公开(公告)号：US20150195914A1

公开(公告)日：2015-07-09

申请号：US14147225

申请日：2014-01-03

Applicant: International Business Machines Corporation

Inventor： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/0231 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/09645 ,  H05K2201/10015 ,  H05K2201/10507 ,  Y02P70/611 ,  Y10T29/49135

Abstract: Various embodiments include integrated circuit structures having an off-axis in-hole capacitor. In some embodiments, an integrated circuit (IC) structure includes: a substrate layer having an upper surface; an IC chip at least partially contained within the substrate layer and aligned with a minor axis perpendicular to the upper surface of the substrate layer; an aperture in the substrate layer, the aperture physically separated from the IC chip; and a capacitor in the aperture and at least partially contained within the substrate layer, the capacitor being physically isolated from the IC chip, wherein the capacitor is aligned with an axis perpendicular to the upper surface of the substrate layer and offset from the minor axis of the IC chip.

Abstract translation: 各种实施例包括具有离轴孔内电容器的集成电路结构。 在一些实施例中，集成电路（IC）结构包括：具有上表面的基底层; 至少部分地包含在所述衬底层内并与垂直于所述衬底层的上表面的短轴对准的IC芯片; 所述基板层中的孔，所述孔与所述IC芯片物理分离; 以及孔中的电容器，并且至少部分地包含在所述衬底层内，所述电容器与所述IC芯片物理隔离，其中所述电容器与垂直于所述衬底层的上表面的轴线对准，并且偏离所述衬底层的短轴 IC芯片。

公开(公告)号：US20140355220A1

公开(公告)日：2014-12-04

申请号：US14464006

申请日：2014-08-20

Applicant: Ambianti B.V.

Inventor： Georgios Metaxas

IPC: H05K1/02

CPC classification number: H05K1/0292 ,  G06F3/1446 ,  G09G3/20 ,  G09G3/2085 ,  G09G3/2088 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2330/08 ,  G09G2340/0492 ,  G09G2360/141 ,  G09G2370/18 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/09972 ,  H05K2201/10507

Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.

Abstract translation: 一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器， 驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧 与第一侧相对的第二侧。 驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

公开(公告)号：US20130122658A1

公开(公告)日：2013-05-16

申请号：US13296707

申请日：2011-11-15

Applicant: Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H01L21/56

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 提供了一种方法和装置，其中空腔形成在支撑结构中，支撑结构可操作以支撑半导体器件，将电路元件的至少一部分设置在支撑结构中的空腔中，将空腔填充在 支撑结构，其具有不导电的填充材料，以至少部分地围绕电路元件与非导电填充材料，并将半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。

公开(公告)号：US20120314380A1

公开(公告)日：2012-12-13

申请号：US13464903

申请日：2012-05-04

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/18

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

公开(公告)号：US20230269864A1

公开(公告)日：2023-08-24

申请号：US18310639

申请日：2023-05-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji TAKEMATSU ,  Takanori UEJIMA ,  Dai NAKAGAWA

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K2201/10507 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.

公开(公告)号：US20180231821A1

公开(公告)日：2018-08-16

申请号：US15750837

申请日：2016-11-08

Applicant: OMRON Corporation

Inventor： Wakahiro KAWAI ,  Takafumi BESSHO

IPC: G02F1/1345 ,  H05K1/18 ,  H05K3/32 ,  H05K1/09 ,  H05K3/12

CPC classification number: G02F1/13452 ,  H01L21/565 ,  H01L23/552 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15323 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/092 ,  H05K1/181 ,  H05K1/185 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10371 ,  H05K2201/10507 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1469

Abstract: Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

公开(公告)号：US20170339779A1

公开(公告)日：2017-11-23

申请号：US15158399

申请日：2016-05-18

Applicant: Raytheon Company

Inventor： Brian W. Johansen ,  Justin Kasemodel ,  James M. Elliott

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/0204 ,  H01L23/4275 ,  H01L23/4338 ,  H05K1/181 ,  H05K3/34 ,  H05K2201/10227 ,  H05K2201/10507

Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

公开(公告)号：US20170256874A1

公开(公告)日：2017-09-07

申请号：US15059475

申请日：2016-03-03

Applicant: International Business Machines Corporation

Inventor： Francois Abel ,  Andreas Doering ,  Ronald P. Luijten ,  Mauro Spreafico ,  Beat Weiss

IPC: H01R12/73 ,  G06F13/42 ,  H05K1/02

CPC classification number: H01R12/737 ,  G06F13/42 ,  H05K1/0231 ,  H05K1/0296 ,  H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10507

Abstract: An electronic circuit card comprises a printed circuit board (PCB) with electronic components thereon. The electronic components comprise drivers for transmitting TX signals and receivers for receiving RX signals, according to several groups of interface signals. There is further provided a connector edge, arranged at an edge of the card, and configured to allow the card to be connected to an external connector. This connector edge comprises two subsets of symmetric pins on respective (opposite) sides thereof. The drivers and the receivers are connected to the pins, for respectively conveying the TX signals and the RX signals. Pins are assigned such that, for each of the several groups of supported interface signals, any pin (of any of the subsets) connected to transmit TX signals is located opposite a pin (of the other subset) connected to receive RX signals. Pairs of consecutive pins (on each side) typically come in differential pairs.

公开(公告)号：US09491885B2

公开(公告)日：2016-11-08

申请号：US14502717

申请日：2014-09-30

Applicant: Seagate Technology LLC

Inventor： Shawn Noland ,  Daniel Milligan

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K7/1489 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10507

Abstract: An apparatus as associated method contemplating a housing and a midplane supported by the housing having a midplane connector. A printed circuit board (PCB) having a PCB connector is selectively connectable to the midplane connector. A plurality of data storage devices are arranged on the printed circuit board in a staggered pattern, each electrically connected to the PCB connector via a respective electrical trace in the PCB.

Abstract translation: 一种设备作为相关方法，考虑由具有中平面连接器的壳体支撑的壳体和中平面。 具有PCB连接器的印刷电路板（PCB）可选择性地连接到中面板连接器。 多个数据存储装置以交错图案布置在印刷电路板上，每个电路板经由PCB中的相应电迹线与PCB连接器电连接。

公开(公告)号：US09129908B2

公开(公告)日：2015-09-08

申请号：US13296707

申请日：2011-11-15

Applicant: Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

Inventor： Jovica Savic ,  Zhiping Yang ,  Jie Xue ,  Li Li

IPC: H01L21/00 ,  H01L23/31 ,  H01L23/24

CPC classification number: H05K1/183 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/095 ,  H05K2201/10492 ,  H05K2201/10507 ,  H01L2924/00

Abstract: A method and apparatus are provided in which a cavity is formed in a support structure, the support structure being operable to support a semiconductor device, disposing at least a portion of a circuit element in the cavity in the support structure, filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material, and electrically connecting the semiconductor device to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.

Abstract translation: 提供了一种方法和装置，其中空腔形成在支撑结构中，支撑结构可操作以支撑半导体器件，将电路元件的至少一部分设置在支撑结构中的空腔中，将空腔填充在 支撑结构，其具有不导电的填充材料，以至少部分地围绕电路元件与非导电填充材料，并将半导体器件电连接到电路元件。 在示例性实施例中，电路元件可操作以基本上阻挡由半导体器件或另一半导体器件输出的直流电流。