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    ELECTRICAL CONNECTOR.
    62.
    发明公开
    ELECTRICAL CONNECTOR. 失效
    电连接器。

    公开(公告)号：EP0670760A4

    公开(公告)日：1997-04-09

    申请号：EP93918432

    申请日：1993-07-21

    Applicant: BERG TECH INC

    Inventor： LWEE NAI HOCK ,  KIN LOKE WING ,  SUAT NG BEE

    IPC: B23K3/08 ,  B23K31/02 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34

    CPC classification number: H01R12/52 ,  B23K3/08 ,  B23K2201/40 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1147 ,  H05K2203/304

    Abstract: The present invention provides a vertical card connector (12) capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The vertical card connector includes an insulating housing (14) with a plurality of contact terminals (26) and a heat-resisting insulating resin film (28) covering the bottom surface (14b) of the housing. Each contact terminal has a solder tail (26b) extending through film. A slight gap (30a) is created between the heat-resisting film (28) and the bottom surface of the housing. The solder tail of the contact is inserted into a corresponding plated through hole (1a) and soldered there. The film (28) prevents a melted solder from flowing past the solder tail toward a contact beam of the contact at a time of soldering. A gas evolved from the solder escapes through the gap between the circuit board and the bottom of the housing.

    Method for the construction and application of a circuit-board interface for electrical connection in control and monitoring apparatuses having plate-type or similar connection terminals and associated apparatus having a circuit-board interface for electrical connection
    63.
    发明公开
    Method for the construction and application of a circuit-board interface for electrical connection in control and monitoring apparatuses having plate-type or similar connection terminals and associated apparatus having a circuit-board interface for electrical connection 失效
    一种用于制备和使用的电路板接口，用于在控制的电连接的监视装置与板状或类似的连接端子和相关的装置与该电路板接口的过程。

    公开(公告)号：EP0382300A2

    公开(公告)日：1990-08-16

    申请号：EP90200244.3

    申请日：1990-02-02

    Applicant: CROUZET S.p.A.

    Inventor： Thepault, Claude

    IPC: H05K3/34 ,  H05K1/02

    CPC classification number: H05K3/3447 ,  H05K1/0201 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0209 ,  H05K2201/10575 ,  H05K2203/081 ,  H05K2203/111 ,  H05K2203/304 ,  Y10T29/49142 ,  Y10T29/49149

    Abstract: Method for the construction and application of a plate interface for the electrical interconnection in control and monitoring devices with terminal outlets of the plate type or the like, comprising the phases of:
    - making a rigid printed circuit (1) having apertures disposed according to the layout of the output terminals of the control device;
    - application by screen-printing of a soldering paste onto the locations of the printed circuit corresponding to the terminals to be brought into electrical contact;
    - preheating of the terminals only of the control device; - assembling of the electrical interconnection plate on the control device with the interposition of a further plate (7) for the thermal pro­tection of the control device itself;
    - melting of the soldering paste according to a thermal cycle comprising a preheating phase, a melting phase and a succeeding slow cooling phase; and associated programming and monitoring device having output terminals for connectors of the plate-type or the like, electrically interconnected and functionally arranged by means of an interface having a rigid plate electrically connected to said terminals by welding, intended especially for use in washing machines, drying machines and the like.

    Abstract translation: 用于板式接口，用于控制所述电互连的结构和应用方法和监测与板型等的终端网点装置，其包括以下阶段： - 制备刚性印刷电路（1），其具有孔径弃置雅丁到 控制装置的输出端子的布局; - 通过焊接膏到对应于端子上的印刷电路的位置的丝网印刷应用被带入电接触; - 终端唯一的控制装置的的预热; - 与用于控制设备本身的热保护此外板（7）的插入所述控制装置上的电互连板的组装; - 焊膏gemäß热循环包括一个预热阶段，熔化阶段和随后的缓慢冷却相的熔化; 和相关联的编程和监视具有输出端子装置为板型或特别是用于洗衣机的使用等，电互连并且通过具有刚性的板电连接到所述端子通过焊接的界面的方式功能性地布置，拟爱连接器， 烘干机等。

    LED MODULE AND LIGHTING ASSEMBLY
    64.
    发明申请
    LED MODULE AND LIGHTING ASSEMBLY 审中-公开
    LED模块和照明组件

