公开(公告)号：WO2016207764A1

公开(公告)日：2016-12-29

申请号：PCT/IB2016/053590

申请日：2016-06-16

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) ,  SIMPSON, Reginald ,  NEHRING, Ronald ,  ROUABHI, Mokhtar

Inventor： SIMPSON, Reginald ,  NEHRING, Ronald ,  ROUABHI, Mokhtar

IPC: H05K3/32 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0203 ,  H01L23/66 ,  H01L2223/6644 ,  H03F1/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H05K1/0243 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10969

Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

Abstract translation: 公开了功率放大器组件和组件。 根据一些实施例，提供一种功率放大器组件（10），其包括功率放大器（12），功率放大器（12）具有带栅极接触表面的栅极引线（14），具有漏极接触表面的漏极引线（13） 具有长度和宽度的表面（15）。 延伸的热塞（11）安装在源接触表面上以将表面散热（18）并延伸源的电路。 延长的热塞具有至少一个长度大于源接触表面的长度。

公开(公告)号：WO2016013362A1

公开(公告)日：2016-01-28

申请号：PCT/JP2015/069019

申请日：2015-07-01

Applicant: 株式会社オートネットワーク技術研究所 ,  住友電装株式会社 ,  住友電気工業株式会社

Inventor： 中村　有延

IPC: H05K1/18 ,  H02G3/16

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: 電子部品の端子の曲げ加工等が不要である回路構成体を提供すること。 実装される電子部品３０は、その本体部３１が基板１０に形成された第一開口１１の少なくとも一部を覆うように基板１０の一方の面１０ａ上に配置された状態で、当該第一開口１１を通じて導電部材２０に接続され、第一種端子３２が基板１０の導電パターン（ランド１４）に接続され、第二種端子３３が基板１０に形成された第二開口１３を通じて導電部材２０に接続されている回路構成体１とする。

Abstract translation: 为了提供电子元件端子不需要弯曲等的电路结构。电路结构1具有：安装的电子部件30，其通过形成在基板10中的第一开口11连接到导电部件20，所述第一开口11形成在基板10中， 电子部件以其主体部31布置在基板10的表面10a上以覆盖第一开口11的至少一部分的状态连接; 连接到导电图案（平台14）的第一类型端子32; 以及通过形成在基板10中的第二开口13连接到导电部件20的第二类型端子33。

公开(公告)号：WO2015055470A1

公开(公告)日：2015-04-23

申请号：PCT/EP2014/071476

申请日：2014-10-07

Applicant: CONTINENTAL TEVES AG & CO. OHG ,  CONTI TEMIC MICROELECTRONIC GMBH

Inventor： DALKE, Lars ,  GILB, Jürgen ,  WECKERLE, Michael

IPC: H05K3/32

CPC classification number: H05K3/328 ,  H05K1/11 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10295 ,  H05K2201/10628 ,  H05K2201/10962

Abstract: Die Erfindung betrifft ein elektronisches Steuergerät, insbesondere eines Kraftfahrzeugbremssystems, umfassend zumindest einen Schaltungsträger (5) für elektronische Bauelemente, wobei wenigstens ein elektronisches Bauelement (1) zumindest einen elektrischen Leiter (2) aufweist und welches sich weiterhin dadurch auszeichnet, dass der elektrische Leiter (2) des elektronischen Bauelements (1) mit zumindest einem Kontaktelement (3) mechanisch sowie elektrisch leitend verbunden ist und das Kontaktelement (3) mechanisch und elektrisch leitend mit wenigstens einer Kontaktstelle (4) des Schaltungsträgers (5) verbunden ist, wobei zumindest die mechanische und elektrisch leitende Verbindung des elektrischen Leiters (2) mit dem Kontaktelement (3) eine mittels Ultraschallschweißens erzeugte Verbindung ist. Zudem beschreibt die Erfindung ein Verfahren zur Anordnung und elektrischen Anbindung wenigstens eines elektronischen Bauelements auf einem Schaltungsträger eines elektronischen Steuergeräts.

Abstract translation: 本发明涉及一种电子控制单元，特别是机动车辆的制动系统，包括用于电子部件的至少一个电路载体（5），其中至少一个电子元件（1）具有至少一个电导体（2）和其特征在于，进一步的电导体（ 2）将电子部件（1）与至少一个接触元件（3）是机械地和导电地连接和接触元件（3）是机械地和导电地连接到至少（电路载体（5）的接触点4），其中，至少所述机械 和电导体（2）与所述接触元件（3）的导电连接是通过超声波焊接所产生的化合物。 此外，本发明描述了一种用于装配和电子控制单元的电路基板上的至少一个电子部件的电连接的方法。

公开(公告)号：WO2008071576A2

公开(公告)日：2008-06-19

申请号：PCT/EP2007063165

申请日：2007-12-03

Applicant: CONTINENTAL AUTOMOTIVE GMBH ,  BAUR FRANK ,  BERNHARDT ANDREAS ,  BREY ROLAND ,  GOETTE CARSTEN ,  GOETZENBERGER MARTIN ,  REKOFSKY ANDREAS ,  SCHINGALE ANGELIKA

