括通过移除地面接触特征之上的电子组件的一部分来暴露接地接触特征的一部分。 曝光步骤在地面接触特征之上形成至少一个沟槽。 该方法和系统还包括沉积基本上覆盖电子封装的电磁辐射屏蔽物，填充沟槽，并且电连接到接地触点特征。

    CIRCUIT BOARD HAVING CONFIGURABLE GROUND LINK AND WITH COPLANAR CIRCUIT AND GROUND TRACES
    69.
    发明申请
    CIRCUIT BOARD HAVING CONFIGURABLE GROUND LINK AND WITH COPLANAR CIRCUIT AND GROUND TRACES 审中-公开
    具有可配置地线的电路板和共线电路和地线

    公开(公告)号：WO2008021217A1

    公开(公告)日：2008-02-21

    申请号：PCT/US2007/017763

    申请日：2007-08-10

    Applicant: TYCO ELECTRONICS CORPORATION ,  BARTHOLOMEW, Victor, L.

    Inventor： BARTHOLOMEW, Victor, L.

    IPC: H05K1/02

    CPC classification number: H05K1/0219 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/062 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/10356 ,  H05K2203/173 ,  Y10S439/943 ,  Y10T29/49155

    Abstract: A transition circuit board (100) for transitioning a cable to a connector is provided. A circuit board has an outer surface (104) with a circuit trace (106), ground plane (120) and ground link (118) provided thereon. A cable pad (114) and a contact pad (116) are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating (168) is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.

    Abstract translation: 提供了一种用于将电缆转换到连接器的过渡电路板（100）。 电路板具有带有电路迹线（106），设置在其上的接地平面（120）和接地连接（118）的外表面（104）。 在电路迹线的相对端设有电缆垫（114）和接触垫（116）。 接地链路与接地平面电气相同，并且位于与电路迹线相邻并由电路迹线隔开的空间。 绝缘涂层（168）设置在电路板的至少一部分，接地平面和电路板的外表面上。 绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。 在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

    DOUBLE ADHERENT ELECTRICALLY CONDUCTIVE TAPE
    70.
    发明申请
    DOUBLE ADHERENT ELECTRICALLY CONDUCTIVE TAPE 审中-公开
    双电源电导磁带

    公开(公告)号：WO99063627A1

    公开(公告)日：1999-12-09

    申请号：PCT/SE1999/000885

    申请日：1999-05-25

    IPC: H01B5/04 ,  H01R4/04 ,  H05K3/36 ,  H05K3/40 ,  H05K3/32

    CPC classification number: H05K3/361 ,  H01B5/04 ,  H01R4/04 ,  H05K3/403 ,  H05K2201/09354

    Abstract: Double adherent, electrically conductive tape comprising an elastic and flexible tape (1) being adherent on both sides, and an electrically conductive material applied along at least one edge of the tape. The electrically conductive material is in the shape of at least one continuous strip (2) folded in the longitudinal direction of the tape about an edge of the tape.

    Abstract translation: 双重贴附的导电胶带，包括在两侧粘附的弹性和柔性胶带（1），以及沿胶带的至少一个边缘施加的导电材料。 导电材料是至少一条连续条带（2）的形状，沿带的纵向方向围绕带的边缘折叠。

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