    公开(公告)号：WO2012128458A3

    公开(公告)日：2012-10-18

    申请号：PCT/KR2012000381

    申请日：2012-01-17

    Applicant: LEE CHUNG HOON

    Inventor： LEE CHUNG HOON

    IPC: F21S2/00 ,  F21V15/06 ,  F21V29/00 ,  F21Y101/02

    CPC classification number: H01L33/64 ,  F21K9/278 ,  F21V23/005 ,  F21V29/15 ,  F21V29/74 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/10106 ,  H05K2201/10575 ,  H01L2924/00

    Abstract: Disclosed are a light emitting diode (LED) module and a lighting assembly. The lighting assembly comprises a light emitting device, a driver integrated circuit device for driving the light emitting device, a heat sink for dissipating heat generated from the light emitting device, and a heat shielding portion for blocking thermal interference between the driver integrated circuit device and the light emitting device. In the LED module, the driver integrated circuit device is disposed on the heat shielding portion. Accordingly, it is possible to block thermal interference between the light emitting device and the driver integrated circuit device and to decrease the size of the lighting assembly.

    Abstract translation: 公开了一种发光二极管（LED）模块和照明组件。 照明组件包括发光器件，用于驱动发光器件的驱动器集成电路器件，用于散发从发光器件产生的热的散热器，以及用于阻挡驱动器集成电路器件与驱动器集成电路器件之间的热干扰的热屏蔽部分 发光装置。 在LED模块中，驱动器集成电路器件设置在热屏蔽部分上。 因此，可以阻止发光器件和驱动器集成电路器件之间的热干扰并且减小照明组件的尺寸。

    ELECTRICAL CONNECTOR
    67.
    发明申请
    ELECTRICAL CONNECTOR 审中-公开
    电气连接器

    公开(公告)号：WO1994012311A1

    公开(公告)日：1994-06-09

    申请号：PCT/US1993007064

    申请日：1993-07-21

    Applicant: BERG TECHNOLOGY, INC. ,  LWEE, Nai, Hock ,  KIN, Loke, Wing ,  SUAT, Ng, Bee

    Inventor： BERG TECHNOLOGY, INC.

    IPC: B23K31/02

    CPC classification number: H01R12/52 ,  B23K3/08 ,  B23K2101/40 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1147 ,  H05K2203/304

    Abstract: The present invention provides a vertical card connector (12) capable of preventing an undesirable flow of melted solder which destroys proper contacts and of removing a corrosion-causing acid gas. The vertical card connector includes an insulating housing (14) with a plurality of contact terminals (26) and a heat-resisting insulating resin film (28) covering the bottom surface (14b) of the housing. Each contact terminal has a solder tail (26b) extending through film. A slight gap (30a) is created between the heat-resisting film (28) and the bottom surface of the housing. The solder tail of the contact is inserted into a corresponding plated through hole (1a) and soldered there. The film (28) prevents a melted solder from flowing past the solder tail toward a contact beam of the contact at a time of soldering. A gas evolved from the solder escapes through the gap between the circuit board and the bottom of the housing.

    Abstract translation: 本发明提供一种垂直卡连接器（12），其能够防止熔化的焊料的不期望的流动破坏适当的接触和去除腐蚀性的酸性气体。 垂直卡连接器包括具有覆盖壳体的底表面（14b）的多个接触端子（26）和耐热绝缘树脂膜（28）的绝缘壳体（14）。 每个接触端子具有延伸穿过膜的焊尾（26b）。 在耐热膜（28）和壳体的底表面之间产生轻微的间隙（30a）。 将触点的焊尾插入对应的电镀通孔（1a）中并在其上焊接。 在焊接时，膜（28）防止熔化的焊料流过焊料尾部朝向触点的接触梁流动。 从焊料逸出的气体通过电路板和壳体底部之间的间隙逸出。

    Underfill film having thermally conductive sheet
    69.
    发明授权
    Underfill film having thermally conductive sheet 失效
    具有导热片的底部填充膜

    公开(公告)号：US08269339B2

    公开(公告)日：2012-09-18

    申请号：US13041007

    申请日：2011-03-04

    Applicant: Keiji Matsumoto

    Inventor： Keiji Matsumoto

    IPC: H01L23/10 ,  H01L23/34

    CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

    Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

    Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。

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