Inventor： BAUR FRANK ,  BERNHARDT ANDREAS ,  BREY ROLAND ,  GOETTE CARSTEN ,  GOETZENBERGER MARTIN ,  REKOFSKY ANDREAS ,  SCHINGALE ANGELIKA

IPC: H05K3/30 ,  H05K3/36

CPC classification number: H05K1/111 ,  H01L23/10 ,  H01L24/27 ,  H01L24/28 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/81894 ,  H01L2224/83141 ,  H01L2224/83205 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/83894 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85895 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01075 ,  H01L2924/07811 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/325 ,  H05K3/36 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2201/209 ,  H05K2203/0307 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A problem addressed by the present invention is that of connecting at least two components (10) together mechanically and/or electrically. According to the invention, this problem is solved in a circuit arrangement with at least two components (10), each having a contact surface (12), by the fact that at least one of the contact surfaces (12) is roughened and the components (10) are connected galvanically and/or mechanically using a press connection of the contact surfaces (12). An advantage of the invention consists of the fact that for creating the connection it is not mandatory for an auxiliary agent (e. g., solder, adhesive, screws, rivets, etc.) to be required. The invention is particularly suited to an automated fixing function and, if applicable, also to a sealing function. Advantageously, soldering processes of known type, e.g., can be replaced or improved. In addition, the invention can be used to advantage in the construction and thermal attachment of heat sinks.

Abstract translation: 本发明的目的是机械地和/或电气地互连至少两个部件（10）。 根据本发明，该目的的电路装置实现了具有至少两种组分（10）由所述接触面的挤压连接具有接触表面（12），在接触表面中的至少一个（12）实现粗糙化和部件（10）（12 ）电连接和/或机械连接。 本发明的优点在于，对于需要助剂（例如焊料，粘合剂，螺钉，铆钉等）的化合物的产生来说不是绝对必要的。 本发明特别适用于自动化固定以及可能还用于密封功能。 有利地，因为。 B.已知类型的焊接工艺被替换或改进。 此外，本发明可以有利地用于散热器的设计和热连接。

公开(公告)号：WO2007061996A2

公开(公告)日：2007-05-31

申请号：PCT/US2006/044989

申请日：2006-11-20

Applicant: BAKER HUGHES INCORPORATED ,  BELL, Samuel, R.

Inventor： BELL, Samuel, R.

IPC: H01L21/00

CPC classification number: H05K3/321 ,  H05K2201/10628 ,  H05K2201/10734

Abstract: A device and method employing an electrically conductive adhesive for electrically and mechanically connecting an electrical component to a board substrate. The electrical component can include an integrated circuit and the board may include a printed circuit board. The possible adhesives include a silver conducting RTV, silver- conducting adhesive, as well as silver conducting epoxy.

Abstract translation: 一种使用导电粘合剂将电气部件电连接和机械地连接到基板的装置和方法。 电气部件可以包括集成电路，并且电路板可以包括印刷电路板。 可能的粘合剂包括银导电RTV，银导电粘合剂以及银导电环氧树脂。

公开(公告)号：WO2006098879A1

公开(公告)日：2006-09-21

申请号：PCT/US2006/007283

申请日：2006-03-01

Applicant: RCD TECHNOLOGY INC. ,  OBERLE, Robert, R.

Inventor： OBERLE, Robert, R.

IPC: H01L23/495 ,  G08B13/14

CPC classification number: H01L23/3164 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/86 ,  H01L2924/0102 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/10628 ,  H05K2203/1311 ,  Y02P80/30 ,  H01L2924/00

Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract translation: 构造RFID单元的方法可以包括使用保护层来将导电粘合剂尚未完全设定的状态下将集成电路芯片模块保持在具有天线单元的基板层上。

公开(公告)号：US20240006403A1

公开(公告)日：2024-01-04

申请号：US18036904

申请日：2021-12-03

Applicant: Molex, LLC

Inventor： Victor Zaderej ,  Richard Fitzpatrick ,  Alan Han ,  Lily Yeung ,  Ronald C. Hodge ,  Gary Thomas O'Connor

IPC: H01L25/00 ,  H01L21/48 ,  H01L23/495 ,  H01L25/07 ,  H05K1/18 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L25/50 ,  H01L21/4842 ,  H01L23/49575 ,  H01L25/072 ,  H01L21/4846 ,  H01L23/49562 ,  H05K1/181 ,  H01L23/49861 ,  H05K3/32 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10522 ,  H05K2201/10818 ,  H05K2201/10378 ,  H05K2201/10628

Abstract: A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.

公开(公告)号：US09974182B2

公开(公告)日：2018-05-15

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09705320B1

公开(公告)日：2017-07-11

申请号：US14041510

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick

IPC: H02J3/14 ,  H02J1/00 ,  H02H3/087

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A low power voltage control circuit for use in space missions includes a switching device coupled between an input voltage and an output voltage. The switching device includes a control input coupled to an enable signal, wherein the control input is configured to selectively turn the output voltage on or off based at least in part on the enable signal. A current monitoring circuit is coupled to the output voltage and configured to produce a trip signal, wherein the trip signal is active when a load current flowing through the switching device is determined to exceed a predetermined threshold and is inactive otherwise. The power voltage control circuit is constructed of space qualified components.

公开(公告)号：US20160183369A1

公开(公告)日：2016-06-23

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。