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    MULTI-LAYER AND USER-CONFIGURABLE MICRO-PRINTED CIRCUIT BOARD
    61.
    发明公开
    MULTI-LAYER AND USER-CONFIGURABLE MICRO-PRINTED CIRCUIT BOARD 有权
    多层次，用户可配置微印刷电路板

    公开(公告)号：EP1342252A2

    公开(公告)日：2003-09-10

    申请号：EP01985040.3

    申请日：2001-12-06

    Applicant: PULSE ENGINEERING, INC.

    Inventor： DADAFSHAR, Majid

    IPC: H01F27/28

    CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F27/2804 ,  H05K1/029 ,  H05K1/141 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10196 ,  H05K2201/10303 ,  H05K2203/171

    Abstract: A multi-layer micro-printed circuit board (PCB) is disclosed, which defines a magnetic component (500), such as a transformer, using planar technology. Instead of using the traditional twelve-layer PCB incorporating both a primary and a secondary winding, this invention stacks multiple PCBs (525, 530, 535), each having four or six layers and each including a single winding (either the primary or the secondary). The PCBs are stacked in an offset arrangement such that the pins (501-504A) penetrating the PCB or PCBs including the primary winding or windings do not penetrate the PCB or PCBs including the secondary winding or windings. Additionally, this offset arrangement prevents the pins penetrating the secondary PCBs from penetrating the primary PCBs in the same manner. This offset configuration thereby avoids significant flashover problems associated with current planar components. Moreover, the invention describes an arrangement whereby a jumper or other connection can be used to connect the windings in a series or in a parallel configuration allowing the user to configure the component according to user-required parameters.

    Dual voltage card connector
    62.
    发明公开
    Dual voltage card connector 失效
    双电压卡连接器

    公开(公告)号：EP0889415A3

    公开(公告)日：2001-09-05

    申请号：EP98304834.9

    申请日：1998-06-19

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Egan, Patrick Kevin ,  Smid, Jan Douglas

    IPC: G06F13/40

    CPC classification number: G06F13/4068 ,  H01R12/7005 ,  H01R12/721 ,  H01R29/00 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/117 ,  H05K2201/10196

    Abstract: A multiple supply voltage peripheral component interconnect (PCI) connector 50 is disclosed which replaces connectors that are keyed for a specific signaling voltage. A single connector receives all current types of PCI keyed card edge connectors and supplies the correct signaling voltage thereto. The type of PCI card is identified and the appropriate signaling voltage is switched to the signaling power input (Vio) using industry standard conditions at selected pin locations rather than using unique keying of cards and connectors to assure a match between the signaling voltage required by the card and the signaling voltage supplied at the connector. Detection and control circuitry 57 senses the presence of grounded or open conditions at selected pin locations indicative of the type card present in the connector and switches the signaling power supply to the correct voltage source. Also, the connector may be buffered to enable connection to a single logical PCI bus 55 irrespective of the signaling voltage supplied to the card 58. Further, the buffered connectors can be replicated to enable numerous cards, with any mix of signaling voltages, to be attached to the single logical bus.

    HIGH POWER VARIABLE SLIDE RF TUNER
    65.
    发明公开
    HIGH POWER VARIABLE SLIDE RF TUNER 有权
    可变RF调谐器，用于高功率应用

    公开(公告)号：EP1579465A2

    公开(公告)日：2005-09-28

    申请号：EP03715920.9

    申请日：2003-01-08

    Applicant: RAYTHEON COMPANY

    Inventor： OBERT, Thomas, L. ,  BROWN, Kenneth, W. ,  DRAKE, Thomas, A.

    IPC: H01G5/00

    CPC classification number: H01G5/0138 ,  H05K1/0272 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/10196

    Abstract: A high power slide tuning capacitor (200) integrated into a circuit board adapted to function at RF and microwave frequencies. The capacitor (200) is comprised of a dielectric substrate (26) with a cavity (28) cut into a side of the substrate (26); a ground plane (24) mounted on a bottom surface of the dielectric substrate (26); a microstrip patch (22) mounted on a top surface of the dielectric substrate (26) and positioned above the cavity (28); and a movable dielectric stub (30) which engages the cavity (28) such that a variable length of the stub (30) is positioned beneath the microstrip patch (22). The microstrip patch (22) can be coupled to a desired circuit trace (20), effectively forming a shunt capacitor to ground.

    Platine mit mehreren integrierten Schaltungen
    69.
    发明公开
    Platine mit mehreren integrierten Schaltungen 失效

    公开(公告)号：EP0730275A2

    公开(公告)日：1996-09-04

    申请号：EP96103201.8

    申请日：1996-03-01

    Applicant: SIEMENS AKTIENGESELLSCHAFT

    Inventor： non der Ropp, Thomas, Dr. Dipl.-Phys.

    IPC: G11C5/00 ,  G11C5/14

    CPC classification number: H05K1/0262 ,  G11C5/147 ,  H05K1/18 ,  H05K2201/10174 ,  H05K2201/10196 ,  H05K2201/10689

    Abstract: Platine mit mehreren integrierten Schaltungen 2, die mit einem zuführbaren ersten Versorgungspotential V1 arbeiten. Die Platine 1 weist eine Potential-Anpassungsanordnung 3 auf, deren Ausgangspotential das erste Versorgungspotential V1 ist und deren Eingangspotential ein der Platine 1 zuführbares zweites Versorgungspotential V2 ist. Die Potential-Anpassungsanordnung kann beispielsweise eine Diode oder ein Spannungsregler sein.

    Abstract translation: 集成电路（2）的工作电压（VI）低于其所安装的电路板（1）的外部电源的电压（V2）; 例如 新一代CMOS电路只需要3.3V而不是5V。为了满足要求，电源电压适配器（3）以调节器的形式提供，其产生适当的电压降并且还抑制输出电压的波动。 具有正向导通电压降的简单二极管可能产生必要的电压差。

    Apparatus for modifying an electrical signal
    70.
    发明公开
    Apparatus for modifying an electrical signal 失效
    GerätzurVeränderungeines elektrischen信号。

    公开(公告)号：EP0641046A1

    公开(公告)日：1995-03-01

    申请号：EP94305276.1

    申请日：1994-07-19

    Applicant: ADVANCED MICRO DEVICES INC.

    Inventor： Duley, Raymond S.

    IPC: H01R31/06 ,  H01R29/00

    CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H01R12/7076 ,  H01R29/00 ,  H01R31/06 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/0286 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2924/00

    Abstract: The present invention provides an apparatus for altering an electrical signal between a first device and a second device. The apparatus includes a support structure or interconnection member having at least two surfaces with a plurality of contacts on each surface. The contacts are arranged in a predesignated pattern to mate with the conductors of each of the devices. In a typical application, the apparatus will be used to connect a microprocessor powered by approximately 3.3V to a printed circuit board of a system using a power supply of approximately 5.0V.

    Abstract translation: 本发明提供一种用于改变第一设备和第二设备之间的电信号的设备。 该装置包括支撑结构或互连构件，其具有在每个表面上具有多个触点的至少两个表面。 触点以预先指定的图案布置，以与每个设备的导体相配合。 在典型的应用中，该装置将用于将使用大约3.3V的电源的微处理器连接到使用大约5.0V的电源的系统的印刷电路板。

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